Abstract:
Nanowire-based devices are provided. In one aspect, a field-effect transistor (FET) inverter is provided. The FET inverter includes a plurality of device layers oriented vertically in a stack, each device layer having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, wherein the source and drain regions of one or more of the device layers are doped with an n-type dopant and the source and drain regions of one or more other of the device layers are doped with a p-type dopant; a gate common to each of the device layers surrounding the nanowire channels; a first contact to the source regions of the one or more device layers doped with an n-type dopant; a second contact to the source regions of the one or more device layers doped with a p-type dopant; and a third contact common to the drain regions of each of the device layers. Techniques for fabricating a FET inverter are also provided.
Abstract:
Aspects of a method and system for mitigating risk of electrostatic discharge in a system on chip are provided. In this regard, for an IC comprising a plurality of portions electrically isolated from one another within the IC, ESD current may be routed via one or more paths within and/or on a package to which the IC is bonded. The one or more paths may electrically couple two or more of the portions of the IC. The one or more paths may have low impedance at DC and high impedance at one or more frequencies utilized in the integrated circuit. One of the portions of the IC may be a ground plane for RF circuitry. One of the portions of the IC may be a ground plane for digital circuitry. The one or more paths may be fabricated in one or more metal layers of said package.
Abstract:
A folding tool includes two support plates, a ratchet driver pivotally mounted between the two support plates, a rotation seat rotatably mounted between the two support plates, and a plurality of tips each removably mounted on the rotation seat and each detachably mounted on the ratchet driver. The ratchet driver drives each of the tips to rotate in the operation direction only and idles in the opposite direction so that each of the tips can rotate the screw member in the operation direction successively so as to screw or unscrew the screw member easily and quickly. Thus, when the folding tool is used in a smaller space, each of the tips is driven by the ratchet driver to rotate the screw member in the operation direction successively and to screw or unscrew the screw member easily and quickly.
Abstract:
A method of fabricating a semiconductor integrated circuit including a power diode includes providing a semiconductor substrate of first conductivity type, fabricating a integrated circuit such as a CMOS transistor circuit in a first region of the substrate, and fabricating a power diode in a second region in the semiconductor substrate. Dielectric material is formed between the first region and the second regions thereby providing electrical isolation between the integrated circuit in the first region and the power diode in the second region. The power diode can comprise a plurality of MOS source/drain elements and associated gate elements all connected together by one electrode of the diode, and a semiconductor layer in the second region can function as another source/drain of the power diode.
Abstract:
A method of fabricating a semiconductor integrated circuit including a power diode includes providing a semiconductor substrate of first conductivity type, fabricating a integrated circuit such as a CMOS transistor circuit in a first region of the substrate, and fabricating a power diode in a second region in the semiconductor substrate. Dielectric material is formed between the first region and the second regions thereby providing electrical isolation between the integrated circuit in the first region and the power diode in the second region. The power diode can comprise a plurality of MOS source/drain elements and associated gate elements all connected together by one electrode of the diode, and a semiconductor layer in the second region can function as another source/drain of the power diode.
Abstract:
A semiconductor structure is provided that includes a plurality of vertically stacked and vertically spaced apart semiconductor nanowires (e.g., a semiconductor nanowire mesh) located on a surface of a substrate. One end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a source region and another end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a drain region. A gate region including a gate dielectric and a gate conductor abuts the plurality of vertically stacked and vertically spaced apart semiconductor nanowires, and the source regions and the drain regions are self-aligned with the gate region.
Abstract:
Nanowire-based devices are provided. In one aspect, a SRAM cell includes at least one pair of pass gates and at least one pair of inverters formed adjacent to one another on a wafer. Each pass gate includes one or more device layers each having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region and a gate common to each of the pass gate device layers surrounding the nanowire channels. Each inverter includes a plurality of device layers each having a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region and a gate common to each of the inverter device layers surrounding the nanowire channels.
Abstract:
Aspects of a method and system for mitigating risk of electrostatic discharge in a system on chip are provided. In this regard, for an IC comprising a plurality of portions electrically isolated from one another within the IC, ESD current may be routed via one or more paths within and/or on a package to which the IC is bonded. The one or more paths may electrically couple two or more of the portions of the IC. The one or more paths may have low impedance at DC and high impedance at one or more frequencies utilized in the integrated circuit. One of the portions of the IC may be a ground plane for RF circuitry. One of the portions of the IC may be a ground plane for digital circuitry. The one or more paths may be fabricated in one or more metal layers of said package.
Abstract:
An optical signal measurement system provides a tunable optical filter. An unknown optical signal is scanned through the tunable optical filter. The wavelength and chromatic dispersion values of the unknown optical signal scanned through the tunable optical filter are measured by operating the tunable optical filter in a scanning mode for at least one of OSA and PMD measurements, and in a stepping mode for CD measurements. The wavelength and the dispersion values in the unknown optical signal are specified.
Abstract:
A packing box with cardboard walls includes a pallet base, four wall assemblies, a top cover, a plurality of fasteners and five cardboard pieces. A horizontally extending female edge is provided on each of the four sides of the pallet base. The right and left sides of each wall assembly are provided with a male edge and a female edge to allow two neighboring wall assemblies to engage with each other. The upper and lower sides of each wall assembly are provided with a male edge, and the male edge on the lower side of each wall assembly may rest on and engage with the corresponding female edge of the pallet base. Each side of the top cover has a downwards extending wall edge and a horizontally extending top cover edge so that the top cover may rest on the four wall assemblies via the four top cover edges and the male edges and that the four wall edges may engage with the inner members of the four male edges of the wall assemblies. The cross section of the fasteners has a “” shape, and a fastening groove is provided on each of the fasteners. A threaded hole extends through one arm of the fastener and a bolt may be fitted into the hole. A convex tip is provided on the front tip of the bolt and two protrusions are provided on the other arm of the fastener. Last, the five cardboard pieces are fitted onto the four wall assemblies and the top cover.