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公开(公告)号：US07893492B2
公开(公告)日：2011-02-22
申请号：US12371943
申请日：2009-02-17
IPC分类号： H01L21/02
CPC分类号： H01L29/0665 , B82Y10/00 , B82Y40/00 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/66545 , H01L29/66772 , H01L29/66795 , H01L29/775 , H01L29/785 , H01L29/78696 , Y10S977/72 , Y10S977/742 , Y10S977/762 , Y10S977/938
摘要： A semiconductor structure is provided that includes a plurality of vertically stacked and vertically spaced apart semiconductor nanowires (e.g., a semiconductor nanowire mesh) located on a surface of a substrate. One end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a source region and another end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a drain region. A gate region including a gate dielectric and a gate conductor abuts the plurality of vertically stacked and vertically spaced apart semiconductor nanowires, and the source regions and the drain regions are self-aligned with the gate region.
摘要翻译： 提供一种半导体结构，其包括位于衬底表面上的多个垂直堆叠且垂直间隔开的半导体纳米线（例如，半导体纳米线网）。 每个垂直堆叠和垂直间隔开的半导体纳米线的一个端段连接到源极区域，并且每个垂直堆叠和垂直间隔开的半导体纳米线的另一个端部段连接到漏极区域。 包括栅极电介质和栅极导体的栅极区域邻接多个垂直堆叠和垂直间隔的半导体纳米线，并且源极区域和漏极区域与栅极区域自对准。
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公开(公告)号：US20100297816A1
公开(公告)日：2010-11-25
申请号：US12848582
申请日：2010-08-02
IPC分类号： H01L21/336
CPC分类号： H01L29/0665 , B82Y10/00 , B82Y40/00 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/66545 , H01L29/66772 , H01L29/66795 , H01L29/775 , H01L29/785 , H01L29/78696 , Y10S977/72 , Y10S977/742 , Y10S977/762 , Y10S977/938
摘要： A semiconductor structure is provided that includes a plurality of vertically stacked and vertically spaced apart semiconductor nanowires (e.g., a semiconductor nanowire mesh) located on a surface of a substrate. One end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a source region and another end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a drain region. A gate region including a gate dielectric and a gate conductor abuts the plurality of vertically stacked and vertically spaced apart semiconductor nanowires, and the source regions and the drain regions are self-aligned with the gate region.
摘要翻译： 提供一种半导体结构，其包括位于衬底表面上的多个垂直堆叠且垂直间隔开的半导体纳米线（例如，半导体纳米线网）。 每个垂直堆叠和垂直间隔开的半导体纳米线的一个端段连接到源极区域，并且每个垂直堆叠和垂直间隔开的半导体纳米线的另一个端部段连接到漏极区域。 包括栅极电介质和栅极导体的栅极区域邻接多个垂直堆叠和垂直间隔的半导体纳米线，并且源极区域和漏极区域与栅极区域自对准。
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公开(公告)号：US07892945B2
公开(公告)日：2011-02-22
申请号：US12848582
申请日：2010-08-02
IPC分类号： H01L21/76
CPC分类号： H01L29/0665 , B82Y10/00 , B82Y40/00 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/66545 , H01L29/66772 , H01L29/66795 , H01L29/775 , H01L29/785 , H01L29/78696 , Y10S977/72 , Y10S977/742 , Y10S977/762 , Y10S977/938
摘要： A semiconductor structure is provided that includes a plurality of vertically stacked and vertically spaced apart semiconductor nanowires (e.g., a semiconductor nanowire mesh) located on a surface of a substrate. One end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a source region and another end segment of each vertically stacked and vertically spaced apart semiconductor nanowires is connected to a drain region. A gate region including a gate dielectric and a gate conductor abuts the plurality of vertically stacked and vertically spaced apart semiconductor nanowires, and the source regions and the drain regions are self-aligned with the gate region.
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公开(公告)号：US08703576B2
公开(公告)日：2014-04-22
申请号：US13232293
申请日：2011-09-14
IPC分类号： H01L21/76
CPC分类号： H01L29/51 , H01L21/311 , H01L21/76825 , H01L21/76837 , H01L29/66545
摘要： Disposable gate structures are formed on a semiconductor substrate. A planarization dielectric layer is deposited over the disposable gate structures and planarized to provide a top surface that is coplanar with top surface of the disposable gate structures. The planarization dielectric layer at this point includes gap-fill keyholes between narrowly spaced disposable gate structures. A printable dielectric layer is deposited over the planarization dielectric layer to fill the gap-fill keyholes. Areas of the printable dielectric layer over the gap-fill keyholes are illuminated with radiation that cross-links cross-linkable bonds in the material of the printable dielectric layer. Non-crosslinked portions of the printable dielectric layer are subsequently removed selective to crosslinked portions of the printable dielectric layer, which fills at least the upper portion of each gate-fill keyhole. The disposable gate structures are removed to form gate cavities. The gate cavities are filled with a gate dielectric and a gate electrode.
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公开(公告)号：US20130062709A1
公开(公告)日：2013-03-14
申请号：US13232293
申请日：2011-09-14
CPC分类号： H01L29/51 , H01L21/311 , H01L21/76825 , H01L21/76837 , H01L29/66545
摘要： Disposable gate structures are formed on a semiconductor substrate. A planarization dielectric layer is deposited over the disposable gate structures and planarized to provide a top surface that is coplanar with top surface of the disposable gate structures. The planarization dielectric layer at this point includes gap-fill keyholes between narrowly spaced disposable gate structures. A printable dielectric layer is deposited over the planarization dielectric layer to fill the gap-fill keyholes. Areas of the printable dielectric layer over the gap-fill keyholes are illuminated with radiation that cross-links cross-linkable bonds in the material of the printable dielectric layer. Non-crosslinked portions of the printable dielectric layer are subsequently removed selective to crosslinked portions of the printable dielectric layer, which fills at least the upper portion of each gate-fill keyhole. The disposable gate structures are removed to form gate cavities. The gate cavities are filled with a gate dielectric and a gate electrode.
摘要翻译： 在半导体衬底上形成一次性栅极结构。 平坦化电介质层沉积在一次性栅极结构上并且被平坦化以提供与一次性栅极结构的顶表面共面的顶表面。 此时的平坦化电介质层包括狭缝间隔一次性栅极结构之间的间隙填充键孔。 在平坦化介电层上沉积可印刷介电层以填充间隙填充键孔。 在间隙填充键孔上的可印刷电介质层的区域被可印刷介电层的材料中交叉连接的辐射辐射照射。 可打印介电层的非交联部分随后被选择性地移除到可印刷介电层的交联部分，该可印刷电介质层至少填充每个栅极填充孔眼的上部。 去除一次性门结构以形成门腔。 栅极腔填充有栅极电介质和栅电极。
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公开(公告)号：US20130175624A1
公开(公告)日：2013-07-11
申请号：US13611335
申请日：2012-09-12
IPC分类号： H01L29/78
CPC分类号： H01L29/66795 , H01L29/785
摘要： Semiconductor devices and methods that include forming a fin field effect transistor by defining a fin hardmask on a semiconductor layer, forming a dummy structure over the fin hardmask to establish a planar area on the semiconductor layer, removing a portion of the fin hardmask that extends beyond the dummy structure, etching a semiconductor layer adjacent to the dummy structure to produce recessed source and drain regions, removing the dummy structure, etching the semiconductor layer in the planar area to produce fins, and forming a gate stack over the fins.
摘要翻译： 半导体器件和方法包括通过在半导体层上限定翅片硬掩模来形成鳍状场效应晶体管，在散热片硬掩模上形成虚拟结构，以在半导体层上建立平面区域，去除超出鳍片硬掩模的一部分 蚀刻与虚拟结构相邻的半导体层，以产生凹陷的源极和漏极区域，去除虚设结构，蚀刻平面区域中的半导体层以产生鳍片，以及在鳍片上形成栅极叠层。
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7.发明授权Embedded planar source/drain stressors for a finFET including a plurality of fins 有权用于包括多个翅片的finFET的嵌入式平面源极/漏极应力源公开(公告)号：US09024355B2
公开(公告)日：2015-05-05
申请号：US13483200
申请日：2012-05-30
CPC分类号： H01L29/66484 , H01L21/845 , H01L27/1211 , H01L29/66795 , H01L29/7831 , H01L29/7848 , H01L29/785
摘要： Fin-defining mask structures are formed over a semiconductor material layer having a first semiconductor material and a disposable gate structure is formed thereupon. A gate spacer is formed around the disposable gate structure and physically exposed portions of the fin-defining mask structures are subsequently removed. The semiconductor material layer is recessed employing the disposable gate structure and the gate spacer as an etch mask to form recessed semiconductor material portions. Embedded planar source/drain stressors are formed on the recessed semiconductor material portions by selective deposition of a second semiconductor material having a different lattice constant than the first semiconductor material. After formation of a planarization dielectric layer, the disposable gate structure is removed. A plurality of semiconductor fins are formed employing the fin-defining mask structures as an etch mask. A replacement gate structure is formed on the plurality of semiconductor fins.
摘要翻译： 翅片限定掩模结构形成在具有第一半导体材料的半导体材料层上，并且在其上形成一次性栅极结构。 在一次性栅极结构周围形成栅极间隔物，随后去除鳍状物限定掩模结构的物理暴露部分。 使用一次性栅极结构和栅极间隔物作为蚀刻掩模来凹入半导体材料层以形成凹入的半导体材料部分。 通过选择性沉积具有与第一半导体材料不同的晶格常数的第二半导体材料，在凹入的半导体材料部分上形成嵌入式平面源极/漏极应力。 在形成平坦化介电层之后，去除一次性栅极结构。 使用鳍状限定掩模结构作为蚀刻掩模形成多个半导体鳍。 在多个半导体鳍片上形成替换栅极结构。
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公开(公告)号：US08981478B2
公开(公告)日：2015-03-17
申请号：US13611335
申请日：2012-09-12
IPC分类号： H01L29/78
CPC分类号： H01L29/66795 , H01L29/785
摘要： Semiconductor devices and methods that include forming a fin field effect transistor by defining a fin hardmask on a semiconductor layer, forming a dummy structure over the fin hardmask to establish a planar area on the semiconductor layer, removing a portion of the fin hardmask that extends beyond the dummy structure, etching a semiconductor layer adjacent to the dummy structure to produce recessed source and drain regions, removing the dummy structure, etching the semiconductor layer in the planar area to produce fins, and forming a gate stack over the fins.
摘要翻译： 半导体器件和方法包括通过在半导体层上限定翅片硬掩模来形成鳍状场效应晶体管，在散热片硬掩模上形成虚拟结构，以在半导体层上建立平面区域，去除超出鳍片硬掩模的一部分 蚀刻与虚拟结构相邻的半导体层，以产生凹陷的源极和漏极区域，去除虚设结构，蚀刻平面区域中的半导体层以产生鳍片，以及在鳍片上形成栅极叠层。
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9.发明申请EMBEDDED PLANAR SOURCE/DRAIN STRESSORS FOR A FINFET INCLUDING A PLURALITY OF FINS 有权嵌入式平面电源/漏极应力器，包括多个FINS公开(公告)号：US20130320399A1
公开(公告)日：2013-12-05
申请号：US13483200
申请日：2012-05-30
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/66484 , H01L21/845 , H01L27/1211 , H01L29/66795 , H01L29/7831 , H01L29/7848 , H01L29/785
摘要： Fin-defining mask structures are formed over a semiconductor material layer having a first semiconductor material and a disposable gate structure is formed thereupon. A gate spacer is formed around the disposable gate structure and physically exposed portions of the fin-defining mask structures are subsequently removed. The semiconductor material layer is recessed employing the disposable gate structure and the gate spacer as an etch mask to form recessed semiconductor material portions. Embedded planar source/drain stressors are formed on the recessed semiconductor material portions by selective deposition of a second semiconductor material having a different lattice constant than the first semiconductor material. After formation of a planarization dielectric layer, the disposable gate structure is removed. A plurality of semiconductor fins are formed employing the fin-defining mask structures as an etch mask. A replacement gate structure is formed on the plurality of semiconductor fins.
摘要翻译： 翅片限定掩模结构形成在具有第一半导体材料的半导体材料层上，并且在其上形成一次性栅极结构。 在一次性栅极结构周围形成栅极间隔物，随后去除鳍状物限定掩模结构的物理暴露部分。 使用一次性栅极结构和栅极间隔物作为蚀刻掩模来凹入半导体材料层以形成凹入的半导体材料部分。 通过选择性沉积具有与第一半导体材料不同的晶格常数的第二半导体材料，在凹入的半导体材料部分上形成嵌入式平面源极/漏极应力。 在形成平坦化介电层之后，去除一次性栅极结构。 使用鳍状限定掩模结构作为蚀刻掩模形成多个半导体鳍。 在多个半导体鳍片上形成替换栅极结构。
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10.发明申请NON-PLANAR MOSFET STRUCTURES WITH ASYMMETRIC RECESSED SOURCE DRAINS AND METHODS FOR MAKING THE SAME 有权具有不对称吸收源排水的非平面MOSFET结构及其制造方法公开(公告)号：US20130214357A1
公开(公告)日：2013-08-22
申请号：US13398339
申请日：2012-02-16
IPC分类号： H01L29/786 , H01L21/336
CPC分类号： H01L29/66545 , H01L29/0657 , H01L29/66795
摘要： Non-planar Metal Oxide Field Effect Transistors (MOSFETs) and methods for making non-planar MOSFETs with asymmetric, recessed source and drains having improved extrinsic resistance and fringing capacitance. The methods include a fin-last, replacement gate process to form the non-planar MOSFETs and employ a retrograde metal lift-off process to form the asymmetric source/drain recesses. The lift-off process creates one recess which is off-set from a gate structure while a second recess is aligned with the structure. Thus, source/drain asymmetry is achieved by the physical structure of the source/drains, and not merely by ion implantation. The resulting non-planar device has a first channel of a fin contacting a substantially undoped area on the drain side and a doped area on the source side, thus the first channel is asymmetric. A channel on atop surface of a fin is symmetric because it contacts doped areas on both the drain and source sides.
摘要翻译： 非平面金属氧化物场效应晶体管（MOSFET）和用于制造具有改进的外在电阻和边缘电容的具有不对称，凹陷源极和漏极的非平面MOSFET的方法。 这些方法包括最后一个替代栅极工艺，以形成非平面MOSFET并且采用逆向金属剥离工艺来形成不对称的源极/漏极凹槽。 剥离过程产生一个从门结构偏离的凹槽，而第二凹槽与结构对准。 因此，源/漏不对称性通过源极/漏极的物理结构实现，而不仅仅是通过离子注入来实现。 所得到的非平面器件具有接触漏极侧的基本上未掺杂的区域和源极侧的掺杂区域的翅片的第一通道，因此第一通道是不对称的。 鳍的顶表面上的通道是对称的，因为它接触漏极和源极侧上的掺杂区域。
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