Abstract:
A method of manufacturing shutters for computer disks, optical disks and the like, includes forming a rib on a connecting member formed between adjoining shutter blanks during bending and cutting processing. The rib is concave in cross-section and increases a strength of the connecting portion such that stress applied during bending processing, and movement of the rolled steel which is used for manufacturing, does not deform the connecting portion. According to this, processing speed for manufacturing may be increased and further, thinner material may be utilized in forming the shutters. Also, at a later stage of processing, the convex ribs may again be flattened.
Abstract:
A method of packaging an article, such as a disk cassette or a tape cassette, in a wrapping film having at least a printed portion to be attached adhesively to the surface of the article comprises wrapping the article in the wrapping film, and pressing the printed portion to the surface of the article to attach the printed portion adhesively to the surface of the article so that the printed portion remains on the surface of the article when the wrapping film is torn off. Characters and patterns to be formed on both the article and the wrapping film are printed on the wrapping film and the characters and patterns to be formed on the surface of the article are formed in the printed portion of the wrapping film and the printed portion is attached adhesively to the surface of the article when the article is wrapped in the wrapping film. Therefore, nothing needs to be printed on the article, which reduces the manufacturing cost of the article.
Abstract:
A lifter for a disk mounted in a disk cartridge comprises a lifter body formed of a flexible thin plate material and having a fold, folded at a predetermined angle so as to define a fixing member at one side of the fold and a pressing member at the other. A cutout is formed at a position across the fold to minimize distorting forces concentrated at the fold.
Abstract:
A storage case for disc-shaped recording media contained within respective substantially flat rectangular housings is constituted by a one-piece molded plastic member including a central spine having opposed side edges joined by flexible hinges with respective rectangular covers which are swingable between closed positions, in which the covers extend substantially parallel to each other from the spine with their inner surfaces in confronting relation, and opened positions in which the covers are spread angularly apart, elements on the covers for holding respective disc-shaped recording media in their rectangular housings against the inner surfaces of the respective covers, and a holder on the spine extending from the latter between the covers in the closed positions of the latter for embracing and holding at least one additional disc-shaped recording medium at an edge portion of its respective rectangular housing so as to accommodate such at least one additional disc-shaped recording medium in its respective housing between the disc-shaped recording media in their respective housings held against the inner surfaces of the covers.
Abstract:
There is a problem that a reverse off-leak current becomes too large in a Schottky barrier diode. A semiconductor device of the present invention includes P-type first and second anode diffusion layers formed in an N-type epitaxial layer, N-type cathode diffusion layers formed in the epitaxial layer, a P-type third anode diffusion layer formed in the epitaxial layer so as to surround the first and second anode diffusion layers and to extend toward the cathode diffusion layers, and a Schottky barrier metal layer formed on the first and second anode diffusion layers.
Abstract:
The invention provides a high voltage MOS transistor having a high gate breakdown voltage and a high source/drain breakdown voltage and having a low on-resistance. A gate electrode is formed on an epitaxial silicon layer with a LOCOS film being interposed therebetween. A P-type first drift layer is formed on the left side of the LOCOS film, and a P+-type source layer is disposed on the surface of the epitaxial silicon layer on the right side of the LOCOS film, being opposed to the first drift layer over the gate electrode. A P-type second drift layer is formed by being diffused in the epitaxial silicon layer deeper than the first drift layer, extending from under the first drift layer to under the left side of the LOCOS film. A recess is formed in a bottom portion of the second drift layer under the left end of the LOCOS film.
Abstract:
In a semiconductor device of the present invention, a MOS transistor is disposed in an elliptical shape. Linear regions in the elliptical shape are respectively used as the active regions, and round regions in the elliptical shape is used respectively as the inactive regions. In each of the inactive regions, a P type diffusion layer is formed to coincide with a round shape. Another P type diffusion layer is formed in a part of one of the inactive regions. These P type diffusion layers are formed as floating diffusion layers, are capacitively coupled to a metal layer on an insulating layer, and assume a state where predetermined potentials are respectively applied thereto. This structure makes it possible to maintain current performance of the active regions, while improving the withstand voltage characteristics in the inactive regions.
Abstract:
In a conventional semiconductor device, there is a problem that an N-type diffusion region provided for protecting an element from an overvoltage is narrow and a breakdown current is concentrated so that a PN junction region for protection is broken. In a semiconductor device of the present invention, an N-type buried diffusion layer is formed across a substrate and an epitaxial layer. A P-type buried diffusion layer is formed across a wider region on an upper surface of the N-type buried diffusion layer so that a PN junction region for overvoltage protection is formed. A P-type diffusion layer is formed so as to be connected to the P-type diffusion layer. A breakdown voltage of the PN junction region is lower than a breakdown voltage between a source and a drain. With this structure, the concentration of the breakdown current is prevented so that the semiconductor device can be protected from the overvoltage.
Abstract:
The invention provides a high voltage MOS transistor having a high source/drain breakdown voltage of about 300V and a low on-resistance. An N-type body layer is formed extending from a source layer side to under a gate electrode. A P-type second drift layer is formed in an epitaxial semiconductor layer by being diffused deeper than a first drift layer, extending from under the first drift layer to under the gate electrode and forming a PN junction with the body layer under the gate electrode. A surface of the body layer between this second drift layer and the source layer serves as a channel region. The first drift layer is formed at a distance from a left end of the gate electrode where electric field concentration easily occurs.
Abstract:
In a semiconductor device of the present invention, an N type epitaxial layer is stacked on a P type single crystal silicon substrate. In the epitaxial layer, an N type diffusion layer as a base draw-out region, P type diffusion layers as an emitter region, and P type diffusion layers as a collector region are formed. The emitter region has a region having a larger diffusion width in a portion deeper than in a vicinity of a surface thereof. In a lateral PNP transistor, a smallest base width is formed in a deep portion of the epitaxial layer. By use of this structure, even in a case where the collector region is narrowed, a desired hfe value can be realized. Thus, the device size can be reduced.