Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
    91.
    发明申请
    Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same 有权
    用于半导体发光器件封装的底座以及包括其的半导体发光器件封装

    公开(公告)号:US20070253209A1

    公开(公告)日:2007-11-01

    申请号:US11412381

    申请日:2006-04-27

    IPC分类号: B60Q1/124

    摘要: A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

    摘要翻译: 一种用于固体照明包装的基座,包括具有上表面和下表面的支撑构件,第一侧表面和与第一侧表面相对的第二侧表面,位于支撑构件的上表面上的第一电接合垫, 接合区域靠近支撑构件的第一侧表面,以及第二接合区域,其朝着支撑构件的第二侧表面延伸,并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

    High efficiency LEDs with tunnel junctions
    92.
    发明申请
    High efficiency LEDs with tunnel junctions 有权
    具有隧道结的高效率LED

    公开(公告)号:US20070194330A1

    公开(公告)日:2007-08-23

    申请号:US11362472

    申请日:2006-02-23

    IPC分类号: H01L33/00

    摘要: An LED made from a wide band gap semiconductor material and having a low resistance p-type confinement layer with a tunnel junction in a wide band gap semiconductor device is disclosed. A dissimilar material is placed at the tunnel junction where the material generates a natural dipole. This natural dipole is used to form a junction having a tunnel width that is smaller than such a width would be without the dissimilar material. A low resistance p-type confinement layer having a tunnel junction in a wide band gap semiconductor device may be fabricated by generating a polarization charge in the junction of the confinement layer, and forming a tunnel width in the junction that is smaller than the width would be without the polarization charge. Tunneling through the tunnel junction in the confinement layer may be enhanced by the addition of impurities within the junction. These impurities may form band gap states in the junction.

    摘要翻译: 公开了一种由宽带隙半导体材料制成的LED,并具有在宽带隙半导体器件中具有隧道结的低电阻p型约束层。 不同的材料放置在材料产生天然偶极子的隧道结处。 该天然偶极子用于形成隧道宽度小于不具有不同材料的宽度的接合点。 在宽带隙半导体器件中具有隧道结的低电阻p型限制层可以通过在限制层的接合处产生极化电荷并在接合部中形成小于宽度的隧道宽度来制造 没有极化电荷。 可以通过在连接处添加杂质来增强通过限制层中的隧道结的隧穿。 这些杂质可能在结中形成带隙状态。

    Multi element, multi color solid state LED/laser
    95.
    发明授权
    Multi element, multi color solid state LED/laser 有权
    多元素,多色固态LED /激光

    公开(公告)号:US07084436B2

    公开(公告)日:2006-08-01

    申请号:US10815426

    申请日:2004-03-31

    IPC分类号: H01L33/00

    摘要: A light emitting diode (LED) grown on a substrate doped with one or more rare earth or transition element. The dopant ions absorb some or all of the light from the LED's active layer, pumping the electrons on the dopant ion to a higher energy state. The electrons are naturally drawn to their equilibrium state and they emit light at a wavelength that depends on the type of dopant ion. The invention is particularly applicable to nitride based LEDs emitting UV light and grown on a sapphire substrate doped with chromium. The chromium ions absorb the UV light, exciting the electrons on ions to a higher energy state. When they return to their equilibrium state they emit red light and some of the red light will emit from the LED's surface. The LED can also have active layers that emit green and blue and UV light, such that the LED emits green, blue, red light and UV light which combines to create white light. Alternatively, it can have one active layer and grown on a sapphire substrate doped with Cr, Ti, and Co such that the substrate absorbs the UV light and emits blue, green, and red light. The invention is also capable of providing a tunable LED over a variety of color shades. The invention is also applicable to solid state laser having one or more active layers emitting UV light with the laser grown on a sapphire substrate doped with one or more rare earth or transition elements.

    摘要翻译: 在掺杂有一种或多种稀土或过渡元素的衬底上生长的发光二极管(LED)。 掺杂剂离子吸收来自LED有源层的一些或全部光,将掺杂剂离子上的电子泵送到更高的能量状态。 电子被自然地吸收到它们的平衡状态,并且它们以取决于掺杂剂离子的类型的波长发光。 本发明特别适用于发射紫外光并在掺杂有铬的蓝宝石衬底上生长的基于氮化物的LED。 铬离子吸收紫外光,激发离子上的电子到更高的能量状态。 当它们回到它们的平衡状态时,它们发出红光,并且一些红光将从LED的表面发射。 LED还可以具有发射绿色和蓝色和紫外线的有源层,使得LED发出绿色,蓝色,红色光和UV光,其组合以产生白光。 或者,它可以具有一个活性层并在掺杂有Cr,Ti和Co的蓝宝石衬底上生长,使得衬底吸收UV光并发出蓝色,绿色和红色光。 本发明还能够在各种色调上提供可调LED。 本发明也适用于具有一个或多个发射紫外光的有源层的固体激光器,其中激光生长在掺杂有一种或多种稀土或过渡元素的蓝宝石衬底上。

    Polycarbonate molding materials exhibiting improved mechanical properties
    98.
    发明授权
    Polycarbonate molding materials exhibiting improved mechanical properties 有权
    表现出改进的机械性能的聚碳酸酯模塑材料

    公开(公告)号:US06414107B1

    公开(公告)日:2002-07-02

    申请号:US09857273

    申请日:2001-06-01

    IPC分类号: C08G6400

    摘要: A thermoplastic polycarbonate molding composition is described. The thermoplastic composition contains a silicon compound, e.g., silicon dioxide, having an average particle diameter of 0.001 &mgr;m to 10 &mgr;m. The silicon compound is present in the composition in an amount of 0.01 to 30 parts by weight per 100 parts by weight of the thermoplastic polycarbonate. Also describe are shaped articles, e.g., data technology housing components, made from the thermoplastic polycarbonate composition of the present invention.

    摘要翻译: 描述热塑性聚碳酸酯模塑组合物。 热塑性组合物含有平均粒径为0.001μm至10μm的硅化合物,例如二氧化硅。 该组合物中存在的硅化合物的量为每100重量份热塑性聚碳酸酯0.01至30重量份。 还描述了由本发明的热塑性聚碳酸酯组合物制成的成型制品,例如数据技术外壳部件。

    Lab centrifuge with imbalance shutoff
    99.
    发明授权
    Lab centrifuge with imbalance shutoff 失效
    实验室离心机不平衡关闭

    公开(公告)号:US5496254A

    公开(公告)日:1996-03-05

    申请号:US322611

    申请日:1994-10-13

    IPC分类号: B04B9/14 B04B13/00

    CPC分类号: B04B9/146

    摘要: A lab centrifuge with a rotor carrying vessel supports and a motor with a vertical shaft driving said rotor into rotation, the stator associated with said rotor being supported by elastic supports on a centrifuge base. A shutoff device controls the motor which it shuts off in response to a signal generated by a component affixed to the stator and a component affixed to the base when the stator deviation taking place is found to exceed or match the maximum admissible threshold imbalance. One of the two components is a field generator generating a constant field and the other component is a field intensity detector connected to an analyzer which, upon limit changes in field intensity caused by the deviation, implements shutoff.

    摘要翻译: 具有转子承载容器支架的实验室离心机和具有驱动所述转子旋转的垂直轴的马达,与所述转子相关联的定子由离心机基座上的弹性支撑件支撑。 关闭装置控制其关闭的电动机,以响应于固定到定子上的部件产生的信号和当发生定子偏差发生超过或匹配最大允许阈值不平衡时固定到基座上的部件。 两个部件中的一个是产生恒定场的场发生器,另一个部件是连接到分析仪的场强检测器,在由偏差引起的场强的极限变化时,实现截止。

    LED array and method for fabricating same

    公开(公告)号:US10295147B2

    公开(公告)日:2019-05-21

    申请号:US11982276

    申请日:2007-10-31

    摘要: A light emitting device or array comprising a submount having a top surface, a bottom surface and a plurality of edges, with input and output terminals disposed on the top surface. A plurality of attach pads and traces are also disposed on the top surface and electrically connected between the input and output terminals. A plurality of LEDs are also included, each of which is mounted to one of the attach pads. The attach pads cover more of the top surface than the LEDs and spread heat from the LEDs to the top surface of the submount. A plurality of lenses are also included each of which is molded over a respective one of the attach pads and covers the LED mounted to the particular attach pad. The arrays are shaped and arranged so that they can be easily attached to similar arrays in a tiling fashion, with the desired number of arrays included to meet the desired lighting requirements. Methods for fabricating the arrays from a single submount or submounts panel are also disclosed.