公开(公告)号：US20110309464A1

公开(公告)日：2011-12-22

申请号：US13164246

申请日：2011-06-20

申请人： Kensaku YAMAMOTO ,  Naohiro Suzuki ,  Hidefumi Takaya ,  Masahiro Sugimoto ,  Jun Morimoto ,  Narumasa Soejima ,  Tsuyoshi Ishikawa ,  Yukihiko Watanabe

发明人： Kensaku YAMAMOTO ,  Naohiro Suzuki ,  Hidefumi Takaya ,  Masahiro Sugimoto ,  Jun Morimoto ,  Narumasa Soejima ,  Tsuyoshi Ishikawa ,  Yukihiko Watanabe

IPC分类号： H01L29/06

CPC分类号： H01L29/7813 ,  H01L29/0619 ,  H01L29/0661 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/1608 ,  H01L29/407 ,  H01L29/66068 ,  H01L29/7397 ,  H01L29/7811 ,  H01L29/8613

摘要： A semiconductor device includes a semiconductor substrate and an electric field terminal part. The semiconductor substrate includes a substrate, a drift layer disposed on a surface of the substrate, and a base layer disposed on a surface of the drift layer. The semiconductor substrate is divided into a cell region in which a semiconductor element is disposed and a peripheral region that surrounds the cell region. The base region has a bottom face located on a same plane throughout the cell region and the peripheral region and provides an electric field relaxing layer located in the peripheral region. The electric field terminal part surrounds the cell region and a portion of the electric field relaxing layer and penetrates the electric field relaxing layer from a surface of the electric field relaxing layer to the drift layer.

摘要翻译： 半导体器件包括半导体衬底和电场端子部分。 半导体衬底包括衬底，设置在衬底的表面上的漂移层和设置在漂移层的表面上的基底层。 半导体衬底被分成其中设置半导体元件的单元区域和围绕单元区域的外围区域。 基底区域具有位于整个电池区域和外围区域的同一平面上的底面，并且提供位于周边区域中的电场弛豫层。 电场端子部围绕电池区域和电场缓和层的一部分，从电场缓和层的表面向漂移层贯通电场缓和层。

公开(公告)号：US20110254903A1

公开(公告)日：2011-10-20

申请号：US13087286

申请日：2011-04-14

申请人： Yuji Kanome ,  Hiroyuki Tanaka ,  Yoshiaki Suzuki ,  Seiji Suzuki ,  Masahiro Sugimoto ,  Takeaki Nakano ,  Susumu Hirosawa

发明人： Yuji Kanome ,  Hiroyuki Tanaka ,  Yoshiaki Suzuki ,  Seiji Suzuki ,  Masahiro Sugimoto ,  Takeaki Nakano ,  Susumu Hirosawa

IPC分类号： B41J2/175

CPC分类号： B41J2/17509 ,  B41J2/17596

摘要： Provided is a printing apparatus in which bubbles in a print head are easily removed. The printing apparatus includes a first one-way valve disposed between the pump and the ink tank in the collection channel, the first one-way valve allowing movement of ink from the pump to the ink tank and blocking movement of ink from the ink tank to the pump; a circulation channel that connects the ink tank to the collection channel at a position between the pump and the first one-way valve, the circulation channel enabling circulation of ink from the ink tank, through the print head, and to the ink tank; and a second one-way valve disposed in the circulation channel, the second one-way valve allowing movement of ink from the ink tank to the pump and blocking movement of ink from the pump to the ink tank.

摘要翻译： 提供了一种其中容易去除打印头中的气泡的打印设备。 打印装置包括设置在收集通道中的泵和墨水罐之间的第一单向阀，第一单向阀允许墨水从泵移动到墨水盒并阻止墨水从墨水盒移动到 泵; 循环通道，其在所述泵和所述第一单向阀之间的位置处将所述墨水罐连接到所述收集通道，所述循环通道使得能够从所述墨水罐通过所述打印头和所述墨水罐循环墨水; 以及设置在所述循环通道中的第二单向阀，所述第二单向阀允许墨从所述墨罐移动到所述泵并阻止墨从所述泵移动到所述墨槽。

公开(公告)号：US20110211018A1

公开(公告)日：2011-09-01

申请号：US13033437

申请日：2011-02-23

申请人： Susumu Hirosawa ,  Yuji Kanome ,  Hiroyuki Tanaka ,  Yoshiaki Suzuki ,  Masahiro Sugimoto ,  Seiji Suzuki ,  Takeaki Nakano

发明人： Susumu Hirosawa ,  Yuji Kanome ,  Hiroyuki Tanaka ,  Yoshiaki Suzuki ,  Masahiro Sugimoto ,  Seiji Suzuki ,  Takeaki Nakano

IPC分类号： B41J2/135

CPC分类号： B41J2/16508 ,  B41J2/16526

摘要： In order to efficiently perform preliminary ejection of ink at a bend of an ink circulation passage, the number of preliminary ejections of a nozzle group located on the outer side of the bend is set larger than the number of preliminary ejections of a nozzle group located in the middle of the bend.

摘要翻译： 为了在油墨循环通道的弯曲部处有效地进行油墨的预喷射，位于弯曲部的外侧的喷嘴组的预喷射次数被设定为大于位于喷嘴组中的喷嘴组的预喷射次数 弯曲的中间。

公开(公告)号：US20110109691A1

公开(公告)日：2011-05-12

申请号：US12941914

申请日：2010-11-08

申请人： Takaya Sato ,  Yuji Kanome ,  Hiroyuki Tanaka ,  Yoshiaki Suzuki ,  Masahiro Sugimoto ,  Seiji Suzuki ,  Susumu Hirosawa ,  Takeaki Nakano

发明人： Takaya Sato ,  Yuji Kanome ,  Hiroyuki Tanaka ,  Yoshiaki Suzuki ,  Masahiro Sugimoto ,  Seiji Suzuki ,  Susumu Hirosawa ,  Takeaki Nakano

IPC分类号： B41J2/165

CPC分类号： B41J2/16585 ,  B41J2/16538

摘要： An apparatus includes a recording head having a sealing portion arranged in proximity to nozzle arrays and protruding beyond a nozzle surface. A wiper unit configured to wipe the nozzle surface of the recording head has a first wiper blade and a second wiper blade, and the first wiper blade is arranged to be inclined by an angle θ1 (θ1>0) with respect to a direction orthogonal to the wiping direction within a plane parallel to the nozzle surface, while the second wiper blade is arranged to be inclined by an angle θ2 (θ2

摘要翻译： 一种装置包括具有密封部分的记录头，该密封部分布置在喷嘴阵列附近并突出超过喷嘴表面。 被配置为擦拭记录头的喷嘴表面的刮水器单元具有第一刮水片和第二刮水片，并且第一刮水片布置成相对于第一刮板和倾斜角倾斜1; 在与喷嘴表面平行的平面内与擦拭方向正交的方向，而第二刮片设置成相对于与擦拭方向正交的方向倾斜角度θ; 2（＆amp; the; 2; 0） 飞机。

公开(公告)号：US20110109689A1

公开(公告)日：2011-05-12

申请号：US12896703

申请日：2010-10-01

申请人： Masahiro Sugimoto ,  Akira Kida ,  Susumu Hirosawa ,  Takeaki Nakano ,  Hiroyuki Tanaka ,  Seiji Suzuki ,  Yoshiaki Suzuki ,  Yuji Kanome

发明人： Masahiro Sugimoto ,  Akira Kida ,  Susumu Hirosawa ,  Takeaki Nakano ,  Hiroyuki Tanaka ,  Seiji Suzuki ,  Yoshiaki Suzuki ,  Yuji Kanome

IPC分类号： B41J2/165

CPC分类号： B41J29/377 ,  B41J2/165 ,  B41J2/1714

摘要： An apparatus includes a supply unit having a humidifying portion that supplies humidified gas near a nozzle array of a line-type recording head. In correspondence to displacement of the recording head in a direction of the nozzle array, at least one of an introducing direction and an introducing position of the supplied humidified gas can be changed.

摘要翻译： 一种装置，包括：供给单元，具有在线型记录头的喷嘴列附近供给加湿气体的加湿部。 对应于记录头沿着喷嘴阵列的方向的位移，可以改变供应的加湿气体的导入方向和导入位置中的至少一个。

公开(公告)号：US20050200875A1

公开(公告)日：2005-09-15

申请号：US11068870

申请日：2005-03-02

申请人： Masahiro Sugimoto ,  Satoru Moriyama

发明人： Masahiro Sugimoto ,  Satoru Moriyama

IPC分类号： B41J29/38 ,  B41J11/00 ,  B41J15/04 ,  G06F3/12 ,  G06F15/00 ,  H04N1/46

CPC分类号： B41J11/009 ,  B41J15/042

摘要： If a signal of a unit detecting switch provided at a roll paper unit setting position in a print apparatus is detected and the value indicated by the detected signal is not stored in a medium information memory area, it is determined that it is a new roll paper unit and shortage request information is transmitted to a personal computer. If medium information is received, a medium information acquisition processing is carried out. In this medium information acquisition processing, received medium information is stored in the medium information memory area.

摘要翻译： 如果检测到设置在打印设备中的卷纸单元设置位置处的单元检测开关的信号，并且检测到的信号指示的值未被存储在介质信息存储区域中，则确定它是新的卷纸 单位和短缺请求信息被传送到个人计算机。 如果接收到媒体信息，则进行介质信息获取处理。 在该介质信息获取处理中，接收的介质信息被存储在介质信息存储区域中。

公开(公告)号：US5929385A

公开(公告)日：1999-07-27

申请号：US850184

申请日：1997-05-02

申请人： Masahiro Sugimoto ,  Akio Kimura ,  Masanao Mimura ,  Hideo Ishii ,  Shoichi Honjo ,  Yoshihiro Iwata

发明人： Masahiro Sugimoto ,  Akio Kimura ,  Masanao Mimura ,  Hideo Ishii ,  Shoichi Honjo ,  Yoshihiro Iwata

IPC分类号： H01L39/14 ,  H01B12/00

CPC分类号： H01L39/143

摘要： Disclosed is an AC oxide superconductor round wire including a metal matrix, and a plurality of superconductor filaments embedded in the metal matrix, wherein the superconductor filaments are twisted at a twist pitch L.sub.p satisfying the following relation.2L.sub.c1

摘要翻译： 公开了一种包含金属基体的AC氧化物超导体圆线和嵌入在金属基体中的多根超导体丝，其中超导体长丝以满足以下关系的扭曲节距Lp扭曲.2Lc1

公开(公告)号：US5096749A

公开(公告)日：1992-03-17

申请号：US588862

申请日：1990-09-27

申请人： Shigeki Harada ,  Masahiro Sugimoto

发明人： Shigeki Harada ,  Masahiro Sugimoto

IPC分类号： C23C14/06 ,  C04B41/51 ,  C04B41/52 ,  C04B41/89 ,  C23C14/14 ,  C23C14/18 ,  C23C14/58 ,  H01L23/10 ,  H05K1/03 ,  H05K3/38

CPC分类号： C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/207 ,  H05K1/0306 ,  H05K3/38 ,  Y10T428/12056 ,  Y10T428/12576 ,  Y10T428/31536

摘要： A metallization layer structure containing, in order, an aluminum nitride ceramic base layer, an aluminum titanium nitride layer, a titanium layer, a heat-resistant metallic layer and a metallic layer for facilitating soldering and brazing. The aluminum titanium nitride layer is formed at the interface between the aluminum nitride ceramic base layer and the titanium layer by subjecting a laminate containing, in order, an aluminum nitride ceramic base layer, a titanium layer, a heat-resistant metallic layer and a metallic layer for facilitating soldering and brazing to a heat treatment within the range of 350.degree.-1000.degree. C. for 40 minutes.

公开(公告)号：US5081067A

公开(公告)日：1992-01-14

申请号：US698030

申请日：1991-05-10

申请人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

发明人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

IPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/15312 ,  Y10T29/49144

摘要： A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring patttern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.

公开(公告)号：US5065223A

公开(公告)日：1991-11-12

申请号：US531457

申请日：1990-05-31

申请人： Hirohisa Matsuki ,  Shigeki Harada ,  Masahiro Sugimoto ,  Toshiki Yoshida

发明人： Hirohisa Matsuki ,  Shigeki Harada ,  Masahiro Sugimoto ,  Toshiki Yoshida

IPC分类号： H01L23/055 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/3675 ,  H01L23/055 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/01079

摘要： A semiconductor device includes a semiconductor chip, a substrate for supporting the semiconductor chip, a plurality of terminals provided on the substrate for external connections, a plurality of lead wires provided on the semiconductor chip for connections to the terminals, and a multilevel interconnection structure for connecting the plurality of terminals to the plurality of lead wires on the semiconductor chip. The multilevel interconnection structure includes at least a lower conductor layer provided on the substrate and patterned into a plurality of pattern portions connected electrically to the terminals, an insulator layer provided on the lower conductor layer, and an upper conductor layer provided above the insulator layer. The upper conductor layer is formed with a connection area immediately below the lead wires on the semiconductor chip when the semiconductor chip is mounted on the substrate, the upper conductor layer is patterned in the connection area into a plurality of conductor strips extending parallel with each other in correspondence to the lead wires, the insulator layer is provided with contact holes so as to connect electrically the conductor strips of the upper conductor layer with the pattern portions of the lower conductor layer. In the semiconductor device, each of the pattern portions in the connection area has an edge extending obliquely to the conductor strips of the upper conductor layer wherein the pattern portions are disposed so that a pair of adjacent pattern portions have respective edges opposing with each other and extending parallel with each other with a lateral gap extending therebetween.