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    Packaged semiconductor device
    1.
    发明授权
    Packaged semiconductor device 失效
    包装半导体器件

    公开(公告)号：US5065223A

    公开(公告)日：1991-11-12

    申请号：US531457

    申请日：1990-05-31

    申请人： Hirohisa Matsuki ,  Shigeki Harada ,  Masahiro Sugimoto ,  Toshiki Yoshida

    发明人： Hirohisa Matsuki ,  Shigeki Harada ,  Masahiro Sugimoto ,  Toshiki Yoshida

    IPC分类号： H01L23/055 ,  H01L23/367 ,  H01L23/498

    CPC分类号： H01L23/3675 ,  H01L23/055 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/01079

    摘要： A semiconductor device includes a semiconductor chip, a substrate for supporting the semiconductor chip, a plurality of terminals provided on the substrate for external connections, a plurality of lead wires provided on the semiconductor chip for connections to the terminals, and a multilevel interconnection structure for connecting the plurality of terminals to the plurality of lead wires on the semiconductor chip. The multilevel interconnection structure includes at least a lower conductor layer provided on the substrate and patterned into a plurality of pattern portions connected electrically to the terminals, an insulator layer provided on the lower conductor layer, and an upper conductor layer provided above the insulator layer. The upper conductor layer is formed with a connection area immediately below the lead wires on the semiconductor chip when the semiconductor chip is mounted on the substrate, the upper conductor layer is patterned in the connection area into a plurality of conductor strips extending parallel with each other in correspondence to the lead wires, the insulator layer is provided with contact holes so as to connect electrically the conductor strips of the upper conductor layer with the pattern portions of the lower conductor layer. In the semiconductor device, each of the pattern portions in the connection area has an edge extending obliquely to the conductor strips of the upper conductor layer wherein the pattern portions are disposed so that a pair of adjacent pattern portions have respective edges opposing with each other and extending parallel with each other with a lateral gap extending therebetween.

    Heatsink package for flip-chip IC
    3.
    发明授权
    Heatsink package for flip-chip IC 失效
    散热片封装用于倒装IC

    公开(公告)号：US4698663A

    公开(公告)日：1987-10-06

    申请号：US937414

    申请日：1986-12-03

    申请人： Masahiro Sugimoto ,  Yasumasa Wakasugi ,  Shigeki Harada

    发明人： Masahiro Sugimoto ,  Yasumasa Wakasugi ,  Shigeki Harada

    IPC分类号： H01L23/04 ,  H01L23/02 ,  H01L23/055 ,  H01L23/34 ,  H01L23/367

    CPC分类号： H01L23/055 ,  H01L23/3675 ,  H01L2224/32225 ,  H01L2924/01079 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap to cover the opening and to make contact with the semiconductor element via the opening, so that heat generated by the semiconductor element is conducted directly to the heatsink member. A method of producing the semiconductor device comprises the steps of mounting the semiconductor element on the substrate, covering the semiconductor element by the cap which is fixed to the substrate, and mounting the heatsink member on the cap to cover the opening and to make contact with the semiconductor element via the opening.

    摘要翻译： 半导体器件包括衬底，安装在衬底上的半导体元件，具有比用于覆盖半导体元件以提供气密密封的半导体元件的外部尺寸小的开口的帽以及安装在帽上的散热构件以覆盖 开口，并且经由开口与半导体元件接触，使得由半导体元件产生的热直接传导到散热构件。 一种制造半导体器件的方法包括以下步骤：将半导体元件安装在基板上，通过固定到基板的盖覆盖半导体元件，并将散热构件安装在盖上以覆盖开口并与 半导体元件经由开口。

    Lamp lighting apparatus
    10.
    发明授权
    Lamp lighting apparatus 失效
    灯具照明设备

    公开(公告)号：US07598678B2

    公开(公告)日：2009-10-06

    申请号：US11460103

    申请日：2006-07-26

    申请人： Shigeki Harada ,  Taichiro Tamida ,  Akihiko Iwata

    发明人： Shigeki Harada ,  Taichiro Tamida ,  Akihiko Iwata

    IPC分类号： H05B37/02

    CPC分类号： H05B41/2886 ,  H05B41/2928 ,  Y02B20/208

    摘要： A lamp lighting apparatus includes an arc spot movement detector (5) for monitoring an DC voltage Vb which is the bus voltage of an inverter (3), and for detecting a movement of an arc spot which appears before a lamp 1 enters a state where human beings can recognize a flicker of the lamp (1), and, when the arc spot movement detector (5) detects a movement of the arc spot, controls a switch (2a) of a DCDC converter (2) so as to suppress the movement of the arc spot.

    摘要翻译： 灯具照明装置包括用于监视作为逆变器（3）的总线电压的直流电压Vb的电弧点运动检测器（5），并且用于检测在灯1进入灯1之前出现的电弧点的运动， 人可以识别灯（1）的闪烁，并且当电弧点移动检测器（5）检测到电弧点的移动时，控制DCDC转换器（2）的开关（2a），以便抑制 电弧点运动。