摘要:
Provided are novel Building Integrable Photovoltaic (BIPV) modules having one or more connectors that are movable between extended and retracted positions. Connector adjustment may be performed in the field, for example, during installation of a module. In certain embodiments, a connector includes a connector body and extension body. The extension body flexibly attaches the connector body to the module and allows the connector body to move with respect to the module edge. In an extended position, the connector body is positioned closer to the edge and is configured to make electrical connections to a joiner connector for interconnecting with an adjacent module. In a retracted positioned, the connector body is positioned further from the edge and is configured to make electrical connections to a jumper for interconnecting the conductive elements of the connector. In certain embodiments, a jumper does not protrude beyond the edge when connected to the connector body.
摘要:
Provided are novel interconnecting strips for electrically connecting building integrable photovoltaic (BIPV) modules in a photovoltaic array. An interconnecting strip can be provided between a building structure and the BIPV modules, with electrical connections established by lowering the modules onto the strip previously positioned on the structure. The strip can includes two or more terminal groups aligned with different rows of BIPV modules. Each terminal group includes two or more connector terminals for connecting to the modules in that row. The interconnecting strip also includes leads extending between terminal groups and connecting connector terminals of different groups. In certain embodiments, terminal groups are offset with respect to adjacent groups to align with BIPV modules that are similarly offset to provide a moisture barrier. The interconnecting strip may be reconfigured in the field to provide different electrical connection schemes among BIPV modules.
摘要:
A method of making a semiconductor device includes providing a web substrate, forming a first semiconductor layer of a first conductivity type over the web substrate, forming a second semiconductor layer of a second conductivity type over a first side of the first semiconductor layer, forming a first electrode layer over the second semiconductor layer, forming a handle web substrate over the first electrode layer, delaminating the web substrate from the first semiconductor layer after the step of forming the handle web substrate, where at least one opening extends through the first and the second semiconductor layers, and forming a second electrode layer over a second side of the first semiconductor layer such that the first and second electrode layers are in electrical contact with each other.
摘要:
Building integrable photovoltaic (BIP) modules include photovoltaic inserts for producing electrical power and supporting structures for mechanically attaching and supporting the insert with respect to a building structure, such as roof tops. The supporting structures may include ventilation ribs that form ventilation channels under the photovoltaic insert and, in certain embodiments, under other components of the module. These ribs may be used to provide mechanical support to the entire module. In specific embodiments, ventilation channels of one module are configured to coincide with ventilation channels of one or more other like modules and to form a continuous channel along the roof edge. The supporting structures may be used to form moisture barriers in between two modules, such as side glitters. In certain embodiments, supporting structures are separate components and are attached to the insert to form a module during fabrication or installation of the module on a building structure.
摘要:
A method and apparatus for protecting a diode assembly of a photovoltaic module from compressive and tensile forces by providing at least one interior shielding element are provided. According to various embodiments, a photovoltaic module including a first encasing layer, a second encasing layer, at least one photovoltaic cell disposed between the first and second encasing layers, at least one shielded diode assembly disposed on the at least one photovoltaic cell and electrically connected to the at least one photovoltaic cell, and a pottant disposed between the at least one photovoltaic cell and the second encasing layer is provided. A localized shielding element may be used to shield the diode assembly.
摘要:
A combination photovoltaic and wind power generation installation comprising at least one wind turbine and a plurality of photovoltaic arrays, wherein the photovoltaic arrays may be disposed around the at least one wind turbine such that the photovoltaic arrays are at least partially shaded a portion of the day by the shadow cast by the at least one wind turbine. Photovoltaic modules that are resistant to shading effects may be used to minimize the effects of shading by the at least one wind turbine. The combination photovoltaic and wind power generation installation may transmit power through a single transmission line.
摘要:
Provided herein are methods and systems for scribing solar cell structures to create isolated solar cells. According to various embodiments, the methods involve scanning an excimer laser beam along a scribe line of a solar cell structure to ablate electrically active layers of the structure. A photomask having variable transmittance is disposed between the beam source and the solar cell structure. The transmittance is calibrated to produce variable fluence levels such that a stepped scribed profile is obtained. In certain embodiments, a front contact/absorber/back contact stack is removed along a portion of the scribe line, while a front contact/absorber stack is simultaneously removed along a parallel portion, with the back contact layer unremoved. In this manner, the scribe electrically isolates solar cells on either side of the scribe line, while providing a contact point to the back contact layer of one of the solar cells for subsequent cell-cell interconnection.
摘要:
Provided are photovoltaic module assemblies configured for improved installation. The assemblies include frameless photovoltaic modules and retainers for supporting the modules on mounting structures. The retainers support the modules at least during cure of adhesive materials provided between the modules and the mounting structures. Once cured, the adhesive materials provide permanent support to the modules. The retainers may interlock with the mounting structures during installation or be integral components of the structures. In certain embodiments, retainers are used to control a gap between the modules and mounting structures. Retainers may be removable and collected after installation is completed. Alternatively, retainers may remain as parts of assemblies at least during some initial period. Retainers may be made from various degradable materials, such as biodegradable plastics, UV degradable plastics, and/or water soluble materials. Provided also are methods for installing frameless photovoltaic modules on mounting structures.
摘要:
Provided herein are methods and systems for scribing solar cell structures to create isolated solar cells. According to various embodiments, the methods involve scanning an excimer laser beam along a scribe line of a solar cell structure to ablate electrically active layers of the structure. A photomask having variable transmittance is disposed between the beam source and the solar cell structure. The transmittance is calibrated to produce variable fluence levels such that a stepped scribed profile is obtained. In certain embodiments, a front contact/absorber/back contact stack is removed along a portion of the scribe line, while a front contact/absorber stack is simultaneously removed along a parallel portion, with the back contact layer unremoved. In this manner, the scribe electrically isolates solar cells on either side of the scribe line, while providing a contact point to the back contact layer of one of the solar cells for subsequent cell-cell interconnection.
摘要:
A solar cell includes a substrate, a first electrode located over the substrate, where the first electrode comprises a first transition metal layer, at least one p-type semiconductor absorber layer located over the first electrode, an n-type semiconductor layer located over the p-type semiconductor absorber layer, and a second electrode located over the n-type semiconductor layer. The first transition metal layer contains (i) an alkali element or an alkali compound and (ii) a lattice distortion element or a lattice distortion compound. The p-type semiconductor absorber layer includes a copper indium selenide (CIS) based alloy material.