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公开(公告)号：US20180328796A1
公开(公告)日：2018-11-15
申请号：US15775729
申请日：2016-11-09
申请人： DENSO CORPORATION
摘要： A diagnosis apparatus diagnoses an assembly state of an assembled component having a sliding portion. The diagnosis apparatus includes a sensor unit that detects a heat flux flowing from the sliding portion toward an outside, and a control apparatus that determines whether an assembly state of the assembled component is correct or not based on a detection result detected by the sensor unit. A magnitude of a heat flux from the sliding portion is different between when the assembly state of the assembled component having the sliding portion is correct and when it is incorrect. Hence, according to the diagnosis apparatus, it is possible to diagnose whether an assembly state of the assembled component is correct or not.
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公开(公告)号：US10038133B2
公开(公告)日：2018-07-31
申请号：US14975078
申请日：2015-12-18
发明人： Guillaume Savelli , Joël Dufourcq
摘要： Sensor including a substrate, an assembly of thermoelectric layers including at least one first and one second junction of a thermocouple, at least one first and one second connection pads arranged to transfer heat respectively to each first and each second junction, a support member (2) of the substrate (3) intended to be connected to the hot source (Sc) and to the cold source (Sf), first and second metal connectors arranged to electrically connect the support member (2) respectively to each first and each second connection pad, the support member (2) including a thermal conductor configured to transfer heat from the hot source (Sc) to the first metal connector, and to transfer heat from the second metal connector to the cold source (Sf).
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93.发明申请公开(公告)号：US20180143087A1
公开(公告)日：2018-05-24
申请号：US15571895
申请日：2016-04-20
申请人： DENSO CORPORATION
发明人： Norio GOUKO , Atusi SAKAIDA , Keiji OKAMOTO , Yoshihiko SHIRAISHI
摘要： According to a manufacturing method of a heat flux sensor, the heat flux sensor is sandwiched between a heater plate and a cooling unit. The heater plate is disposed on the first surface of the heat flux sensor, and the cooling unit is disposed on the second surface of the same. A heat radiation measurement plate is disposed on a surface of the heater plate opposite to the surface on which the heat flux sensor is disposed. According to this configuration, the temperature of the heater plate is controlled in an inspection process such that the heater plate is kept at an ambient temperature. This makes it possible to stabilize the temperature of the heater plate in a short time.
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公开(公告)号：US09823206B2
公开(公告)日：2017-11-21
申请号：US14331111
申请日：2014-07-14
发明人： Hyun Woo Lee , Jong Won Lee
摘要： An apparatus for measuring an overall heat transfer coefficient may include an external chamber provided using a heat insulation material and including an internal space, an internal chamber disposed in the external chamber and having an opening upper portion, a heat source supply to supply heat to an internal portion of the internal chamber, a cutoff portion disposed in the upper portion of the internal chamber to seal the internal chamber and prevent an outflow of heat emitted from the heat source supply, and a temperature measurement portion disposed in an internal portion and an external portion of the internal chamber to measure an internal temperature and an external temperature of the internal chamber, in which the cutoff portion may realize covering conditions indoors through a combination of a covering material and a thermal screen, and adjust the external temperature of the internal chamber.
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公开(公告)号：US20170299446A1
公开(公告)日：2017-10-19
申请号：US15636689
申请日：2017-06-29
IPC分类号： G01K17/20
CPC分类号： G01K17/20
摘要： An assessment system and method are described that capture indoor temperature measurements and corresponding outdoor temperature measurements in order to determine a thermal efficiency of a structure. The assessment system identifies quiescent periods and trims these periods to eliminate undesirable influences such as auxiliary heating or solar gain. The quiescent periods are then compared to outdoor temperature differences to determine the thermal efficiency of the structure. The system can model the structure's performance metrics, through inferred qualitative and quantitative characterizations including, but not limited to, the building's rate of temperature change as a function of internal and external temperatures, the building's heating, cooling, and other energy needs as they relate to the building envelope, appliances, and other products used at the site and occupant behavior.
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96.发明授权公开(公告)号：US09618402B2
公开(公告)日：2017-04-11
申请号：US14058603
申请日：2013-10-21
发明人： Jae Sung Kwon , Hyung Sung Kim , Jong Sung Park , Young Sung Jung
CPC分类号： G01K17/00 , F25D23/065 , G01K17/20
摘要： A thermal insulation performance measurement apparatus which measures thermal insulation performance of a thermal insulator by heat flux to the thermal insulator, measured by a heat flux sensor, and a measurement method using the same includes a heat flux sensor provided with one surface adapted to contact an object to be measured, a first heat source arranged on the upper surface of the heat flux sensor to supply heat to the heat flux sensor, a thermal insulator arranged on the upper surface of the first heat source, a third heat source arranged on the upper surface of the thermal insulator, and a second heat source arranged around the heat flux sensor.
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公开(公告)号：US20160313193A1
公开(公告)日：2016-10-27
申请号：US15103366
申请日：2014-12-12
申请人： OMRON CORPORATION
摘要： An internal temperature sensor includes substrates with one surface to be placed in contact with a measurement surface of an object to measure an internal temperature of the object, a heat flux sensor on another surface of the substrates, and a temperature sensor. The heat flux sensor is fabricated through a MEMS process and includes first and second temperature measurement parts, and a thin film including a thermopile to detect a temperature difference between the first and second temperature measurement parts. The thin film is supported by a thermally conductive member to form a space between the first temperature measurement part and the substrates and to extend parallel to the substrates. The thermally conductive member conducts heat traveling from the object through the substrates to the second temperature measurement part. The temperature sensor measures the temperature of a part of the substrates that is in contact with the thermally conductive member.
摘要翻译： 内部温度传感器包括具有一个表面的基板，该表面被放置成与物体的测量表面接触以测量物体的内部温度，在基板的另一表面上的热通量传感器和温度传感器。 热通量传感器通过MEMS工艺制造并且包括第一和第二温度测量部件，以及包括热电堆的薄膜，以检测第一和第二温度测量部件之间的温度差。 薄膜由导热构件支撑，以在第一温度测量部件和基板之间形成空间，并平行于基板延伸。 导热构件将从物体通过基板传导的热传导到第二温度测量部件。 温度传感器测量与导热部件接触的一部分基板的温度。
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公开(公告)号：US09461231B2
公开(公告)日：2016-10-04
申请号：US14974850
申请日：2015-12-18
发明人： Guillaume Savelli , Joël Dufourcq
摘要： This sensor (1) includes an assembly of thermoelectric layers, a support member (2) including at least one first and one second metallic connector pins (30, 31), first and second metal connectors arranged to electrically connect the support member (2) respectively to a first connection pad and a second connection pad, an external package (8) including a first surface (8a) and a second opposite surface (8b) intended to be respectively connected to a hot source and to a cold source, a first via (80) connecting the first surface (8a) to each first connector pin (30), a second via (81) connecting the second surface (8b) to each second connector pin (31), and the support member (2) includes thermal conductors between the connector pins (30, 31) and the metal connectors.
摘要翻译： 该传感器（1）包括热电层的组件，包括至少一个第一和第二金属连接器销（30,31）的支撑构件（2），布置成电连接支撑构件（2）的第一和第二金属连接器， 分别连接到第一连接焊盘和第二连接焊盘，包括旨在分别连接到热源和冷源的第一表面（8a）和第二相对表面（8b）的外部封装（8），第一 将第一表面（8a）连接到每个第一连接器销（30）的通孔（80），将第二表面（8b）连接到每个第二连接器销（31）的第二通孔（81），并且支撑构件 连接器插针（30,31）和金属连接器之间的热导体。
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99.发明授权公开(公告)号：US09316547B1
公开(公告)日：2016-04-19
申请号：US13914614
申请日：2013-06-10
摘要： A new method for determining heat transfer coefficient (h) and adiabatic effectiveness (η) waveforms h(t) and η(t) from a single test uses a novel inverse heat transfer methodology to use surface temperature histories obtained using prior art approaches to approximate the h(t) and η(t) waveforms. The method best curve fits the data to a pair of truncated Fourier series.
摘要翻译： 从单个测试中确定传热系数（h）和绝热效能（＆eegr）波形h（t）和（e）的新方法使用新的反向热传递方法来使用现有技术方法获得的表面温度历史 以近似h（t）和（e）（t）波形。 该方法最佳曲线将数据拟合成一对截取傅立叶级数。
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公开(公告)号：US20160011130A1
公开(公告)日：2016-01-14
申请号：US14331111
申请日：2014-07-14
发明人： Hyun Woo Lee , Jong Won Lee
摘要： An apparatus for measuring an overall heat transfer coefficient may include an external chamber provided using a heat insulation material and including an internal space, an internal chamber disposed in the external chamber and having an opening upper portion, a heat source supply to supply heat to an internal portion of the internal chamber, a cutoff portion disposed in the upper portion of the internal chamber to seal the internal chamber and prevent an outflow of heat emitted from the heat source supply, and a temperature measurement portion disposed in an internal portion and an external portion of the internal chamber to measure an internal temperature and an external temperature of the internal chamber, in which the cutoff portion may realize covering conditions indoors through a combination of a covering material and a thermal screen, and adjust the external temperature of the internal chamber.
摘要翻译： 用于测量总传热系数的装置可以包括使用隔热材料设置并包括内部空间的外部室，设置在外部室中的内部室，并且具有开口上部，供给热量的热源 所述内部室的内部部分设置在所述内部室的上部，以密封所述内部室并防止从所述热源供应源发出的热量的流出;以及设置在内部部分和外部的温度测量部分 内部室的部分，以测量内部室的内部温度和外部温度，其中截止部分可以通过覆盖材料和热屏蔽的组合在室内实现覆盖条件，并且调节内部室的外部温度 。
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