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公开(公告)号：US11069839B2
公开(公告)日：2021-07-20
申请号：US16738827
申请日：2020-01-09
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: Disclosed is an optical component package. The optical component package according to the present invention includes: a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a sub-substrate provided in a cavity of the main substrate, and electrically connected to each of the metal bodies with the vertical insulation part interposed therebetween; an optical component mounted on the sub-substrate; and a light transmitting member provided above the optical component, wherein the sub-substrate includes: an insulating body; a via hole vertically passing through the insulating body, and filled with a metal material; and a metal pad connected to the optical component.
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公开(公告)号：US20210199696A1
公开(公告)日：2021-07-01
申请号：US17131443
申请日：2020-12-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Tae Hwan SONG
Abstract: A method of manufacturing a probe card and a probe card manufactured using the same are disclosed. The method is configured to be capable of collectively attaching probes to a wiring board provided with a connection pad to which the probes are attached.
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公开(公告)号：US11049759B2
公开(公告)日：2021-06-29
申请号：US16447852
申请日：2019-06-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
IPC: H01L21/683 , H01L33/00 , B25J15/06
Abstract: The present invention relates to a micro LED transfer head transferring micro LEDs from a first substrate to a second substrate. According to the present invention, vacuum pressure of a grip region where the micro LEDs are gripped is uniformized, so that the micro LED transfer head transfers the micro LEDs efficiently. In addition, the vacuum pressure is distributed over a grip surface where the micro LEDs are gripped, thereby improving efficiency of transferring the micro LEDs.
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公开(公告)号：US20210116478A1
公开(公告)日：2021-04-22
申请号：US17038642
申请日：2020-09-30
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
Abstract: Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.
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公开(公告)号：US20200290150A1
公开(公告)日：2020-09-17
申请号：US16814865
申请日：2020-03-10
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN
IPC: B23K20/12 , C23C16/455 , H01L21/67
Abstract: The present invention relates to a joined component formed by friction stir welding and, more particularly, to a joined component formed in a structure in which no interface exists between flow paths formed therein.
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Patent Agency Ranking
公开(公告)号：US20200251373A1
公开(公告)日：2020-08-06
申请号：US16777794
申请日：2020-01-30
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L21/683 , H01L33/00 , H05K13/04
Abstract: The present invention relates to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head, in which the lowering position of the micro LED transfer head is limited.
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公开(公告)号：US10658549B2
公开(公告)日：2020-05-19
申请号：US16144857
申请日：2018-09-27
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.
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公开(公告)号：US20200065545A1
公开(公告)日：2020-02-27
申请号：US16546108
申请日：2019-08-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: G06K9/00 , H01L27/146
Abstract: Disclosed is a biometric sensor capable of reliably obtaining a biometric image optically. Further disclosed is a display device including the biometric sensor. The biometric sensor includes a photo-detector and an anodic oxide film. The anodic oxide film is provided with a through hole vertically extending through the anodic oxide film from an upper surface to a lower surface, having a larger width than pores formed in the anodic oxide film during anodic oxidation, and providing an optical path leading to the photo-detector.
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公开(公告)号：US20200013648A1
公开(公告)日：2020-01-09
申请号：US16459457
申请日：2019-07-01
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L21/67 , H01L21/683 , B65G47/91
Abstract: The present invention relates to a micro LED transfer head improving efficiency of transferring micro LEDs.
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公开(公告)号：US20200006110A1
公开(公告)日：2020-01-02
申请号：US16447852
申请日：2019-06-20
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo AHN , Seung Ho PARK , Sung Hyun BYUN
IPC: H01L21/683 , H01L33/00
Abstract: The present invention relates to a micro LED transfer head transferring micro LEDs from a first substrate to a second substrate. According to the present invention, vacuum pressure of a grip region where the micro LEDs are gripped is uniformized, so that the micro LED transfer head transfers the micro LEDs efficiently. In addition, the vacuum pressure is distributed over a grip surface where the micro LEDs are gripped, thereby improving efficiency of transferring the micro LEDs.
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