公开(公告)号：US20100224551A1

公开(公告)日：2010-09-09

申请号：US12553459

申请日：2009-09-03

申请人： Kazuya Hongo ,  Hiroshi Kojima ,  Tetsuo Ohta ,  Seiichi Takagi

发明人： Kazuya Hongo ,  Hiroshi Kojima ,  Tetsuo Ohta ,  Seiichi Takagi

IPC分类号： B01D35/30

CPC分类号： B01D63/087 ,  B01D2325/021 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2200/0647 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0877

摘要： A micro fluidic device includes a separation membrane that has an upper surface and a lower surface opposing to each other and a side surface; a plurality of base materials that sandwiches the separation membrane; a first channel and a second channel that are partitioned from each other by the separation membrane; a first feed port that is connected to the first channel; and a first discharge port that is connected to the second channel, wherein the first channel comes into contact with at least a part of the upper surface and the lower surface of the separation membrane, the second channel comes into contact with at least a part of the side surface of the separation membrane, and a fluid is movable in a surface direction within the separation membrane.

摘要翻译： 微流体装置包括分离膜，其具有彼此相对的上表面和下表面以及侧表面; 夹持分离膜的多个基材; 通过分离膜彼此分隔的第一通道和第二通道; 连接到第一通道的第一进料口; 以及连接到第二通道的第一排出口，其中第一通道与分离膜的上表面和下表面的至少一部分接触，第二通道与至少一部分 分离膜的侧表面和流体可以在分离膜内沿表面方向移动。

公开(公告)号：US20070259605A1

公开(公告)日：2007-11-08

申请号：US11779441

申请日：2007-07-18

申请人： Koji OTSUKA ,  Masabumi Ito ,  Hiroshi Kojima

发明人： Koji OTSUKA ,  Masabumi Ito ,  Hiroshi Kojima

IPC分类号： B24B49/00 ,  B24B7/30

CPC分类号： C03C15/02 ,  C03C19/00 ,  C03C2204/08

摘要： A process for polishing a glass substrate, which enables to polish a glass substrate having a large waviness formed by mechanical polishing, to have a surface excellent in flatness, is provided. A process for polishing a glass substrate, comprising a step of measuring the surface profile of a mechanically polished glass substrate to identify the width of waviness present in the glass substrate, and a step of applying dry etching using a beam having a beam size in FWHM (full width of half maximum) value of at most the above size of waviness, to polish the surface of the glass substrate.

摘要翻译： 提供了一种用于抛光玻璃基板的方法，该玻璃基板能够研磨通过机械抛光形成的具有大波纹度的玻璃基板以具有优异的平面度的表面。 一种用于抛光玻璃基板的方法，包括测量机械抛光的玻璃基板的表面轮廓以识别玻璃基板中存在的波纹宽度的步骤，以及使用在FWHM中具有光束尺寸的光束进行干蚀刻的步骤 （全宽半高）值至多为上述大小的波纹，以研磨玻璃基板的表面。

公开(公告)号：US07224226B2

公开(公告)日：2007-05-29

申请号：US11212310

申请日：2005-08-26

申请人： Hiroshi Kojima ,  Yuki Kiri

发明人： Hiroshi Kojima ,  Yuki Kiri

IPC分类号： H03F3/45

CPC分类号： H03F1/34 ,  H03F3/14 ,  H03F3/45183 ,  H03F3/45475

摘要： An amplifying device comprising a first terminal to which an alternating signal is inputted; a second terminal connected via an external first resistor to a power supply line; a third terminal to be grounded; a second resistor provided on a signal line in between the second terminal and the third terminal; a differential amplifier, the alternating signal of which being inputted through the first terminal to one input terminal and an output according to the alternating signal being fed back to the other input terminal via a signal line in between the second terminal and the second resistor, and between the one input terminal and the other input terminal, a positive offset voltage higher than a maximum level of the alternating signal being produced in advance; and a third resistor provided between a signal line joining the first terminal and the one input terminal, and a signal line leading to the third terminal. A voltage waveform of the alternating signal that has been amplified on the basis of the resistances of the first and second resistors is produced at the second terminal.

摘要翻译： 一种放大装置，包括：输入交流信号的第一端子; 经由外部第一电阻器连接到电源线的第二端子; 要接地的第三个终端; 设置在第二端子和第三端子之间的信号线上的第二电阻器; 差分放大器，其交流信号通过第一端子输入到一个输入端子，并且根据交流信号的输出端经由第二端子和第二电阻器之间的信号线反馈到另一输入端子，以及 在一个输入端子和另一个输入端子之间，预先产生高于交变信号的最大电平的正偏移电压; 以及设置在连接第一端子和一个输入端子的信号线之间的第三电阻器，以及通向第三端子的信号线。 在第二端子处产生基于第一和第二电阻器的电阻放大的交变信号的电压波形。

公开(公告)号：US20070059608A1

公开(公告)日：2007-03-15

申请号：US11222979

申请日：2005-09-12

申请人： Yoshiaki Ikuta ,  Hiroshi Kojima ,  Kouji Otsuka

发明人： Yoshiaki Ikuta ,  Hiroshi Kojima ,  Kouji Otsuka

IPC分类号： G03B27/62 ,  G06F17/50 ,  G03F1/00

CPC分类号： G03F7/707 ,  G03F1/60 ,  G03F7/703 ,  G03F7/70783

摘要： A photomask is manufactured by a method including providing a substrate having a surface on which a predetermined pattern is to be formed, positioning the substrate in an exposure tool so as to obtain an amount of deformation of the surface due to an external force imposed on the substrate, calculating a target profile of the surface, based on the amount of deformation and a target flatness of the surface, and processing the surface of the substrate so as to make the surface substantially flat when the substrate is positioned in the exposure tool.

摘要翻译： 通过包括提供具有要在其上形成预定图案的表面的基板的方法制造光掩模，将基板定位在曝光工具中，以便获得由于施加在其上的外力而导致的表面的变形量 基板，基于所述表面的变形量和目标平面度来计算所述表面的目标轮廓，以及当所述基板位于所述曝光工具中时，对所述基板的表面进行处理，以使所述表面基本上平坦。

公开(公告)号：US20050233132A1

公开(公告)日：2005-10-20

申请号：US10519796

申请日：2003-08-06

申请人： Hiroshi Kojima

发明人： Hiroshi Kojima

IPC分类号： H05K9/00 ,  B32B5/16

CPC分类号： H05K9/0096 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T442/109 ,  Y10T442/11 ,  Y10T442/112

摘要： Blackened layers 23A and 23B are formed by depositing Cu—Co alloy particles on the surfaces of a metal layer 21. The metal layer 21 coated with the blackened layers 23A and 23B of the Cu—Co alloy particles is subjected to a chromating process to form density-intensifying layers 25A and 25B on the blackened layers 23A and 23B. A base 11 is laminated to the density-intensifying layer 25A or 25B. A conductive structure 109 consisting of the meal layer 21, the blackened layers 23A and 23B, and the density-intensifying layers 25A and 25B is processed by a photolithographic process to complete an electromagnetic shielding sheet 1 having a mesh conductive structure.

摘要翻译： 通过在金属层21的表面上沉积Cu-Co合金颗粒而形成钝化层23A和23B。 对涂覆有Cu-Co合金颗粒的黑化层23A和23B的金属层21进行铬酸盐化处理，以在黑化层23A和23B上形成增强强化层25A和25B。 11层压到增密层25A或25B。由餐层21，黑化层23A和23B以及增强密度层25A和25B组成的导电结构109由 光刻工艺完成具有网状导电结构的电磁屏蔽片1。

公开(公告)号：US06771112B1

公开(公告)日：2004-08-03

申请号：US09552085

申请日：2000-02-24

申请人： Tsutomu Ishikawa ,  Hiroshi Kojima

发明人： Tsutomu Ishikawa ,  Hiroshi Kojima

IPC分类号： H03K17687

CPC分类号： H01L27/098 ,  H01L21/761 ,  H01L27/0635 ,  H01L29/808 ,  H03F1/14

摘要： An integrated semiconductor device is provided that has pads with less input signal attenuation. When J-FET (2) is driven by an input signal, the current passing through it varies. The parasitic capacitance (4) is charged or discharged by the input/output signal of the buffer circuit (6) following the varying current. Thus, since the voltage across the parasitic capacitance (3) varies in phase and at the same level, the parasitic capacitance (3) can be ignored. This effect allows attenuation of an input signal due to the parasitic capacitance (3) to be prevented.

摘要翻译： 提供了具有较少输入信号衰减的焊盘的集成半导体器件。 当J-FET（2）由输入信号驱动时，通过它的电流变化。 寄生电容（4）由跟随变化电流的缓冲电路（6）的输入/输出信号充电或放电。 因此，由于寄生电容（3）两端的电压在相位和相同的电平上变化，寄生电容（3）可以被忽略。 该效果允许由于寄生电容（3）而导致的输入信号的衰减被阻止。

公开(公告)号：US06746312B2

公开(公告)日：2004-06-08

申请号：US09864229

申请日：2001-05-25

申请人： Hiroomi Torii ,  Hiroshi Kojima ,  Suguru Ogura ,  Soichi Isobe

发明人： Hiroomi Torii ,  Hiroshi Kojima ,  Suguru Ogura ,  Soichi Isobe

IPC分类号： B24B100

CPC分类号： B24B37/042 ,  B24B49/00

摘要： The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid is supplied onto a polishing cloth attached on a turntable, and a semiconductor wafer to be polished is held by a top ring. The turntable and the top ring are rotated, respectively. A surface, to be polished, of the semiconductor wafer held by the top ring is pressed against the polishing cloth on the turntable to polish the semiconductor wafer. When a polished semiconductor wafer held by the top ring is to be removed from the polishing cloth on the turntable, a relative speed of the turntable and the top ring is increased as compared with a relative speed of the turntable and the top ring at a period of polishing.

摘要翻译： 本发明涉及一种将诸如半导体晶片的工件抛光成平面镜面抛光的抛光方法和装置。 抛光液被供给到安装在转盘上的抛光布上，被抛光的半导体晶片由顶环保持。 转盘和顶环分别旋转。 由顶环保持的半导体晶片的待抛光表面被压在转台上的抛光布上以抛光半导体晶片。 当由顶环保持的经抛光的半导体晶片从转台上的研磨布上取出时，转盘和顶环的相对速度与转盘和顶环的相对速度相比在一段时间内增加 的抛光。

公开(公告)号：US06677837B2

公开(公告)日：2004-01-13

申请号：US10193642

申请日：2002-07-11

申请人： Hiroshi Kojima ,  Hiroyuki Katoh ,  Meiji Miyashita ,  Kazuhisa Sano

发明人： Hiroshi Kojima ,  Hiroyuki Katoh ,  Meiji Miyashita ,  Kazuhisa Sano

IPC分类号： H01P120

CPC分类号： H01P1/2088

摘要： The present invention provides a dielectric waveguide filter comprising a plurality of dielectric waveguide resonators in the form of rectangular parallelepiped-shaped blocks aligned as a single main body having opposite ends defined by respective the end blocks located thereat, and a pair of input and output electrodes provided in the end blocks, respectively. Each of the end blocks is formed with a protruding portion including a dielectric substance extended from that therein. A conductive strip line extending from the bottom surface of corresponding one of the end blocks to the edge region of the bottom surface of corresponding one of the protruding portions. The bottom surfaces have a region where the dielectric substance in contact with the both sides of the conductive strip line is exposed to outside. The conductive strip lines are coupled with micro-strip lines or co-planer lines on a printed circuit board having a given length to obtain an adequate matching between input and output signals.

摘要翻译： 本发明提供了一种电介质波导滤波器，包括多个矩形平行六面体形状的电介质波导谐振器，该谐振器被排列为单个主体，该相对端由位于其上的端部块限定，并且一对输入和输出电极 分别设置在端块中。 每个端块形成有包括从其延伸的电介质的突出部分。 导电带状线，其从相应的一个端块的底表面延伸到相应的一个突出部分的底表面的边缘区域。 底表面具有与导电带状线的两侧接触的电介质被暴露在外部的区域。 导电带线与具有给定长度的印刷电路板上的微带线或共平面线连接以获得输入和输出信号之间的充分匹配。

公开(公告)号：US06464213B1

公开(公告)日：2002-10-15

申请号：US09466876

申请日：1999-12-20

申请人： Hiroshi Kojima

发明人： Hiroshi Kojima

IPC分类号： F16F500

CPC分类号： F16F15/03 ,  F16F13/00 ,  F16F13/264

摘要： In the vibration isolating apparatus of the present invention, a controller provides drive current to an electromagnet when shaking vibration is being generated. This causes an intermediate plate to be attracted to the electromagnet thereby preventing elastic deformation of a first elastic piece caused by load transmitted from a top plate. Therefore, the static spring constant of an elastic body can be made larger than when the electromagnet is not being operated. Furthermore, the controller shuts off the supply of drive current to the electromagnet when idling vibration is being generated. This causes the intermediate plate to move away from the electromagnet thereby enabling elastic deformation of the first elastic piece cause by the load transmitted from the top plate. Therefore, the static spring constant of the elastic body can be made smaller than when the electromagnet is operated. The result of this is that, according to the vibration isolating apparatus of the present invention, the static spring constant of an elastic body to counter vertical load and the static spring constant of an elastic body to counter shear load can both be adjusted to optimum values in accordance with the characteristics of the input vibration.

摘要翻译： 在本发明的防振装置中，当振动产生振动时，控制器向电磁铁提供驱动电流。 这导致中间板被吸引到电磁体，从而防止由顶板传递的负载引起的第一弹性片的弹性变形。 因此，可以使弹性体的静态弹簧常数大于电磁体未被操作时的静态弹簧常数。 此外，当产生怠速振动时，控制器关闭向电磁铁供给的驱动电流。 这使得中间板离开电磁体，由此能够使由第一弹性片发生的载荷产生弹性变形。 因此，可以使弹性体的静态弹簧常数小于电磁铁操作时的静态弹簧常数。 其结果是，根据本发明的防振装置，弹性体的抗垂直载荷的静态弹簧常数和弹性体的抗剪切载荷的静态弹簧常数都可以调节到最佳值 按照输入振动的特点。

公开(公告)号：US06216309B1

公开(公告)日：2001-04-17

申请号：US09190058

申请日：1998-11-12

申请人： Masami Goto ,  Toshio Kobayashi ,  Hiroshi Ohsaki ,  Hiroshi Kojima ,  Masaaki Shimuba

发明人： Masami Goto ,  Toshio Kobayashi ,  Hiroshi Ohsaki ,  Hiroshi Kojima ,  Masaaki Shimuba

IPC分类号： B60S106

CPC分类号： B60S1/0402 ,  B60S1/0433 ,  B60S1/0488 ,  Y10S248/90 ,  Y10S403/03

摘要： A wiper device for a vehicle disclosed is provided with a wiper motor, a wiper pivot connected to the wiper motor, and a wiper frame in which the wiper pivot is arranged. In this case, the wiper pivot can rotate around the pivot axis thereof by using a drive force from the wiper motor, and the wiper pivot extends so as to project toward an outer side of the vehicle body. Further, the wiper frame has a bracket portion fixing the wiper frame to the vehicle body. Then, in the structure mentioned above, it is constructed in such a manner that the bracket portion of the wiper frame is released from the vehicle body so as to move the wiper pivot to an inner side of the vehicle body when a load equal to or more than a predetermined value acts on the wiper pivot.

摘要翻译： 用于车辆的刮水器装置设置有刮水器马达，连接到刮水器马达的刮水器枢轴和布置刮水器枢轴的刮水器框架。 在这种情况下，刮水器枢轴可以通过使用来自刮水器马达的驱动力绕其枢转轴线旋转，并且刮水器枢轴延伸以朝向车体的外侧突出。 此外，刮水器框架具有将刮水器框架固定到车身的托架部。 然后，在上述结构中，其构造为使得擦拭器框架的支架部分从车身释放，以便当与...相同的载荷时将刮水器枢轴移动到车体的内侧， 超过预定值作用在刮水器枢轴上。