Multilayer ceramic capacitor
    101.
    发明授权

    公开(公告)号:US11670451B2

    公开(公告)日:2023-06-06

    申请号:US17675313

    申请日:2022-02-18

    IPC分类号: H01G4/01 H01G4/12

    CPC分类号: H01G4/01 H01G4/1227

    摘要: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminated in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.

    CAPACITOR COMPONENT
    102.
    发明申请

    公开(公告)号:US20230030737A1

    公开(公告)日:2023-02-02

    申请号:US17966118

    申请日:2022-10-14

    摘要: A capacitor component includes a body having a lamination portion in which first internal electrodes and second internal electrodes are alternately disposed to face each other in a first direction with dielectric layers disposed therebetween, and first and second margin portions disposed on respective opposing sides of the lamination portion in a second direction perpendicular to the first direction. First and second external electrodes are disposed on respective opposing sides of the body in a third direction and are electrically connected to the first and second internal electrodes, respectively. Each of the first and second margin portions includes a reinforcing pattern.

    Multi-layered ceramic electronic component and manufacturing method thereof

    公开(公告)号:US11569034B2

    公开(公告)日:2023-01-31

    申请号:US17464150

    申请日:2021-09-01

    摘要: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes disposed to face each other and a dielectric layer interposed therebetween. When an average thickness of the dielectric layer is denoted as ‘td,’ an average thickness of the first and second internal electrodes is denoted as ‘te,’ and a standard deviation of thicknesses of an internal electrode, measured at a plurality of points in a predetermined region of the internal electrode, is denoted as ‘σte,’ a ratio of the standard deviation of thicknesses of the internal electrode to the average thickness of the dielectric layer, which is denoted as ‘σte/td,’ satisfies 0.12≤σte/td≤0.21.

    Multilayer capacitor and board having the same mounted thereon

    公开(公告)号:US11309132B2

    公开(公告)日:2022-04-19

    申请号:US16858827

    申请日:2020-04-27

    摘要: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

    CAPACITOR COMPONENT
    106.
    发明申请

    公开(公告)号:US20220037089A1

    公开(公告)日:2022-02-03

    申请号:US17503832

    申请日:2021-10-18

    摘要: A capacitor component includes a body including a layered portion having alternately stacked first and second internal electrodes laminated with dielectric layers interposed therebetween in a first direction, and first and second connecting portions disposed on two opposing surfaces of the layered portion, respectively, in a second direction perpendicular to the first direction and electrically connected to the first and second internal electrodes, respectively. The first and second connecting portions each include a metal layer disposed on the layered portion, a ceramic layer disposed on the metal layer, and an exposed portion penetrating through the ceramic layer to be in contact with the metal layer.

    ELECTRONIC COMPONENT
    107.
    发明申请

    公开(公告)号:US20220005646A1

    公开(公告)日:2022-01-06

    申请号:US17482051

    申请日:2021-09-22

    摘要: An electronic component includes a capacitor body including a dielectric layer and first and second internal electrodes, and a first to sixth surfaces, the first and the second internal electrodes being exposed through the third and the fourth surfaces, respectively; first and second external electrodes respectively extending from the third and fourth surfaces of the body to a portion of the first surface and respectively connected to the first and second internal electrodes; a shielding layer comprising a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth and sixth surfaces of the capacitor body; and an insulating layer disposed between the capacitor body and the shielding layer. A lower portion of the capacitor body is exposed from the insulating layer and the shielding layer.

    Electronic component with SA/BW ratio and board having the same mounted thereon

    公开(公告)号:US11166376B2

    公开(公告)日:2021-11-02

    申请号:US16846806

    申请日:2020-04-13

    摘要: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.

    Multilayer ceramic electronic component

    公开(公告)号:US11081281B2

    公开(公告)日:2021-08-03

    申请号:US16202053

    申请日:2018-11-27

    IPC分类号: H01G4/30 H01G4/12 H01G4/008

    摘要: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween, and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrodes include electrode layers electrically connected to the internal electrodes and conductive resin layers disposed on the electrode layers, and the conductive layers are disposed to extend first and second surfaces of the ceramic body. When a distance from an outer edge of one of the first or second external electrodes disposed on a first or second surface to an inner edge thereof is defined as BW and surface roughness of the ceramic body is defined as Ra, a ratio of 100 times the surface roughness Ra to the distance BW (Ra*100/BW) satisfies (Ra*100/BW)≤1.0.