Modular force sensor
    111.
    发明授权
    Modular force sensor 有权
    模块式力传感器

    公开(公告)号:US08281670B2

    公开(公告)日:2012-10-09

    申请号:US12793014

    申请日:2010-06-03

    Abstract: A modular force sensor apparatus, method, and system are provided to improve force and torque sensing and feedback to the surgeon performing a telerobotic surgery. In one embodiment, a modular force sensor includes a tube portion including a plurality of strain gauges, a proximal tube portion for operably coupling to a shaft of a surgical instrument that may be operably coupled to a manipulator arm of a robotic surgical system, and a distal tube portion for proximally coupling to a wrist joint coupled to an end portion.

    Abstract translation: 提供了一种模块式力传感器装置,方法和系统,以改善对外科医生执行远程外科手术的力和转矩检测和反馈。 在一个实施例中,模块化力传感器包括包括多个应变计的管部分,用于可操作地联接到外科器械的轴的近侧管部分,其可操作地联接到机器人手术系统的操纵臂,以及 用于向近侧联接到联接到端部的腕关节的远端管部分。

    RADIATION HARDENED BIPOLAR INJUNCTION TRANSISTOR
    114.
    发明申请
    RADIATION HARDENED BIPOLAR INJUNCTION TRANSISTOR 有权
    辐射硬化双极性介电晶体管

    公开(公告)号:US20120168909A1

    公开(公告)日:2012-07-05

    申请号:US13334087

    申请日:2011-12-22

    CPC classification number: H01L29/402 H01L29/66272 H01L29/7322

    Abstract: A method for integrating a bipolar injunction transistor in a semiconductor chip includes the steps of forming an intrinsic base region of a second type of conductivity extending in the collector region from a main surface through an intrinsic base window of the sacrificial insulating layer, forming an emitter region of the first type of conductivity extending in the intrinsic base region from the main surface through an emitter window of the sacrificial insulating layer, removing the sacrificial insulating layer, forming an intermediate insulating layer on the main surface, and forming an extrinsic base region of the second type of conductivity extending in the intrinsic base region from the main surface through an extrinsic base window of the intermediate insulating layer

    Abstract translation: 一种用于在半导体芯片中积分双极性抑制晶体管的方法包括以下步骤:在主表面通过牺牲绝缘层的本征基极窗形成在集电极区域中延伸的第二类型导电的本征基极区域,形成发射极 所述第一类型的导电性区域从所述主表面延伸穿过所述牺牲绝缘层的发射极窗口,去除所述牺牲绝缘层,在所述主表面上形成中间绝缘层,以及形成所述牺牲绝缘层的外部基极区域 该第二类型的导电性在本征基区中从主表面穿过中间绝缘层的非本征基窗延伸

    Scalable language infrastructure for electronic system level tools
    117.
    发明授权
    Scalable language infrastructure for electronic system level tools 失效
    电子系统级工具的可扩展语言基础设施

    公开(公告)号:US08104016B2

    公开(公告)日:2012-01-24

    申请号:US11356578

    申请日:2006-02-17

    CPC classification number: G06F8/36

    Abstract: Systems and methods of scalable language infrastructure for electronic system level tools. In accordance with embodiments of the present invention, knowledge about types, functions and the like is encapsulated in a plurality of intelligent components called active component extension modules that are external to the infrastructure. The infrastructure implements a communication mechanism between the clients and these intelligent components, and acts as a common backbone. The infrastructure itself does not maintain any knowledge about any client, types, functions, etc. In accordance with a method embodiment of the present invention, a request is received from a client of a language infrastructure. The request is forwarded from the language infrastructure to an active component extension module. The active component extension module performs a service responsive to the request.

    Abstract translation: 用于电子系统级工具的可扩展语言基础设施的系统和方法。 根据本发明的实施例,关于类型,功能等的知识被封装在被称为活动组件扩展模块的多个智能组件中,该组件在基础设施外部。 基础架构实现了客户端和这些智能组件之间的通信机制,并且作为通用骨干网。 基础设施本身并不保持关于任何客户端,类型,功能等的任何知识。根据本发明的方法实施例,从语言基础设施的客户端接收请求。 该请求从语言基础设施转发到活动组件扩展模块。 活动组件扩展模块响应于该请求执行服务。

    Methods of manufacturing printed circuit boards
    120.
    发明授权
    Methods of manufacturing printed circuit boards 有权
    制造印刷电路板的方法

    公开(公告)号:US08020292B1

    公开(公告)日:2011-09-20

    申请号:US12772086

    申请日:2010-04-30

    Abstract: Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including at least one metal layer, providing a plurality of one-metal layer carriers after parallel processing each of the plurality of one-metal layer carriers, and attaching at least two of the plurality of one-metal layer carriers with each other and with the core subassembly.

    Abstract translation: 提供了使用并行处理来与子组件互连的印刷电路板的制造方法。 在一个实施例中,本发明涉及一种制造印刷电路板的方法,其包括提供包括至少一个金属层的芯子组件,在并行处理多个单金属层载体中的每一个之后提供多个单金属层载体 并且将所述多个一金属层载体中的至少两个彼此并且与所述芯子组件相连。

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