公开(公告)号：US20150295203A1

公开(公告)日：2015-10-15

申请号：US14689351

申请日：2015-04-17

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei YAMAZAKI ,  Satoshi SEO ,  Hideto OHNUMA ,  Hajime KIMURA ,  Yasuhiro JINBO

IPC: H01L51/52 ,  G02F1/1368 ,  G02F1/1335 ,  G02F1/1339 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5246 ,  G02F1/133514 ,  G02F1/133603 ,  G02F1/1339 ,  G02F1/1368 ,  H01L27/322 ,  H01L27/3246 ,  H01L51/0096 ,  H01L51/524 ,  H01L51/5253 ,  H01L2251/5315

Abstract: A highly reliable light-emitting module or light-emitting device is provided. A method for manufacturing a highly reliable light-emitting module is provided. The light-emitting module includes, between a first substrate and a second substrate, a first electrode provided over the first substrate, a second electrode provided over the first electrode with a layer containing a light-emitting organic compound interposed therebetween, and a sacrifice layer formed using a liquid material provided over the second electrode.

Abstract translation: 提供了高度可靠的发光模块或发光装置。 提供一种用于制造高度可靠的发光模块的方法。 发光模块在第一基板和第二基板之间包括设置在第一基板上的第一电极，设置在第一电极上的第二电极，其间插入有发光有机化合物的层，牺牲层 使用设置在第二电极上的液体材料形成。

公开(公告)号：US20150233557A1

公开(公告)日：2015-08-20

申请号：US14618131

申请日：2015-02-10

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tomoya AOYAMA ,  Yasuhiro JINBO ,  Yoshiharu HIRAKATA ,  Shunpei YAMAZAKI

IPC: F21V21/14 ,  F21L4/00 ,  H05B37/02 ,  F21S9/02 ,  F21S4/00

CPC classification number: F21L4/00 ,  F21S4/22 ,  F21V15/015 ,  F21V21/145 ,  F21W2121/00 ,  F21Y2105/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  F21Y2115/20 ,  H05B37/0272

Abstract: An object of this invention is to provide a highly portable light-emitting device or a highly browsable light-emitting device. The light-emitting device includes a joint portion, and a plurality of light-emitting units apart from each other with the joint portion positioned therebetween. The joint portion and the light-emitting units are flexible. The joint portion can be bent to a curvature radius smaller than a curvature radius to which the light-emitting unit can be bent. The light-emitting unit is supplied with a signal through a side not adjacent to the joint portion or is supplied with a signal by wireless communication.

Abstract translation: 本发明的目的是提供一种高度便携式的发光装置或高度可浏览的发光装置。 发光装置包括接合部分和多个彼此分开的发光单元，其中接合部分位于它们之间。 接合部和发光单元是柔性的。 可以将接合部弯曲成比发光单元弯曲的曲率半径小的曲率半径。 发光单元通过不与接合部分相邻的一侧提供信号，或者通过无线通信被提供信号。

公开(公告)号：US20150059987A1

公开(公告)日：2015-03-05

申请号：US14468662

申请日：2014-08-26

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Kayo KUMAKURA ,  Tomoya AOYAMA ,  Akihiro CHIDA ,  Kohei YOKOYAMA ,  Masakatsu OHNO ,  Satoru IDOJIRI ,  Hisao IKEDA ,  Hiroki ADACHI ,  Yoshiharu HIRAKATA ,  Shingo EGUCHI ,  Yasuhiro JINBO

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B26D1/04 ,  B26D2001/006 ,  B32B38/10 ,  B32B2457/00 ,  G02B6/00 ,  H01L21/67092 ,  H01L27/1248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L51/56 ,  H01L2221/68327 ,  H01L2227/323 ,  H01L2251/5338 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract translation: 提供堆叠的处理装置。 堆叠包括彼此附接的两个基板，其间隙设置在它们的端部之间。 处理装置包括：固定机构，其固定堆叠的一部分;多个吸附夹具，其固定堆叠的一个基板的外周边缘;以及楔形夹具，其插入到堆叠的角部。 多个吸附夹具包括允许吸附夹具在垂直方向和水平方向上分开移动的机构。 处理装置还包括传感器，其感测堆叠中的端部之间的间隙的位置。 楔形夹具的尖端沿着形成在堆叠的端表面上的倒角移动。 楔形夹具插入到堆叠中的端部之间的间隙中。

公开(公告)号：US20140087543A1

公开(公告)日：2014-03-27

申请号：US14097793

申请日：2013-12-05

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yasuhiro JINBO ,  Hironobu SHOJI ,  Hideto OHNUMA ,  Shunpei YAMAZAKI

IPC: H01L21/84

CPC classification number: H01L21/84 ,  H01L21/26506 ,  H01L21/76254

Abstract: It is an object of the present invention to provide a method for manufacturing an SOI substrate having an SOI layer that can be used in practical applications with high yield even when a flexible substrate such as a glass substrate or a plastic substrate is used. Further, it is another object of the present invention to provide a method for manufacturing a thin semiconductor device using such an SOI substrate with high yield. When a single-crystal semiconductor substrate is bonded to a flexible substrate having an insulating surface and the single-crystal semiconductor substrate is separated to manufacture an SOI substrate, one or both of bonding surfaces are activated, and then the flexible substrate having an insulating surface and the single-crystal semiconductor substrate are attached to each other.

Abstract translation: 本发明的目的是提供一种制造具有SOI层的SOI衬底的方法，该SOI衬底即使在使用诸如玻璃衬底或塑料衬底的柔性衬底时，也可以在实际应用中以高产率使用。 此外，本发明的另一个目的是提供一种以高产率制造使用这种SOI衬底的薄半导体器件的方法。 当将单晶半导体衬底接合到具有绝缘表面的柔性衬底并且分离单晶半导体衬底以制造SOI衬底时，一个或两个键合表面被激活，然后柔性衬底具有绝缘表面 并且单晶半导体衬底彼此附接。