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公开(公告)号：US20200266145A1
公开(公告)日：2020-08-20
申请号：US16866255
申请日：2020-05-04
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Paul Merle Emerson , Benjamin Stassen Cook
IPC: H01L23/525 , H01L23/64 , H01L21/288 , H01L21/78 , H01L21/66 , H01L49/02
Abstract: A first conductive routing structure is electrically connected to a first electronic component. A second conductive routing structure is electrically connected to a second electronic component. An additive deposition process deposits a material over a surface of a processed wafer to form a conductive or resistive structure, which extends from a portion of the first conductive routing structure to a portion of the second conductive routing structure, to configure a circuit including the first and second electronic components.
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公开(公告)号：US10748999B2
公开(公告)日：2020-08-18
申请号：US16229827
申请日：2018-12-21
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Benjamin Stassen Cook , Luigi Colombo , Nazila Dadvand , Archana Venugopal
IPC: H01L29/15 , H01L29/16 , H01L29/423 , H01L29/808 , H01L29/66
Abstract: A switchable array micro-lattice comprises a plurality of interconnected units wherein the units are formed of graphene tubes. JFET gates are provided in selected members of the micro-lattice. Gate connectors are routed from an external surface of an integrated circuit (IC) through openings in the micro-lattice to permit control of the JFET gates.
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公开(公告)号：US20200235786A1
公开(公告)日：2020-07-23
申请号：US16844861
申请日：2020-04-09
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Mark William Morgan , Swaminathan Sankaran , Benjamin Stassen Cook , Ali Djabbari , Lutz Albrecht Naumann
Abstract: A removable module includes circuitry, a near field communication (NFC) coupler to provide a data signal to the circuitry, and a second NFC coupler to supply operating voltage to the circuitry.
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公开(公告)号：US20200141800A1
公开(公告)日：2020-05-07
申请号：US16715531
申请日：2019-12-16
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Benjamin Stassen Cook , Daniel Lee Revier
IPC: G01J3/02 , G01J3/12 , G01N21/3581 , G02B6/122
Abstract: On an integrated circuit (IC) die, sensors are configured to receive electromagnetic energy and to generate signals in response to the electromagnetic energy. An encapsulation material encapsulates the IC die and the sensors. A filter structure includes a diffusion of particles within the encapsulation material. The filter structure includes: a first region configured to pass a first band of the electromagnetic energy to the sensors or to block the first band of the electromagnetic energy from passing to the sensors; and a second region configured to pass a second band of the electromagnetic energy to the sensors or to block the second band of the electromagnetic energy from passing to the sensors. The encapsulation material has a first intrinsic property, and the particles have a second intrinsic property that is different from the first intrinsic property.
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公开(公告)号：US10557754B2
公开(公告)日：2020-02-11
申请号：US15800009
申请日：2017-10-31
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Daniel Lee Revier
IPC: H01L21/00 , G01J3/02 , G02B6/122 , G01N21/3581 , G01J3/12
Abstract: An encapsulated package is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. A set of broadband spectral sensors on the IC die are configured to generate a set of signals in response to electromagnetic energy received by the spectral sensors. A photonic filter structure within the encapsulation material is positioned adjacent the set of spectral sensors. The photonic filter structure is configured to pass a different frequency band of electromagnetic energy to each of the set of spectral sensors.
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Patent Agency Ranking
公开(公告)号：US10544039B2
公开(公告)日：2020-01-28
申请号：US15698706
申请日：2017-09-08
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Benjamin Stassen Cook , Kurt Wachtler , Adam Joseph Fruehling , Juan Alejandro Herbsommer , Simon Joshua Jacobs
Abstract: Methods for depositing a measured amount of a species in a sealed cavity. In one example, a method for depositing molecules in a sealed cavity includes depositing a selected number of microcapsules in a cavity. Each of the microcapsules contains a predetermined amount of a first fluid. The cavity is sealed after the microcapsules are deposited. After the cavity is sealed the microcapsules are ruptured to release molecules of the first fluid into the cavity.
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公开(公告)号：US20190279955A1
公开(公告)日：2019-09-12
申请号：US15914761
申请日：2018-03-07
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Daniel Lee Revier , Sadia Naseem , Mahmud Halim Chowdhury
IPC: H01L23/00
Abstract: In described examples, a microelectronic device includes a microelectronic die with a die attach surface. The microelectronic device further includes a nanoparticle layer coupled to the die attach surface. The nanoparticle layer may be in direct contact with the die attach surface, or may be coupled to the die attach surface through an intermediate layer, such as an adhesion layer or a contact metal layer. The nanoparticle layer includes nanoparticles having adjacent nanoparticles adhered to each other. The microelectronic die is attached to a package substrate by a die attach material. The die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles.
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公开(公告)号：US10389410B2
公开(公告)日：2019-08-20
申请号：US15638163
申请日：2017-06-29
Applicant: Texas Instruments Incorporated
Inventor： Nathan Brooks , Benjamin Stassen Cook , Swaminathan Sankaran , Bradley Allen Kramer , Mark W. Morgan , Baher S Haroun
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module. An artificial magnetic conductor surface is positioned adjacent the backside of each NFC coupler to reflect back side electromagnetic energy with a phase shift of approximately zero degrees.
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公开(公告)号：US20190128735A1
公开(公告)日：2019-05-02
申请号：US15800009
申请日：2017-10-31
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Daniel Lee Revier
IPC: G01J3/02 , G02B6/122 , G01J3/12 , G01N21/3581
Abstract: An encapsulated package is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. A set of broadband spectral sensors on the IC die are configured to generate a set of signals in response to electromagnetic energy received by the spectral sensors. A photonic filter structure within the encapsulation material is positioned adjacent the set of spectral sensors. The photonic filter structure is configured to pass a different frequency band of electromagnetic energy to each of the set of spectral sensors.
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公开(公告)号：US20190123711A1
公开(公告)日：2019-04-25
申请号：US15792591
申请日：2017-10-24
Applicant: Texas Instruments Incorporated
Inventor： Daniel Lee Revier , Benjamin Stassen Cook
Abstract: An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. A phonon device is fabricated on the IC die that is configured to emit or to receive phonons that have a range of ultrasonic frequencies. An encapsulation material encapsulates the IC die. A phononic bandgap structure is included within the encapsulation material that is configured to have a phononic bandgap with a frequency range that includes at least a portion of the range of ultrasonic frequencies. A phononic channel is located in the phononic bandgap structure between the phonon device and a surface of the encapsulated IC.
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