摘要:
Stacked inverter delay chains. In accordance with a first embodiment of the present invention, a series stack of two p-type devices is coupled to a series stack of three n-type devices, forming a stacked inverter comprising desirable delay, die area and power characteristics. Two stacked inverters are coupled together to form a stacked inverter delay chain that is more efficient in terms of die area, active and passive power consumption than conventional delay chains comprising conventional inverters.
摘要:
Systems and methods for adjusting threshold voltage. A threshold voltage of a transistor of an integrated circuit is measured. A bias voltage, which when applied to a body well of the transistor corrects a difference between the threshold voltage and a desired threshold voltage for the transistor, is determined. The bias, voltage is encoded into non-volatile storage on the integrated circuit. The non-volatile storage can be digital and/or analog.
摘要:
A method and structure for supply gating low power electronic components uses low threshold gating transistors. The low power components operate at supply voltages of less than one volt and typically in the range of 150 to 400 millivolts. Using low threshold gating transistors, the leakage current of the devices, and therefore the standby power dissipation, can be minimized by using any one, or a combination of, four methods including: overdriving the low threshold gating transistors on; overdriving the low threshold gating transistors off; combining very low threshold device transistors with low threshold gating transistors; and providing the low threshold gating transistors with back bias.
摘要:
Low voltage latches are designed such that the latch components are comprised of low threshold transistors. To overcome the effects of leakage current and ensure proper latch operation, according to the invention, the channel widths of the low threshold transistors making up the feedback components of the latch are larger than the channel widths of the low threshold transistors making up the storage components of the latch. Using the method and structure of the invention, the voltage scalability of the latch is significantly increased. One embodiment of the invention allows for minimum supply voltages of around 120 millivolts, an improvement of over six hundred percent compared with the typical prior art minimum voltage requirement of 800 millivolts.
摘要:
A method for supply gating low power electronic devices uses low threshold gating transistors. The low power devices operate at supply voltages of less than one volt and typically in the range of 150 to 400 millivolts. Using low threshold gating transistors, the leakage current of the devices, and therefore the standby power dissipation, can be optimized by using any one, or a combination of, four methods including: overdriving the low threshold gating transistors on; overdriving the low threshold gating transistors off; combining very low threshold device transistors with low threshold gating transistors; and providing the low threshold gating transistors with back bias.
摘要:
Programmable logic structures include logic blocks that operate at very low supply voltages. According to the invention, a pass transistor is positioned between logic blocks. Since the logic blocks of the invention operate at very low supply voltages, the pass transistor can be overdriven on, thereby reducing the added resistance. In one embodiment of the invention, the pass transistor is a low threshold transistor. In this embodiment, the pass transistor is also overdriven off to reduce leakage current and further isolate the logic blocks.
摘要:
A method for providing low power MOS devices that include buried wells specifically designed to provide a resistive path between the bulk material of the device and a well tie contact. By providing a resistive path, an equivalent RC circuit is introduced to the device that allows the bulk material potential to track the gate potential, thereby advantageously lowering the threshold voltage as the device turns on and raising the threshold voltage as the device turns off. In addition, the introduction of the resistive path also allows the bulk material potential to be controlled and stabilize at an equilibrium potential between clock cycles.
摘要:
An MOS device has source and drain regions of a first conductivity formed in a well of a second conductivity, the well of the second conductivity being formed in an upper surface of a bulk material of the first conductivity. Source and drain potentials are applied to the source and drain regions, respectively, while a separate bias potential is routed to the well through a conductive sub-surface layer of the second conductivity which is located spaced from and beneath an upper surface of the bulk material and which is shorted to the well.
摘要:
A method for making an asymmetric MOS device having a notched gate oxide is disclosed herein. Such MOS devices have a region of a gate oxide adjacent to either the source or drain that is thinner than the remainder of the gate oxide. The thin "notched" region of gate oxide lies over a region of the device's channel region that has been engineered to have a relatively "high" threshold voltage (near 0 volts) in comparison to the remainder of the channel region. This region of higher threshold voltage may be created by a pocket region of increased dopant concentration abutting the source or the drain (but not both) and proximate the channel region. The pocket region has the opposite conductivity type as the source and drain. A device so structured behaves like two pseudo-MOS devices in series: a "source FET" and a "drain FET." If the pocket region is located under the source, the source FET will have a higher threshold voltage and a much shorter effective channel length than the drain FET. If the pocket region is located under the drain, the reverse arrangement will be true. The region of thin gate oxide (the notched region) provides a higher gate capacitance than the remaining regions of thicker gate oxide. Thus, the channel region under the notched region of gate oxide has a relatively high concentration of mobile charge carriers in the channel region.