公开(公告)号：US07468830B2

公开(公告)日：2008-12-23

申请号：US11427327

申请日：2006-06-28

Applicant: Shaoher X. Pan

Inventor： Shaoher X. Pan

IPC: G02B26/00

CPC classification number: G02B26/0841 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/112

Abstract: A method for applying anti-stiction material to a micro device on a substrate includes introducing anti-stiction material on a surface of an encapsulation device or a surface of the substrate and sealing at least a portion of the encapsulation device to the surface of the substrate to form a chamber to encapsulate the micro device and the anti-stiction material. The micro device includes a first component and a second component. The first component is moveable and is configured to contact the second component. The method also includes vaporizing the anti-stiction material and depositing the anti-stiction material on a surface of the first component or a surface of the second component after vaporizing the anti-stiction material to prevent stiction between the first component and the second component.

Abstract translation: 将抗静电材料施加到基板上的微器件的方法包括将抗静电材料引入到封装装置的表面或基板的表面上，并将至少一部分封装装置密封到基板的表面 以形成包封微型装置和抗静电材料的室。 微型装置包括第一部件和第二部件。 第一组件是可移动的并被配置成与第二组件接触。 该方法还包括在蒸发抗静电材料之后蒸发抗静电材料并将抗静电材料沉积在第一组分或第二组分的表面上，以防止第一组分和第二组分之间的粘结。

公开(公告)号：US20080290325A1

公开(公告)日：2008-11-27

申请号：US12185094

申请日：2008-08-03

Applicant: Simon Joshua Jacobs ,  Seth Adrian Miller

Inventor： Simon Joshua Jacobs ,  Seth Adrian Miller

IPC: H01B1/00

CPC classification number: B81B3/0005 ,  B81B2201/042 ,  B81C2201/112 ,  B82Y30/00

Abstract: Phosphonate surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirror devices. The surfactants are adsorbed from vapor or solution to form self-assembled monolayers at the device surface. The higher binding energy of the phosphonate end groups (as compared to carboxylate surfactants) improves the thermal stability of the resulting layer.

Abstract translation: 磷酸盐表面活性剂用于钝化MEMS器件的表面，例如数字微镜器件。 表面活性剂从蒸气或溶液中吸附，在器件表面形成自组装单层。 膦酸酯端基（与羧酸酯表面活性剂相比）的较高的结合能改善了所得层的热稳定性。

公开(公告)号：US07449355B2

公开(公告)日：2008-11-11

申请号：US11115828

申请日：2005-04-27

Applicant: Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

Inventor： Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

IPC: H01L21/00 ,  H01L21/461

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

Abstract translation: 机械结构设置在室中，其至少一部分由封装结构限定。 第一种方法提供了通道盖，其具有至少部分地设置在防静电通道的上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。 第二种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 该至少一个部分与机电装置分开制造，然后固定在机电装置上。 第三种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 所述至少一个部分可以包括线球，螺柱，金属箔或焊料预制件。 一种器件包括衬底，封装结构和机械结构。 抗静电层设置在机械结构的至少一部分上。 在基板和封装结构中的至少一个中形成抗静电通道。 帽至少部分地具有设置在抗静电通道上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。

公开(公告)号：US07256467B2

公开(公告)日：2007-08-14

申请号：US10453933

申请日：2003-06-04

Applicant: Jason S. Reid ,  Nungavram S. Viswanathan

Inventor： Jason S. Reid ,  Nungavram S. Viswanathan

IPC: H01L21/00 ,  H01L29/82

CPC classification number: C09D4/00 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/0176 ,  B81C2201/112 ,  B82Y30/00 ,  C08G77/00 ,  C08G77/04 ,  C08G77/24

Abstract: A micro-electromechanical device is formed on a substrate. The device has sliding, abrading or impacting surfaces. At least one of these surfaces is covered with an anti-stiction material. The anti-stiction material is provided from a slicon compound precursor (e.g. silane, silanol) or multiple silicon compound precursors. Preferably the precursor(s) is fluorinated—more preferably perfluorinated, and is deposited with a solvent as a low molecular weight oligomer or in monomeric form. Examples include silanes (fluorinated or not) with aromatic or polycyclic ring sturctures, and/or silanes (fluorinated or not) having alkenyl, alkynyl, epoxy or acrylate groups. Mixtures either or both of these groups with alkyl chain silanes (preferably fluorinated) are also contemplated.

Abstract translation: 在基板上形成微机电装置。 该装置具有滑动，研磨或冲击表面。 这些表面中的至少一个被抗静电材料覆盖。 抗粘性材料由Slico化合物前体（例如硅烷，硅烷醇）或多种硅化合物前体提供。 优选地，前体被氟化 - 更优选全氟化，并且以溶剂作为低分子量低聚物或以单体形式沉积。 实例包括具有芳族或多环结构的硅烷（氟化或非氟化），和/或具有烯基，炔基，环氧基或丙烯酸酯基团的硅烷（氟化或非氟化）。 这些基团中的一个或两个与烷基链硅烷（优选氟化）混合也是可以预料的。

公开(公告)号：US07226802B2

公开(公告)日：2007-06-05

申请号：US10914006

申请日：2004-08-06

Applicant: Paul M. Ocansey ,  Juergen A. Foerstner

Inventor： Paul M. Ocansey ,  Juergen A. Foerstner

IPC: H01L21/00

CPC classification number: B81B3/0005 ,  B81B2201/0235 ,  B81C1/0096 ,  B81C2201/112 ,  C23C16/14 ,  G01P15/0802 ,  G01P15/125

Abstract: Methods and apparatus are provided for preparing sensing fingers for use in a highly integrated accelerometer. The method includes steps for forming a tungsten/tungsten silicide coating on a silicon finger. The tungsten/tungsten silicide coating adds mass to the silicon finger. The method includes steps of forming silicon fingers from layers of silicon, oxides, and capping material. The silicon fingers are then exposed to tungsten containing gases under conditions to promote the formation of a tungsten silicide seed layer on the exposed silicon surfaces. The tungsten layer is then grown to a desired thickness through a growth step. The coated silicon fingers display improved resistance to stiction as compared to uncoated silicon fingers.

Abstract translation: 提供了用于准备用于高度集成的加速度计中的传感指的方法和装置。 该方法包括在硅指状物上形成钨/硅化钨涂层的步骤。 钨/硅化钨涂层增加了硅胶的质量。 该方法包括从硅，氧化物和封盖材料层形成硅指的步骤。 然后在允许在暴露的硅表面上形成硅化钨晶种层的条件下将硅指暴露于含钨气体的条件下。 然后通过生长步骤将钨层生长至所需厚度。 与未涂覆的硅指相比，涂覆的硅指显示改进的粘性阻力。

公开(公告)号：US20070115532A1

公开(公告)日：2007-05-24

申请号：US11556154

申请日：2006-11-02

Applicant: Dongmin Chen ,  Fulin Xiong

Inventor： Dongmin Chen ,  Fulin Xiong

IPC: G02B26/00

CPC classification number: G02B26/0841 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/112 ,  B82Y30/00

Abstract: Embodiments of the present invention generally relate to a device that has an improved usable lifetime due to the presence of a lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. Embodiments of the present invention also generally include a device, and a method of forming a device, that has one or more surfaces or regions that have a volume of lubricant disposed thereon that acts as a ready supply of “fresh” lubricant to prevent stiction occurring between interacting components found within the device. In one aspect, components within the volume of lubricant form a gas or vapor phase that reduces the chances of stiction-related failure in the formed device. In one example, aspects of this invention may be especially useful for fabricating and using micromechanical devices, such as MEMS devices, NEMS devices, or other similar thermal or fluidic devices.

Abstract translation: 本发明的实施例总体上涉及一种由于存在降低在机电装置中的各种运动部件之间出现静电的可能性的润滑剂而具有改善的使用寿命的装置。 本发明的实施例还通常包括一种装置和一种形成装置的方法，其具有一个或多个表面或区域，其具有设置在其上的润滑剂体积，其用作即将供应的“新鲜”润滑剂以防止发生粘连 在设备内发现的互动组件之间。 在一个方面，润滑剂体积内的组分形成气体或气相，其降低了所形成的装置中与静电相关的故障的机会。 在一个示例中，本发明的方面对于制造和使用诸如MEMS器件，NEMS器件或其它类似的热或流体器件的微机械器件可能特别有用。

公开(公告)号：US07009745B2

公开(公告)日：2006-03-07

申请号：US10699410

申请日：2003-10-31

Applicant: Seth A. Miller ,  Simon Joshua Jacobs

Inventor： Seth A. Miller ,  Simon Joshua Jacobs

IPC: G02B26/08

CPC classification number: G02B26/0841 ,  B81B3/0005 ,  B81B3/0083 ,  B81B2201/042 ,  B81C1/0096 ,  B81C2201/112 ,  G02B1/115 ,  Y10S359/90

Abstract: A micromechanical device having a deflectable member which contacts a stationary member. An antireflective coating is applied to portions of the micromechanical device to limit undesired reflection from the device. A passivation or lubrication layer is applied to the device to reduce stiction between the deflectable member and the stationary member. An insulator layer is utilized between the antireflective coating and the lubrication layer to prevent photoelectric-induced breakdown of the lubrication layer.

Abstract translation: 一种具有接触固定构件的偏转构件的微机械装置。 将抗反射涂层施加到微机械装置的部分以限制来自装置的不期望的反射。 钝化或润滑层被施加到该装置上以减少可偏转构件与固定构件之间的粘连。 在抗反射涂层和润滑层之间使用绝缘体层以防止润滑层的光电引起的击穿。

公开(公告)号：US20060027839A1

公开(公告)日：2006-02-09

申请号：US11243550

申请日：2005-10-04

Applicant: Hiromu Ishii ,  Yasuyuki Tanabe ,  Katsuyuki Machida ,  Masami Urano ,  Shouji Yagi ,  Tomomi Sakata

Inventor： Hiromu Ishii ,  Yasuyuki Tanabe ,  Katsuyuki Machida ,  Masami Urano ,  Shouji Yagi ,  Tomomi Sakata

IPC: H01L29/80

CPC classification number: B81B3/0008 ,  B81B2201/045 ,  B81C2201/112

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract translation: 在根据本发明的微型机器中，在每个电极的表面上形成聚酰亚胺膜。 聚酰亚胺膜如下形成。 将具有每个电极和反电极的基板浸渍在电沉积聚酰亚胺溶液中，并向电极施加正电压。 溶解在电沉积聚酰亚胺溶液中的材料沉积在暴露在溶液中的正电压施加电极的表面上，从而在表面上形成聚酰亚胺膜。

公开(公告)号：US20060007515A1

公开(公告)日：2006-01-12

申请号：US10890352

申请日：2004-07-12

Applicant: Dmitri Simonian ,  John Porter

Inventor： Dmitri Simonian ,  John Porter

IPC: G02F1/03

CPC classification number: G02B26/0833 ,  B81B3/0005 ,  B81B2201/042 ,  B81C1/0096 ,  B81C2201/112 ,  B82Y30/00 ,  C03C17/28 ,  C10M105/00 ,  C10M2207/0406 ,  C10M2211/0425 ,  C10M2211/063 ,  C10M2215/041 ,  C10M2215/2225 ,  C10M2219/081 ,  C10M2223/0603 ,  C10M2227/003 ,  C10M2227/045 ,  C10N2240/06 ,  C23C26/00 ,  C23C30/00 ,  H01L21/02046 ,  H01L21/3121

Abstract: Lubricants for lubricating surfaces of microelectromechanical devices are disclosed. Specifically, the lubricants can be applied to the contacting surfaces of the microelectromechanical devices so as to remove stiction of the contacting surfaces.

Abstract translation: 公开了用于微机电装置润滑表面的润滑剂。 具体地说，可以将润滑剂施加到微机电装置的接触表面，以便消除接触表面的粘性。

公开(公告)号：US20050110051A1

公开(公告)日：2005-05-26

申请号：US10989510

申请日：2004-11-17

Applicant: Bruce Chou ,  Hsien-Ming Wu ,  Chen-Chih Fan

Inventor： Bruce Chou ,  Hsien-Ming Wu ,  Chen-Chih Fan

IPC: G01B7/28 ,  B81B3/00 ,  B81C1/00 ,  H01L21/312 ,  H01L29/768 ,  H01L29/84

CPC classification number: H01L21/3127 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/112 ,  H01L21/0212 ,  H01L21/02282

Abstract: A surface processing method for a chip device includes the steps of: (a) providing a chip body having at least one exposed surface; (b) applying a polymeric monomer solution having a plurality of monomers to the at least one surface of the chip body, wherein each of the monomers has a soft fragment fluorocarbon (FC) polymer end and a polar silane group; and (c) curing the polymeric monomer solution to remove solvents out under proper environment settings, and to polymerize the monomers into a solid polymer layer on the at least one surface. The solid polymer layer thus has an exposed surface having a soft fragment FC polymer structure for protecting the chip body from encountering any external or internal interference.

Abstract translation: 芯片器件的表面处理方法包括以下步骤：（a）提供具有至少一个暴露表面的芯片体; （b）将具有多个单体的聚合单体溶液施加到芯片体的至少一个表面，其中每个单体具有软碎片碳氟化合物（FC）聚合物末端和极性硅烷基团; 和（c）固化聚合单体溶液以在适当的环境设置下除去溶剂，并将单体聚合成至少一个表面上的固体聚合物层。 因此，固体聚合物层具有具有软碎片FC聚合物结构的暴露表面，用于保护芯片体免受任何外部或内部干扰。