公开(公告)号：US10819445B2

公开(公告)日：2020-10-27

申请号：US16196367

申请日：2018-11-20

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Henning Braunisch ,  Hyung-Jin Lee ,  Richard Dischler

IPC: H04B15/04 ,  H04B3/52 ,  H04B1/52 ,  H04B3/56 ,  H04B1/525

Abstract: Embodiments may relate to a transceiver chip. The transceiver chip may include a substrate that has a first transceiver component and a second transceiver component positioned therein. The transceiver chip may further include a well material that is positioned between the first transceiver component and the second transceiver component. The well material may mitigate cross-talk between the first transceiver component and the second transceiver component. Other embodiments may be described or claimed.

公开(公告)号：US20200313306A1

公开(公告)日：2020-10-01

申请号：US16901243

申请日：2020-06-15

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini

IPC: H01Q21/22 ,  H01Q21/00 ,  H01L23/00 ,  H01Q21/06 ,  H01Q23/00 ,  G06K19/077

Abstract: Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.

公开(公告)号：US20200304171A1

公开(公告)日：2020-09-24

申请号：US16897135

申请日：2020-06-09

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Diego Correas-Serrano ,  Neelam Prabhu-Gaunkar ,  Telesphor Kamgaing ,  Cooper S. Levy ,  Chintan S. Thakkar ,  Stefano Pellerano

IPC: H04B3/32 ,  H04L25/03

Abstract: Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.

公开(公告)号：US20200294939A1

公开(公告)日：2020-09-17

申请号：US16394905

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Gilbert W. Dewey ,  Hyung-Jin Lee

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48

Abstract: Embodiments may relate to a semiconductor package that includes a die and a package substrate. The package substrate may include one or more cavities that go through the package substrate from a first side of the package substrate that faces the die to a second side of the package substrate opposite the first side. The semiconductor package may further include a waveguide communicatively coupled with the die. The waveguide may extend through one of the one or more cavities such that the waveguide protrudes from the second side of the package substrate. Other embodiments may be described or claimed.

公开(公告)号：US10734735B2

公开(公告)日：2020-08-04

申请号：US16432651

申请日：2019-06-05

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel Elsherbini

IPC: H01Q21/00 ,  H01Q21/22 ,  H01L23/00 ,  H01Q21/06 ,  H01Q23/00 ,  G06K19/077

Abstract: Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.

公开(公告)号：US10658312B2

公开(公告)日：2020-05-19

申请号：US15712270

申请日：2017-09-22

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel Elsherbini ,  Valluri Rao

IPC: H01L23/66 ,  H01Q1/38 ,  H01L21/48 ,  H01L23/498 ,  H01L21/52 ,  H01L23/00 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q23/00

Abstract: Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.

公开(公告)号：US10566672B2

公开(公告)日：2020-02-18

申请号：US15277504

申请日：2016-09-27

Applicant: INTEL CORPORATION

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Johanna M. Swan ,  Georgios C. Dogiamis ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Telesphor Kamgaing

IPC: H01P5/10 ,  H01Q13/08

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

公开(公告)号：US10453804B2

公开(公告)日：2019-10-22

申请号：US14909939

申请日：2015-03-19

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Thorsten Meyer

IPC: H01L23/373 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00 ,  H01L23/36 ,  H01L23/66 ,  H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01L23/538

Abstract: A package is described for a radio frequency die that has a backside conductive plate. One example includes a conductive plate, a semiconductor die having a front side and a back side, the back side being attached to the plate, a radio frequency component attached to the plate, a dielectric filled cavity in the plate adjacent to the radio frequency component, and a redistribution layer attached to the front side of the die for external connection.

公开(公告)号：US10452571B2

公开(公告)日：2019-10-22

申请号：US15746318

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Georgios C. Dogiamis ,  Brandon M. Rawlings

IPC: G06F13/14 ,  G06F13/00 ,  H04M9/06 ,  G06F3/14

Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.

公开(公告)号：US10410983B2

公开(公告)日：2019-09-10

申请号：US15773152

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/538 ,  H01L25/10 ,  H01L23/552 ,  H01L25/18 ,  H01Q1/38 ,  H01Q1/24

Abstract: Embodiments of the invention include a microelectronic device that includes an overmolded component having a first die with a silicon based substrate. A second die is coupled to the first die with the second die being formed with compound semiconductor materials in a different substrate. A substrate is coupled to the first die. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.