公开(公告)号：US06998630B2

公开(公告)日：2006-02-14

申请号：US10933977

申请日：2004-09-03

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US20060030060A1

公开(公告)日：2006-02-09

申请号：US11244080

申请日：2005-10-06

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： G01R31/26 ,  H01L21/66

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus for detecting defects on a specimen including am illumination optical unit which obliquely projects a laser onto a region which is longer in one direction than in a direction transverse to said one direction on a surface of a specimen, a table unit which mounts said specimen and which is movable, a detection optical unit which detects with an image sensor an image of light formed by light reflected from said specimen in both directions of the one direction and the direction transverse and which reflected light in both directions is formed on said image sensor while said table is moving, a signal processor which processes a signal outputted from said image sensor of said detection optical unit to extract defects of said specimen. A display unit which displays information of defects extracted by said signal processor.

摘要翻译： 一种用于检测试样上的缺陷的装置，包括：am照明光学单元，其将激光倾斜地突出到在一个方向上比沿着与所述一个方向横切的方向在一个方向上长的区域;安装所述样本的台单元 检测光学单元，其利用图像传感器检测在所述图像传感器上形成有从所述一个方向的两个方向和横向方向反射的光形成的光，并且在所述图像传感器上形成两个方向的反射光 当所述表移动时，信号处理器处理从所述检测光学单元的所述图像传感器输出的信号，以提取所述样本的缺陷。 一种显示由所述信号处理器提取的缺陷信息的显示单元。

公开(公告)号：US06888959B2

公开(公告)日：2005-05-03

申请号：US09791682

申请日：2001-02-26

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

IPC分类号： G01N21/956 ,  G06T7/00 ,  H01L21/66 ,  G06K9/00

CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8861 ,  G01N2021/8867 ,  G06T7/97 ,  G06T2207/10152 ,  G06T2207/30148

摘要： In order to inspect a substance to be detected such as a foreign substance in accordance with the condition of the surface of a sample to be inspected such as a semiconductor substrate manufactured in various manufacturing processes under a suitable inspection condition, this method includes the steps of: inspecting a substance to be detected on a sample to be inspected under a plurality inspection conditions, which are previously set, as a single unit to detect at least the data of a detected substance for each of the plurality of inspection conditions; checking the data of the detected substance for the respective inspection conditions against each other to make check data; analyzing the detected substance based on the check data of the detected substance to classify the detected substance; adding the data of classified detected substance to the coordinate data of the detected substance for the respective inspection conditions to make data relating to the classified detected substance for the respective inspection conditions; and selecting a suitable inspection condition based on the data relating to the classified detected substance for the respective inspection conditions.

摘要翻译： 为了在适当的检查条件下，根据在各种制造工序中制造的半导体衬底等被检测样品的表面状况，检查异物等异物，该方法包括以下步骤： 在预先设定的多个检查条件下检查待检测样品上检测到的物质作为单个单元，至少检测多个检查条件中检测物质的数据; 检查相应检查条件的检测物质的数据，以进行检查数据; 基于检测到的物质的检查数据分析检测到的物质以对检测到的物质进行分类; 将各种检测条件的检测物质的坐标数据相加，对各检查条件进行分类检测物质的数据的添加; 以及基于与各检查条件的分类检测物质有关的数据来选择合适的检查条件。

公开(公告)号：US20050024633A1

公开(公告)日：2005-02-03

申请号：US10933977

申请日：2004-09-03

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88 ,  G01N21/94

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US06777677B2

公开(公告)日：2004-08-17

申请号：US10463576

申请日：2003-06-18

申请人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

发明人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

IPC分类号： H01J3728

CPC分类号： G06T7/0004 ,  G01N23/20 ,  G06T2207/30148 ,  H01J2237/2487 ,  H01J2237/2817

摘要： A pattern inspection system for inspecting a substrate surface on which a predetermined pattern is formed with radiation of an electron beam and an optical beam. the pattern inspection system includes a radiation and which radiates an electron beam to the substrate, a detection unit which detects a secondarily generated signal attributable to the radiation of the electron beam, a retrieval unit which retrieves an image from the signal detected by the detection unit, and an image processing unit which classifies the retrieved image depending on a type of the image.

摘要翻译： 一种图案检查系统，用于检查其上形成有电子束和光束的辐射的预定图案的基板表面。 图案检查系统包括辐射并且向基板辐射电子束，检测单元，其检测归因于电子束的辐射的次要生成的信号;检索单元，其从由检测单元检测到的信号中检索图像 以及图像处理单元，其根据图像的类型对检索到的图像进行分类。

公开(公告)号：US06731384B2

公开(公告)日：2004-05-04

申请号：US09973000

申请日：2001-10-10

申请人： Yoshimasa Ohshima ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Kenji Mitomo ,  Takashi Okawa ,  Akira Hamamatsu ,  Shinichi Suzuki

发明人： Yoshimasa Ohshima ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Kenji Mitomo ,  Takashi Okawa ,  Akira Hamamatsu ,  Shinichi Suzuki

IPC分类号： G01N2100

CPC分类号： G01N21/94 ,  G01N21/8806

摘要： An apparatus and method for detecting foreign particle and defect on an object in detection by means of a laser beam, in which the laser beams of different wavelengths are irradiated onto the surface of the object in detection from different angles and the state of foreign particle and defect is separately detected according to the output level of the scattered light reflected from that surface. Further, it is arranged such that the scattered light reflected from the object onto which the laser beam is irradiated from the sole source or the plurality of sources is detected in plural directions, which detecting result is compared for the detection of the directivity of said scattered light in reflection.

摘要翻译： 一种用于通过激光束检测物体中的异物和在物体上的缺陷的装置和方法，其中不同波长的激光束从不同的角度和外来粒子的状态被检测到被检测物体的表面，并且 根据从该表面反射的散射光的输出电平分别检测缺陷。 另外，从多个方向检测从单个源或多个源照射激光束的物体所反射的散射光，将该检测结果进行比较，以检测所述散射的方向性 光反射。

公开(公告)号：US06583414B2

公开(公告)日：2003-06-24

申请号：US09725900

申请日：2000-11-30

申请人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

发明人： Mari Nozoe ,  Hidetoshi Nishiyama ,  Shigeaki Hijikata ,  Kenji Watanabe ,  Koji Abe

IPC分类号： H01J37147

CPC分类号： G06T7/0004 ,  G01N23/20 ,  G06T2207/30148 ,  H01J2237/2487 ,  H01J2237/2817

摘要： There are provided an inline inspection system and inspection method for inspecting the substrate surface on which semiconductors and circuit patterns are formed by radiating thereto white beam, laser beam or electron beam, and reviewing, inspecting and discriminating the detected roughness and figure defect, particle and moreover electrical defect on the surface with higher accuracy within a short period of time with the same instrument. Thereby, automatic movement to the position to be reviewed, acquisition of image and classification can be realized. On the occasion of identifying the position to be reviewed on a sample and forming an image through irradiation of electron beam on the basis of the positional information of defect detected with the other inspection instrument, an electrical defect can be reviewed with the voltage contrast mode by designating the electron beam irradiation condition, detectors and detecting condition depending on a kind of defect to be reviewed. The image obtained is automatically classified in the image processing unit and the result is then additionally output to the defect file.

摘要翻译： 提供了一种在线检查系统和检查方法，用于通过向其发射白光束，激光束或电子束来检查其上形成有半导体和电路图案的衬底表面，并且检查和检查检测到的粗糙度和图形缺陷，颗粒和 此外，在相同仪器的短时间内，表面具有较高精度的电气缺陷。 因此，可以实现自动移动到要检查的位置，获取图像和分类。 在通过基于用其他检查仪检测到的缺陷的位置信息的基础上，通过照射电子束来识别要检查的位置并形成图像的情况下，可以通过电压对比度模式来检查电缺陷 指定电子束照射条件，检测器和检测条件取决于要检查的缺陷的种类。 所获得的图像被自动分类到图像处理单元中，然后将结果另外输出到缺陷文件。

公开(公告)号：US5463459A

公开(公告)日：1995-10-31

申请号：US46720

申请日：1993-04-16

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

IPC分类号： G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01R31/308 ,  H01J37/00 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68 ,  G01N21/89 ,  G02B27/46 ,  G06F15/46

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95623 ,  G01R31/308 ,  H01J37/00 ,  H01L21/67253 ,  H01L21/67288 ,  G01N2021/8822 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L22/12

摘要： A defect detecting apparatus including an illumination system for radiating a light of a plane wave linearly to a substrate having repetitive patterns of different pitches; a focusing optical system for focusing a light image reflected from the substrate thus illuminated by the illumination system; a spatial filter disposed intermediate the focusing optical system so as to shield a diffraction light from repetitive patterns of a small pitch on the substrate; a detector for detecting the light image formed by the focusing optical system; an erasing means for comparing and erasing signals which are generated on the basis of repetitive patterns of a large pitch and obtained through the spatial filter, out of signals detected by the detector; and a defect detecting means for detecting defects on the substrate in accordance with a signal detected by the detector, as well as a method applied to the said apparatus.

摘要翻译： 一种缺陷检测装置，包括用于将平面波的光线线性地发射到具有不同间距的重复图案的基板的照明系统; 聚焦光学系统，用于聚焦由照明系统照射的从基板反射的光图像; 设置在聚焦光学系统之间的空间滤光器，以便屏蔽来自基板上的小间距的重复图案的衍射光; 用于检测由聚焦光学系统形成的光图像的检测器; 擦除装置，用于根据由检测器检测到的信号，比较和擦除基于大间距的重复图案并通过空间滤波器获得的信号; 以及缺陷检测装置，用于根据由检测器检测的信号检测基板上的缺陷，以及应用于所述装置的方法。

公开(公告)号：US08153969B2

公开(公告)日：2012-04-10

申请号：US12323167

申请日：2008-11-25

申请人： Atsuko Fukada ,  Mitsugu Sato ,  Naomasa Suzuki ,  Hidetoshi Nishiyama ,  Muneyuki Fukuda ,  Noritsugu Takahashi

发明人： Atsuko Fukada ,  Mitsugu Sato ,  Naomasa Suzuki ,  Hidetoshi Nishiyama ,  Muneyuki Fukuda ,  Noritsugu Takahashi

IPC分类号： G01N23/00

CPC分类号： G01N23/2251 ,  H01J37/147 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/1501 ,  H01J2237/1508 ,  H01J2237/2449 ,  H01J2237/24507

摘要： In an electric immersion lens having high resolution capability, secondary electrons generated from a specimen are accelerated to suppress the dependency of rotational action of the secondary electrons applied thereto by an objective lens upon energy levels of the secondary electrons and when selectively detecting low and high angle components of elevation and azimuth as viewed from a secondary electron generation site by means of an annular detector interposed between an electron source and the objective lens, the secondary electrons are adjusted and deflected by means of an E×B deflector such that the center axis of secondary electrons converged finely under acceleration is made to be coincident with the center axis of a low elevation signal detection system and the secondary electrons are deviated from an aperture of a high elevation signal detection system.

摘要翻译： 在具有高分辨能力的电浸透镜中，加速从样本产生的二次电子，以抑制由物镜施加到其上的二次电子的旋转作用对二次电子的能级的依赖性，并且当选择性地检测低角度和高角度时 通过设置在电子源和物镜之间的环形检测器从二次电子产生位置观察的仰角和方位的分量，二次电子通过E×B偏转器被调节和偏转，使得中心轴线 在加速度下精细收敛的二次电子与低仰角信号检测系统的中心轴一致，二次电子偏离高仰角信号检测系统的孔径。

公开(公告)号：US20120062890A1

公开(公告)日：2012-03-15

申请号：US13298079

申请日：2011-11-16

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N15/02

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。