INDUCTION MOLDING FOR PARTS HAVING THERMOPLASTIC PORTIONS

    公开(公告)号:US20190118415A1

    公开(公告)日:2019-04-25

    申请号:US15791683

    申请日:2017-10-24

    Abstract: Systems and methods are provided for molding systems that have a low thermal mass. One embodiment is a first tool that includes a first frame. The first frame includes a first set of plates of magnetically permeable material, and a material disposed between plates of the first set. The first tool also includes a first set of induction coils that are disposed within the first frame and that generate a first electromagnetic field, and a first susceptor that extends from the first set of plates. The first susceptor generates heat in response to the first electromagnetic field. The first tool further includes a mold that extends from the first susceptor and receives heat via conductive heat transfer from the first susceptor. Each plate of the first set is thinner than a skin depth at which the first electromagnetic field would generate an electrical induction current.

Patent Agency Ranking