Abstract:
SOI devices for plasma display panel driver chip, include a substrate, a buried oxide layer and an n-type SOI layer in a bottom-up order, where the SOI layer is integrated with an HV-NMOS device, an HV-PMOS device, a Field-PMOS device, an LIGBT device, a CMOS device, an NPN device, a PNP device and an HV-PNP device; the SOI layer includes an n+ doped region within the SOI layer at an interface between the n-type SOI layer and the buried oxide layer; and the n+ doped region has a higher doping concentration than the n-type SOI layer.
Abstract:
A method for adjusting the waveform brightness for a waveform formatted to be displayed on a digital three-dimensional (3D) oscilloscope having M brightness gradation levels to display the waveform on a digital 3D oscilloscope having L brightness gradation levels is includes, creating a ROM in an FPGA and storing a look-up table of screen display brightness value of LCD that is corresponding to the waveform occurrence N(T,A) at the current brightness gradation L. The ROM is divided into 2a sub ROMs, each sub ROM has the capacity of 2b×d bits. A value of round(pL·N(T,A) is assigned to waveform brightness value D(T,A) and is stored correspondingly into the subROML of 2b×d bits by ascending order of the b bits of binary data of waveform occurrence N(T,A). In this way, using the b bits of binary data of waveform occurrence N(T,A) as the binary address of the subROML, corresponding waveform brightness value D(T,A) at the current brightness gradation L can be obtained through look-up table in the subROML.
Abstract:
A high voltage lateral double diffused metal-oxide-semiconductor field effect transistor (LDMOS) comprises a substrate; an epitaxy layer on the substrate; a drift region on the epitaxy layer; and a drain region and a source region at two ends. At least one pair of n-type and p-type semiconductor regions is arranged alternately above the interface of the substrate and the epitaxy layer and firmly attached to a lower surface of the drifting region; the n-type and p-type semiconductor regions are firmly closed to each other and arranged to form a lateral PN junction; and the p-type semiconductor region and the drifting region form a vertical PN junction. The n-type and p-type semiconductor regions are also totally called “a reduced surface field (RESURF) layer in body”, and the LDMOS device with a RESURF layer in body effectively solves conflict between raising reverse withstand voltage and reducing forward on-resistance of the current LDMOS devices.
Abstract:
A high voltage lateral double diffused metal-oxide-semiconductor field effect transistor (LDMOS) comprises a substrate; an epitaxy layer on the substrate; a drift region on the epitaxy layer; and a drain region and a source region at two ends. At least one pair of n-type and p-type semiconductor regions is arranged alternately above the interface of the substrate and the epitaxy layer and firmly attached to a lower surface of the drifting region; the n-type and p-type semiconductor regions are firmly closed to each other and arranged to form a lateral PN junction; and the p-type semiconductor region and the drifting region form a vertical PN junction. The n-type and p-type semiconductor regions are also totally called “a reduced surface field (RESURF) layer in body”, and the LDMOS device with a RESURF layer in body effectively solves conflict between raising reverse withstand voltage and reducing forward on-resistance of the current LDMOS devices.
Abstract:
A metal vanadium film is used as an extraction electrode contacting with a vanadium oxide or doped vanadium oxide film. The electrode material is adapted for a detector, sensor and optical switch based on a vanadium oxide or doped vanadium oxide film. The metal vanadium film is in favor of reducing the thermal conductivity of the support structure of the array unit. The preparation process of the vanadium film using the metal vanadium as the source material is more easily controlled than that of NiCr film using the NiCr alloy as the source material. The extraction electrode of the present invention easily obtains an excellent metal-semiconductor contact characteristic. The preparation process and patterning process of the metal vanadium film have an excellent technology compatibility with the IC and MEMS manufacturing processes.
Abstract:
The present invention relates to a semiconductor device. The device comprises a semiconductor substrate. A semiconductor drift region is on the semiconductor substrate. The semiconductor drift region comprises a semiconductor region of a first conduction type and a semiconductor region of a second conduction type. The semiconductor region of the first conduction type and the semiconductor region of the second conduction type form a superjunction structure. A high-K dielectric is on the semiconductor substrate. The high-K dielectric is adjacent to the semiconductor region of the second conduction type. An active region is on the semiconductor drift region. A trench gate structure is on the high-K dielectric, the trench gate structure being adjacent to the active region. The semiconductor region of the second conduction type is formed by shallow angle ion implantation, thus its width is narrow and its concentration is high.
Abstract:
The present invention provides a method of wet etching a silicon slice including a silicon substrate and a metal film layer thereon comprising steps of: performing lithographic process to the silicon slice forming a masked silicon slice comprising the silicon substrate and a partially masked metal film thereon; immersing the masked silicon slice into an etchant; rotating the masked silicon slice in the etchant; injecting high-purity nitrogen gas into the etchant for agitating the etchant; removing the masked silicon slice out of the etchant, upon completion of etching; and rinsing the masked silicon slice with deionized water.
Abstract:
The present invention discloses an active matrix organic electroluminescence device comprising a thin-film transistor, an organic electroluminescence device, and an interlayer deposited between the thin-film transistor and the organic electroluminescence device, wherein the interlayer is made of cationic ultraviolet-curing adhesive comprising epoxy resin or modified epoxy resin, diluting agent, cationic photo initiator. The interlayer solves poor adhesiveness between the driving circuit and the organic electroluminescence device, and improves the moisture and oxygen proof ability. The preparation method is simple, effective, and able to lower the cost and difficulty, and greatly improve the yield rate.
Abstract:
The present invention relates to a method for detecting Network Anomaly in network architectures based on locator/identifier split, the detection flow is as follows: initialization processing, and in ITR: processing data packets, sending a Map-Request, determining whether to send an additional Map-Request, sending the data packet, processing the Map_Reply, processing EID-to-RLOC Cache entry expired; in ETR: processing data packet, processing Map-Request, determining whether the traffic of the ITR currently sending the Map-Request is abnormal, replying to the ITR of which the query traffic is abnormal, replying to ITR of which the query traffic is abnormal. With respect to the characteristic that the network architecture based on locator/identifier split needs to query the relationship between the locator and the identifier for packet delivery, the present invention detects Network Anomaly based on query traffic instead of network data packet traffic. Thus the present invention has the advantages of effectively reducing the investment on detection device, The overhead of exchanging monitoring information and the detection system maintenance cost; facilitating cross domain coordination; and efficiently handling the failures occurring during network operation in time; effectively improve the reliability of the network, being suitable for a large-scale network.
Abstract:
A semiconductor power device wherein the reverse voltage across the p.sup.+ -regions(s) and the n.sup.+ -regions(s) is sustained by a composite buffer layer, shortly as CB-layer. The CB-layer contains two kinds of semiconductor regions with opposite types of conduction. These two kinds of regions are alternatively arranged, viewed from any cross-section parallel to the interface between the layer itself and the n.sup.+ (or p.sup.+)-region. Whereas the hitherto-used voltage sustaining layer contains only one kind of semiconductor with single type of conduction in the same sectional view. Design guidelines are also provided in this invention. The relation between the on-resistance in unit area Ron and the breakdown voltage V.sub.B of the CB-layer invented is Ron ocV.sub.B.sup.113 which represents a breakthrough to the conventional voltage sustaining layer, whereas the other performances of the power devices remain almost unchanged.