公开(公告)号：US20180361164A1

公开(公告)日：2018-12-20

申请号：US16101639

申请日：2018-08-13

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/375 ,  H02G3/22 ,  H01R43/00 ,  A61N1/05 ,  A61N1/08 ,  H01G4/40 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G2/10 ,  C22C29/12 ,  B23K35/30 ,  A61N1/372

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B22F3/02 ,  B22F3/04 ,  B22F3/15 ,  B22F2007/042 ,  B22F2999/00 ,  B23K35/3013 ,  B32B18/00 ,  C04B35/00 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/403 ,  C04B2237/72 ,  C22C1/0466 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.

公开(公告)号：US10080889B2

公开(公告)日：2018-09-25

申请号：US14187295

申请日：2014-02-23

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/375 ,  H01G4/40 ,  A61N1/08 ,  A61N1/37 ,  H01R13/7195 ,  H03H1/00 ,  H01R13/52 ,  H01G2/02 ,  H01G2/10 ,  H03H7/01

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G2/02 ,  H01G2/10 ,  H01G4/40 ,  H01R13/5224 ,  H01R13/7195 ,  H01R2201/12 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition.

公开(公告)号：US20180236244A1

公开(公告)日：2018-08-23

申请号：US15943998

申请日：2018-04-03

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods

IPC: A61N1/375 ,  A61N1/378 ,  H01R13/52 ,  H01R4/58 ,  H01R13/26

CPC classification number: A61N1/3754 ,  A61N1/37512 ,  A61N1/378 ,  H01R4/58 ,  H01R13/26 ,  H01R13/5221 ,  H01R13/5224 ,  H01R2201/12 ,  H03H2001/0014 ,  H03H2001/0021 ,  H03H2001/0042

Abstract: A feedthrough subassembly for an active implantable medical device includes a metallic ferrule having a conductive ferrule body, at least one surface disposed on a device side, and a ferrule opening passing through the at least one surface. An insulator body hermetically seals the ferrule opening of the conductive ferrule body by at least one of a first gold braze ceramic seal, a glass seal or a glass-ceramic seal. At least one hermetically sealed conductive pathway is disposed through the insulator body. At least one pocket formed in the at least one surface has a gold pocket pad disposed within. When the first gold braze ceramic seal is present, the first gold braze ceramic seal and the gold pocket pad are not physically touching one another.

公开(公告)号：US10016595B2

公开(公告)日：2018-07-10

申请号：US15373139

申请日：2016-12-08

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  H01G4/40 ,  A61N1/375 ,  A61N1/37 ,  H01G4/35 ,  H01R13/7195 ,  H03H1/00 ,  H05K9/00 ,  H03H7/01 ,  H05K5/00 ,  H05K1/18 ,  H01G4/06

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K999/99 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US09931514B2

公开(公告)日：2018-04-03

申请号：US15250210

申请日：2016-08-29

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Jason Woods

IPC: A61N1/00 ,  A61N1/375 ,  H02G15/013 ,  H01G4/40 ,  H01G2/02 ,  H01G4/35 ,  H01G4/228 ,  H03H1/00 ,  H01R13/7197 ,  H01R13/52

CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/5224 ,  H01R13/7197 ,  H02G15/013 ,  H03H1/00 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough assembly for an active implantable medical device includes an electrically conductive ferrule hermetically sealed by a first braze to an insulator. A conductor is hermetically sealed to and disposed through the insulator. A filter capacitor has an active electrode plate and a ground electrode plate which are disposed within and supported by a capacitor dielectric in an interleaved, partially overlapping relationship. A first passageway is disposed through the capacitor dielectric having a capacitor internal metallization which is connected to the active electrode plate. A capacitor external metallization electrically connects to the ground electrode plate. An oxide-resistant metal addition includes a conductive core with a conductive cladding of a different material. A first electrical connection is between the oxide-resistant metal addition and the capacitor external metallization. A second electrical connection is between the oxide-resistant metal addition and the ferrule.

公开(公告)号：US09889306B2

公开(公告)日：2018-02-13

申请号：US14797123

申请日：2015-07-11

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: B01J20/34 ,  A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01G4/35 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/372 ,  A61N1/375 ,  B22F2998/10 ,  C22C29/12 ,  H01G2/103 ,  H01G4/35 ,  H01R43/00 ,  Y10T156/1052 ,  B22F1/0059 ,  B22F3/10

Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

公开(公告)号：USRE46699E1

公开(公告)日：2018-02-06

申请号：US15358202

申请日：2016-11-22

Applicant: Greatbatch Ltd.

Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher Michael Williams ,  Robert Naugler ,  Christine A. Frysz

IPC: A61N1/00 ,  A61N1/375 ,  H01G4/40 ,  H01R13/7195 ,  H01G4/228 ,  H01G2/02 ,  H01G4/35 ,  H03H1/00 ,  H03H7/01

CPC classification number: H01R13/7195 ,  A61N1/086 ,  A61N1/3754 ,  A61N2001/086 ,  H01G4/06 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

公开(公告)号：US20170117866A1

公开(公告)日：2017-04-27

申请号：US15398098

申请日：2017-01-04

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz

IPC: H03H1/00 ,  A61N1/375 ,  A61N1/08 ,  A61N1/37 ,  H01G4/06 ,  H01G4/35

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  A61N2001/086 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze. The ground path comprises an internal ground plate disposed within the circuit board substrate, and the internal ground plate is electrically connected to both the conductive pin and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US20160151635A1

公开(公告)日：2016-06-02

申请号：US14556239

申请日：2014-12-01

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Thomas Marzano ,  Xiaohong Tang ,  William C. Thiebolt ,  Keith W. Seitz

IPC: A61N1/39 ,  A61N1/08 ,  A61N1/362

CPC classification number: A61N1/3968 ,  A61N1/086 ,  A61N1/362 ,  A61N1/3718 ,  A61N1/3754 ,  H03H1/00 ,  H03H7/0107 ,  H03H7/1758 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/005 ,  H03H2001/0085 ,  H03H2007/013

Abstract: A hermetic terminal assembly for an AIMD includes a shielded three-terminal flat-through EMI energy dissipating filter and a hermetically sealed feedthrough configured to be attachable to the ferrule or AIMD housing. The flat-through filter includes a first shield plate, an active electrode plate, and a second shield plate where the shield plates are electrically coupled to a metallization which in turn is coupled either to the ferrule or AIMD housing. The feedthrough includes an alumina substrate comprised of at least 96% alumina and a via hole with a substantially closed pore and substantially pure platinum fill. The platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill, wherein the platinum fill is electrically coupled to at least one active electrode plate in non-conductive relationship to the at least one first and second shield plates.

Abstract translation: 用于AIMD的密封端子组件包括屏蔽的三端子平通EMI消散滤波器和被配置为可附接到套圈或AIMD壳体的密封馈通。 平通过滤器包括第一屏蔽板，有源电极板和第二屏蔽板，其中屏蔽板电耦合到金属化，金属化层又连接到套圈或AIMD壳体。 馈通包括由至少96％的氧化铝组成的氧化铝衬底和具有基本上闭孔的通孔和基本上纯的铂填充物。 铂填充物在氧化铝基底和铂填充物之间形成曲折且相互共形的编织物或界面，其中铂填充物与非至少一个第一和第二屏蔽板的非导电关系电耦合到至少一个有源电极板 。

公开(公告)号：US09233253B2

公开(公告)日：2016-01-12

申请号：US13743276

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: H01G4/35 ,  A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。