Abstract:
The invention relates to a calibration standard, especially for the calibration of devices for the non-destructive measurement of the thickness of thin layers with a carrier plate (16) of a basic material and a standard (17) applied on the carrier plate (16), said standard having the thickness of the layer at which the device is to be calibrated, wherein that a holding device (22) arranged on the basic body (12) of the calibration standard (11) receives at least the standard (17) to the basic body (12) such that upon setting a measuring probe of the device for the non-destructive measurement of thin layers onto the standard (17), its position will be changeable by at least one degree of freedom.
Abstract:
A measurement stand for holding a measuring device (26), in particular a measuring arrangement (26) for measuring the thickness of thin layers, said measurement stand comprising a housing (18) in which a cam follower (23) is guided such that it can be moved up and down and the measuring device (26) is arranged at that end of said housing (18) that faces the measuring object (14), wherein a drive unit (29) with an electric drive (28) drives the lifting movement of the cam follower (23), wherein said drive unit (29) initiates in the down movement at least one first movement phase with a rapid motion and at least one further movement phase of the cam follower (23) with a creep motion until the measuring device (26) touches down on the measuring object (14).
Abstract:
An integrated circuit with electrostatic discharge protection includes a first transistor with a source terminal, a drain terminal and a gate terminal, and a second transistor with a source terminal, a drain terminal and a gate terminal. The gate terminal for each of the first and second transistors is connected to the drain terminal. The first transistor is connected in series with the second transistor by one of the drain and source terminals of the first transistor being connected to one of the drain and source terminals of the second transistor. The series circuit formed by the transistors is connected to an input terminal of the integrated circuit or to a supply terminal and a terminal that applies the reference potential of the integrated circuit. The series circuit of the transistors is dimensioned by the number of transistors and the setting of the channel length and channel width ratios of the transistors.
Abstract:
The invention relates to a semiconductor memory device, a system with a semiconductor memory device, and a method for operating a semiconductor memory device, comprising the steps of reading out a data value, in particular a CAS latency time data value (CL) stored in a memory; activating or deactivating a device provided on said semiconductor memory device in support of a high speed operation, as a function of the data value (CL) stored.
Abstract:
An apparatus for aging a chip, comprising a first bit line connected to a first memory cell; a second bit line connected to a second memory cell; an access circuit for accessing the first memory cell via the first bit line and for accessing the second memory cell via the second bit line; a first controller for selectively connecting/disconnecting the first bit line to the access circuit and from the access circuit, respectively; a second controller for selectively connecting/disconnecting the second bit line to the access circuit and from the access circuit, respectively; a normal operating mode controller for controlling the first and second controller, wherein the normal operating mode controller is formed such to select the first controller in a normal operating mode for accessing the first memory cell, and to connect the access circuit to the first bit line, while the second controller is controlled to disconnect the access circuit from the second bit line; wherein the apparatus comprises: an aging mode controller for controlling the first and second controller, wherein the aging mode controller is formed to control the first controller and the second controller in an aging mode such that the access circuit is connected to the first and second bit lines for a predetermined time period.
Abstract:
The invention relates to a method for reducing the current consumption of an electronic circuit having at least one test module for testing the electronic circuit. The test module is connected to at least one line and/or a connection of the electronic circuit. A test control signal is generated, by means of which the test module is at least partially decoupled from the line or the connection in an operating mode of the electronic circuit such that switching currents are prevented in the test module.
Abstract:
A semiconductor memory includes: at least two memory banks that each have a memory cell matrix, an address decoding unit which includes a bank address decoding unit, a row address decoding unit and a column address decoding unit. At least one demultiplexer is connected upstream of the address buffer memories provided in the row address decoding unit and/or in the column address decoding unit. This demultiplexer is connected to the bank address decoder in order, on the basis of the decoded bank address, to activate the corresponding address buffer memory.
Abstract:
A RAM memory circuit and method for controlling the same includes memory cells disposed in a matrix of rows and columns each addressed for writing in/reading out a datum by activation of a word line assigned to a relevant row and connection of a sense amplifier assigned to a relevant column to a data path. A control device can be set by an immediate-write command, commanding the write operation, to initiate connection of the sense amplifiers selected by the column addresses provided to the data path at an instant ta+Tw, where ta is the instant of activation of the word line selected by a row address provided and Tw is less than a charging time Tc specific to the memory circuit and is necessary, starting from a word line activation, to transfer the datum stored in a memory cell of the relevant row to the respectively selected sense amplifier and amplify it there.
Abstract:
An integrated DRAM memory component has sense amplifiers which, respectively within the framework of the integrated component, are formed from a multiplicity of transistor structures, arranged regularly in cell arrays, and signal interconnect structures with amplification transistors for bit line signal amplification. The amplification transistors are of identical design and they lie opposite one another in pairs in adjacent transistor rows. Signal interconnects, which are associated with the transistor rows and run parallel thereto, supply actuation signals. The signal interconnects for the actuation signals have the same arrangement symmetry as the amplification transistors, which means that the amplification transistors in adjacent transistor rows are in the same signal interconnect proximity.
Abstract:
A dynamic semiconductor memory has memory cells disposed in a cell field. The memory cells are connected to master word lines by way of a word line driver for driving the memory cells. As a rule, all the master word lines that are located in the segmented cell field are inactive, with at most one master word line being active. The master word lines are switched to an active low state, and a portion of the master word lines in a region of the cell field are inverted by a control device located at the beginning of the cell field. The deactivated master word lines in the cell field are at a ground potential, which, in view of the large number of existing master word lines, advantageously substantially reduces the leakage current that must be applied by the generators.