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公开(公告)号：US10314970B2
公开(公告)日：2019-06-11
申请号：US15859344
申请日：2017-12-30
Applicant: International Business Machines Corporation
Inventor： Bing Dang , John U. Knickerbocker , Joana S. B. T. Maria , Bucknell C. Webb , Steven L. Wright
Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.
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公开(公告)号：US20180301440A1
公开(公告)日：2018-10-18
申请号：US16014887
申请日：2018-06-21
Applicant: International Business Machines Corporation
Inventor： Stephen W. Bedell , Bing Dang , Ning Li , Frank R. Libsch , Devendra K. Sadana
IPC: H01L25/075 , H01L33/32 , H01L33/62 , H01L33/30
CPC classification number: H01L25/0753 , H01L33/30 , H01L33/32 , H01L33/62 , H01L2933/0066
Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.
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133.发明授权公开(公告)号：US10103450B2
公开(公告)日：2018-10-16
申请号：US15233628
申请日：2016-08-10
Applicant: International Business Machines Corporation
Inventor： Bing Dang , Duixian Liu , Jean-Olivier Plouchart , Peter Jerome Sorce , Cornelia Kang-I Tsang
Abstract: Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.
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公开(公告)号：US10056310B2
公开(公告)日：2018-08-21
申请号：US15275887
申请日：2016-09-26
Applicant: International Business Machines Corporation
CPC classification number: H01L23/10 , B81B7/0058 , B81C1/00269 , B81C2203/038 , H01L21/4817 , H01L21/50 , H01L31/0203
Abstract: A semiconductor device includes a first bonding surface disposed on a first component of the semiconductor device. A bond material is disposed on the first bonding surface, and a second bonding surface is disposed on a second component of the semiconductor device. The bond material is disposed on the second bonding surface. A first electroplated bond connects the bond material and the first bonding surface, and a second electroplated bond connects the bond material and the second bonding surface.
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公开(公告)号：US20180219005A1
公开(公告)日：2018-08-02
申请号：US15940513
申请日：2018-03-29
Applicant: International Business Machines Corporation
Inventor： Stephen W. Bedell , Bing Dang , Ning Li , Frank R. Libsch , Devendra K. Sadana
IPC: H01L25/075 , H01L33/62
Abstract: Methods of transferring micro-array LEDs of various colors onto a surface of a display substrate are provided. The transferring includes releasing micro-LEDs of a specific color from a structure that includes a releasable material onto a display substrate. The releasable material may be a laser ablatable material or a material that is readily dissolved in a specific etchant.
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Patent Agency Ranking
公开(公告)号：US20180212120A1
公开(公告)日：2018-07-26
申请号：US15416488
申请日：2017-01-26
Applicant: International Business Machines Corporation
Inventor： Stephen W. Bedell , Bing Dang , Ning Li , Frank R. Libsch , Devendra K. Sadana
IPC: H01L33/62 , H01L25/075
CPC classification number: H01L33/62 , H01L25/0753 , H01L2933/0066
Abstract: Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.
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公开(公告)号：US20180211941A1
公开(公告)日：2018-07-26
申请号：US15415505
申请日：2017-01-25
Applicant: International Business Machines Corporation
Inventor： Stephen W. Bedell , Bing Dang , Ning Li , Frank R. Libsch , Devendra K. Sadana
IPC: H01L25/075 , H01L33/62 , H01L33/30 , H01L33/32
CPC classification number: H01L25/0753 , H01L33/30 , H01L33/32 , H01L33/62 , H01L2933/0066
Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.
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公开(公告)号：US10032973B1
公开(公告)日：2018-07-24
申请号：US15416488
申请日：2017-01-26
Applicant: International Business Machines Corporation
Inventor： Stephen W. Bedell , Bing Dang , Ning Li , Frank R. Libsch , Devendra K. Sadana
IPC: H01L21/00 , H01L33/62 , H01L25/075
Abstract: Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.
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公开(公告)号：US10032943B2
公开(公告)日：2018-07-24
申请号：US14974643
申请日：2015-12-18
Applicant: International Business Machines Corporation
Inventor： Bing Dang , John U. Knickerbocker , Steven Lorenz Wright , Cornelia Tsang Yang
IPC: H01L31/024 , H01L31/18
Abstract: A semiconductor structure includes a thin-film device layer, an optoelectronic device disposed in the thin-film device layer, and a surrogate substrate permanently attached to the thin film device layer. The surrogate substrate is optically transparent and has a thermal conductivity of at least 300 W/m-K. The optoelectronic device excitable by visible light transmitted through the surrogate substrate. A method of fabricating the semiconductor structure includes fabricating the optoelectronic device in a device layer thin-film of SiC on a silicon wafer of a first diameter, transferring the device layer thin-film of SiC from the silicon wafer, and permanently bonding the device layer thin-film to a SiC surrogate substrate of a second diameter.
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140.发明申请公开(公告)号：US20180174882A1
公开(公告)日：2018-06-21
申请号：US15900178
申请日：2018-02-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bing Dang , Jeffrey D. Gelorme , John U. Knickerbocker
IPC: H01L21/683 , C09J171/12 , C08K3/04 , C08L63/00 , C09J9/00 , C09J163/00 , C09J171/00 , H01L21/02 , C08G59/06
CPC classification number: H01L21/6835 , C08G59/063 , C08G2650/56 , C08K3/04 , C08L63/00 , C08L71/00 , C09J9/00 , C09J163/00 , C09J171/00 , H01L21/02057 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.
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