摘要:
The invention relates a wiring structure of a vibrator and a piezoelectric pump. On the basis of the recognition that it is difficult to obtain sufficient reliability of connecting parts with a conductive adhesive material only while attention is paid to using the conductive adhesive material instead of soldering, a wiring structure is obtained in which a connecting terminal and a film-like electrode are adhered to each other by a conductive adhesive material, and a pressing member which applies a force in a direction in which the connecting terminal is pressed against the film-like electrode is caused to abut on the connecting terminal.
摘要:
In this side lock apparatus, a opening and closing member is fixed to a support unit so that the opening and closing member can be opened and closed, left and right latches being movably held on the opening and closing member, the left and right latches being urged by a pressure of a spring toward a lock hole formed in the support unit, a free end portion of the latches being moved back from the lock hole in the support member against the spring means by an operation of the operating handle, wherein the left and right latches are operatively connected together via a link lever supported rotatably via a shaft on the opening and closing member, the operating handle being provided with an operating portion engageable with the latch, at least one latch being provided with two contact surfaces engageable with the operating portion of the operating handle.
摘要:
A cylinder liner has an upper portion and a lower portion with respect to an axial direction of the cylinder liner. A high thermal conductive film is provided on an outer circumferential surface of the upper portion. A low thermal conductive film is provided on an outer circumferential surface of the lower portion. The cylinder liner reduces temperature difference of a cylinder along its axial direction.
摘要:
The present invention is to provide a sputtering apparatus and a thin film formation method which make it possible to form respective layers of a multilayer film having a clean interface at a optimum temperature, or which make it possible to continuously carry out the film formation and the surface processing. Another object of this invention is to provide a small sputtering apparatus for forming a multilayer film as compared with prior art apparatus. A sputtering apparatus of this invention comprises a main shaft around which at least one target and at least one surface processing mechanism are installed, a substrate holder holding a substrate or a plurality of substrates arranged facing the target and the surface processing mechanism, and a rotation mechanism to rotate the main shaft or the substrate holder.
摘要:
There is described an improved semiconductor device of chip-scale package (CSP) comprising posts provided on respective electrode pads of a semiconductor chip, and solder balls which are provided on the respective posts as external terminals after the semiconductor chip has been encapsulated with resin while the posts are held in a projecting manner. The semiconductor device prevents occurrence of cracks, which would otherwise be caused by stress which is induced by a difference in coefficient of linear expansion between the semiconductor chip and the sealing resin and is imposed on the posts. In order to alleviate the stress imposed on the posts, a stress-absorbing layer formed from a metal layer having a low Young's modulus, such as gold (Au) or palladium (Pd), is interposed in the middle of each of the posts.
摘要:
The present invention provides a toy that makes character movement realistic, A transparent LCD screen that is visible from the front of the room is disposed within the room so as to be in contact with the walls, ceiling and floor thereof. An internal body such as a chair and an external body such as a tree, fence or kennel are arranged at the front and rear of the LCD screen. A girl character and an animal character are displayed on the LCD screen. A user is able to enjoy the game while viewing the character of the LCD screen, internal body, and external body.
摘要:
A flat-panel display device includes scan lines, signal lines, pixels arrayed at intersections of the scan lines and signal lines and having a surface-conduction electron-emitter, a video processing circuit, a scan line driver, and a signal line driver. The video processing circuit includes a video analysis unit that divides a video signal for one horizontal line into a predetermined number of blocks and obtains average levels of the video signal blocks, a correction coefficient calculation unit that determines correction coefficients for the blocks, which match with voltage drops due to wiring resistance of the scan lines, on the basis of the average levels of the video signal blocks that are obtained by the video analysis unit, and a video signal correction unit that multiplies each video signal block by the associated correction coefficient determined by the correction coefficient calculation unit.
摘要:
A parking assisting device is provided with: a yaw rate sensor for detecting a yaw angle of a vehicle; a controller having a navigation function control unit and a parking assisting function control unit; a function selecting switch for determining switching to a parking assisting mode from a navigation mode; a monitor for providing navigation information, as well as for setting the reference position of the yaw angle and selecting a parking mode; and a speaker for providing parking assisting information to a driver in accordance with a vehicle position specified on the basis of the yaw angle.
摘要:
In connection with a method of manufacturing a semiconductor device including a step of establishing electrical connection between terminal electrodes of a circuit board and electrode pads of a semiconductor substrate by means of ultrasonic vibration, prevention of flaws stemming from ultrasonic vibration is aimed. A semiconductor substrate is mounted on the surface of an insulation circuit board such that terminal electrodes of the insulation circuit board oppose electrode pads of a semiconductor board. Desired electrical connection is established by means of applying ultrasonic vibration between a first holding tool for holding the insulation circuit board and a second holding tool for holding the semiconductor substrate. Ultrasonic vibration is applied while intermediate material of lower hardness is interposed between the first holding tool and the insulation circuit board and while another intermediate material of lower hardness is interposed between the second holding tool and the insulation circuit board.