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    Led chip lamp apparatus
    141.
    发明申请
    Led chip lamp apparatus 审中-公开
    LED芯片灯装置

    公开(公告)号：US20050169006A1

    公开(公告)日：2005-08-04

    申请号：US10766827

    申请日：2004-01-30

    Applicant: Bily Wang ,  Jonnie Chuang ,  Ching Ko

    Inventor： Bily Wang ,  Jonnie Chuang ,  Ching Ko

    IPC: F21S2/00 ,  F21K99/00 ,  F21V7/04

    CPC classification number: F21V29/74 ,  F21K9/00 ,  F21V29/505 ,  F21V29/83 ,  F21Y2107/40 ,  F21Y2115/10

    Abstract: An LED chap lamp apparatus has a heat sink with a reflector, an LED lamp module and a heat pipe. The LED lamp module is assembled on an inside of the reflector for reflecting light of the LED lamp module. The two ends of the heat pipe each connect to the LED lamp module and the heat sink to conduct and disperse the heat produced form the LED chips to increase the lifetime and the light-emitting efficiency of the LED chap lamp apparatus.

    Abstract translation: LED灯具具有具有反射器的散热器，LED灯模块和热管。 LED灯模块组装在反射器的内侧，用于反射LED灯模块的光。 热管的两端分别连接到LED灯模块和散热器，以对从LED芯片产生的热量进行分散，从而提高LED灯具的使用寿命和发光效率。

    Circuit board for large screen LED matrix array display
    143.
    发明申请
    Circuit board for large screen LED matrix array display 有权
    电路板用于大屏幕LED矩阵阵列显示

    公开(公告)号：US20050083275A1

    公开(公告)日：2005-04-21

    申请号：US10685892

    申请日：2003-10-16

    Applicant: Bily Wang ,  Jonnie Chuang ,  John Lin

    Inventor： Bily Wang ,  Jonnie Chuang ,  John Lin

    IPC: G09F9/33 ,  G09G3/32 ,  G09G5/00

    CPC classification number: G09F9/33 ,  G09F9/3026 ,  Y10S248/917 ,  Y10S345/905

    Abstract: Multiple LED matrix array circuit boards are pieced together a form a display panel. L-shape brackets are mounted on the bottom sides of the circuit boards and aligned with the butting edges of the circuit boards. The vertical butting walls are pressed together by clamps. A set screw is inserted in one jaw of the clamp to tighten the pressure between butting edges of the circuit boards. Another set screw is inserted on top of the clamp to align the adjacent boards vertically.

    Abstract translation: 将多个LED矩阵阵列电路板拼接成一个显示面板。 L形支架安装在电路板的底部，并与电路板的对接边缘对齐。 垂直对接墙通过夹具压在一起。 一个固定螺丝插入夹具的一个夹爪中，以紧固电路板对接边缘之间的压力。 另一个固定螺钉插入夹具的顶部，以使相邻的板垂直对齐。

    Focusing cup on a folded frame for surface mount optoelectric semiconductor package
    145.
    发明授权
    Focusing cup on a folded frame for surface mount optoelectric semiconductor package 有权

    公开(公告)号：US06569698B2

    公开(公告)日：2003-05-27

    申请号：US09921253

    申请日：2001-08-03

    Applicant: Bily Wang ,  Bill Chang ,  Chin-Mau James Hwang

    Inventor： Bily Wang ,  Bill Chang ,  Chin-Mau James Hwang

    IPC: H01L2100

    CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48247

    Abstract: A focusing cup is directly glued to two or more preformed folded metal frames. Parts of the top surfaces of the folded metal frames contact the electrodes of semiconductor device placed inside the focusing cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. The preformed metallic frames need not withstand the stress of folding and the package can be made thinner than prior art. The elimination of the through holes makes the package narrower. The bottoms of the metallic frames can be aligned one side of the bottom surface of the package, so that the package can be surface-mounted normally to or in parallel with a motherboard with light emitting respectively in parallel with or normally to the surface of the motherboard.

    LED package chip classification system
    148.
    发明授权
    LED package chip classification system 有权
    LED封装芯片分类系统

    公开(公告)号：US08710387B2

    公开(公告)日：2014-04-29

    申请号：US13204616

    申请日：2011-08-05

    Applicant: Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

    Inventor： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

    IPC: B07C5/00

    CPC classification number: G01R31/01 ,  G01R31/2635

    Abstract: An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.

    Abstract translation: LED封装芯片分类系统包括用于传输多个LED封装芯片的转动单元，芯片测试单元和芯片分类单元。 旋转单元包括旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个抽吸排气双重用途开口。 每个LED封装芯片具有设置在其底侧上的正极焊盘和负极焊盘。 芯片测试单元包括与旋转单元相邻的芯片测试模块，用于测试每个LED封装芯片。 芯片分类单元包括与用于分类LED封装芯片的旋转单元相邻的多个芯片分类模块。 因此，可以通过匹配旋转单元，芯片测试单元和芯片分类单元来分类LED封装芯片。

    LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
    150.
    发明授权
    LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same 有权
    LED芯片封装结构采用高效发光的粗糙表面及其制作方法

    公开(公告)号：US08183065B2

    公开(公告)日：2012-05-22

    申请号：US12896253

    申请日：2010-10-01

    Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

    Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

    IPC: H01L21/00

    CPC classification number: H01L24/97 ,  F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0031 ,  G02B6/0073 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.

    Abstract translation: 通过粗糙表面具有高效发光的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片。 各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖LED芯片的多个封装胶体。 每个包装胶体具有分别形成在其顶表面及其侧表面上的弧形胶体表面和发光胶体表面。

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