公开(公告)号：US20150343224A1

公开(公告)日：2015-12-03

申请号：US14826229

申请日：2015-08-14

Applicant: Greatbatch Ltd.

Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher Michael Williams ,  Robert Naugler ,  Christine A. Frysz

IPC: A61N1/375 ,  H02G15/013

CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H02G15/013 ,  H03H1/00 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an electrically conductive ferrule with an electrically conductive extension at least partially extending into the ferrule opening. An electrically non-conductive insulator hermetically seals the ferrule opening. An electrically conductive pathway is hermetically sealed and disposed through the insulator between a body fluid and device side. A filter capacitor is located on the device side. A first low impedance electrical coupling is between a first metallization of the filter capacitor and the pathway. A ground conductor is disposed through the filter capacitor in non-conductive relation with the at least one active and ground electrode plates, where the ground conductor is electrically coupled to the extension of the ferrule. An oxide-resistant metal addition is disposed on the device side and electrically couples the ground conductor to the second metallization of the filter capacitor.

Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括具有至少部分延伸到套圈开口中的导电延伸部的导电套圈。 非导电绝缘体气密地密封套圈开口。 导电通路密封并通过绝缘体设置在体液和器件侧之间。 滤波电容器位于器件侧。 第一低阻抗电耦合在滤波电容器的第一金属化和通路之间。 接地导体与所述至少一个有源和接地电极板以非导电关系设置穿过所述滤波电容器，其中所述接地导体电耦合到所述套圈的延伸部。 在器件侧设置耐氧化金属添加剂，并将接地导体电耦合到滤波电容器的第二金属化。

公开(公告)号：US09108066B2

公开(公告)日：2015-08-18

申请号：US14202653

申请日：2014-03-10

Applicant: Greatbatch Ltd.

Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher M. Williams ,  Robert Naugler ,  Christine A. Frysz

IPC: A61N1/00 ,  A61N1/375 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/00 ,  H01G4/35 ,  H01G2/02 ,  H01G4/228 ,  H03H7/01

CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括密封到导电套圈或壳体的绝缘体。 导体被气密地密封并且通过绝缘体以非导电关系设置在导体套管或壳体之间，在体液侧和器件侧之间。 馈通电容器设置在器件侧。 第一低阻抗电连接在电容器的第一端金属化和导体之间。 第二低阻抗电连接在电容器的第二端金属化和套圈或壳体之间。 第二低阻抗电连接包括直接连接到套圈或壳体的耐氧化金属添加剂和将第二端金属化物电和物理直接耦合到耐氧化金属添加物的电连接。

公开(公告)号：US20150116053A1

公开(公告)日：2015-04-30

申请号：US14065431

申请日：2013-10-29

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Warren S. Dabney ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  H03H7/01

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3754 ,  H01F17/0006 ,  H01F17/02 ,  H01F17/04 ,  H01F2017/0073 ,  H01G4/12 ,  H01G4/28 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H03H1/00 ,  H03H7/0115 ,  H03H7/0161 ,  H03H7/38 ,  H03H2001/005

Abstract: A header block is configured to be attachable to an implantable medical device. The header block includes a header block body and a connection port disposed in the header block body configured to receive an implantable lead. A conductor is disposed in the header block body electrically coupled to the connection port at a first end and connectable at a second end to the implantable medical device. An impeding device is electrically coupled in series along the length of the conductor and disposed within the header block body. The impeding device is configured to raise the high-frequency impedance of the conductor. The impeding device may include a bandstop filter or an L-C tank circuit.

Abstract translation: 标题块被配置为可附接到可植入医疗装置。 标题块包括标题块主体和设置在头部块主体中的配置为接收可植入引线的连接端口。 导体被布置在头部块体中，第一端部电耦合到连接端口，并且在第二端处可连接到可植入医疗装置。 阻碍装置沿着导体的长度串联电耦合并设置在集管块体内。 阻碍装置被配置为提高导体的高频阻抗。 阻碍装置可以包括带阻滤波器或L-C槽电路。

公开(公告)号：US20140036409A1

公开(公告)日：2014-02-06

申请号：US13743276

申请日：2013-01-16

Applicant: GREATBATCH LTD.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

公开(公告)号：US20130235550A1

公开(公告)日：2013-09-12

申请号：US13873832

申请日：2013-04-30

Applicant: GREATBATCH LTD.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Warren S. Dabney ,  Robert Shawn Johnson

IPC: H05K9/00

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  A61N2001/086 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K2201/10015

Abstract: A shielded three-terminal flat-through EMI/energy dissipating filter includes an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and a second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. In preferred embodiments, the active electrode plate and the shield plates are at least partially disposed with a hybrid flat-through substrate that may include a flex cable section, a rigid cable section, or both.

Abstract translation: 屏蔽三端子平通EMI /消能滤波器包括有源电极板，电路电流通过该有源电极板在第一端子和第二端子之间通过，第一屏蔽板位于有源电极板的第一侧上，第二屏蔽板 屏蔽板在与第一屏蔽板相对的有源电极板的第二侧上。 第一和第二屏蔽板导电地耦合到接地的第三端子。 在优选实施例中，有源电极板和屏蔽板至少部分地布置有可以包括柔性电缆部分，刚性电缆部分或两者的混合平整基板。

公开(公告)号：US20130226262A1

公开(公告)日：2013-08-29

申请号：US13858268

申请日：2013-04-08

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Barry C. Muffoletto ,  Robert W. Siegler ,  Steven W. Winn ,  Thomas A. Skwara ,  Dominick J. Frustaci

IPC: A61N1/36

CPC classification number: A61N1/36135 ,  A61N1/36082 ,  A61N1/37282 ,  A61N1/37288

Abstract: Deep brain electrodes are remotely sensed and activated by means of a remote active implantable medical device (AIMD). In a preferred form, a pulse generator is implanted in the pectoral region and includes a hermetic seal through which protrudes a conductive leadwire which provides an external antenna for transmission and reception of radio frequency (RF) pulses. One or more deep brain electrode modules are constructed and placed which can transmit and receive RF energy from the pulse generator. An RF telemetry link is established between the implanted pulse generator and the deep brain electrode assemblies. The satellite modules are configured for generating pacing pulses for a variety of disease conditions, including epileptic seizures, Turrets Syndrome, Parkinson's Tremor, and a variety of other neurological or brain disorders.

Abstract translation: 通过远程有源可植入医疗设备（AIMD）远程感测和激活深脑电极。 在优选形式中，脉冲发生器被植入胸部区域并且包括气密密封，通过该气密密封件突出提供用于射频（RF）脉冲的发射和接收的外部天线的导电引线。 一个或多个深脑电极模块被构造和放置，其可以从脉冲发生器发射和接收RF能量。 在植入的脉冲发生器和深脑电极组件之间建立RF遥测链路。 卫星模块被配置用于产生用于各种疾病状况的起搏脉冲，包括癫痫发作，炮塔综合征，帕金森氏颤颤和各种其他神经或脑部疾病。