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    Semiconductor package
    145.
    发明授权
    Semiconductor package 审中-公开

    公开(公告)号：US10672723B2

    公开(公告)日：2020-06-02

    申请号：US16392815

    申请日：2019-04-24

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Jing-Cheng Lin ,  Chin-Chuan Chang ,  Jui-Pin Hung

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/03 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10

    Abstract: Some embodiments relate to a semiconductor package. The package includes a redistribution layer (RDL), and a first semiconductor die disposed over the RDL. The first semiconductor die includes a plurality of contact pads electrically coupled to the RDL. The RDL enables fan-out connection of the first semiconductor die. A die package is disposed over the first semiconductor die and over the RDL. The die package is coupled to a first surface of the RDL by a plurality of conductive bump structures. The plurality of conductive bump structures laterally surround the plurality of contact pads and have uppermost surfaces that are level with an uppermost surface of the first semiconductor die.

    Package structure, integrated fan-out package and method of fabricating the same
    146.
    发明授权
    Package structure, integrated fan-out package and method of fabricating the same 有权

    公开(公告)号：US10522476B2

    公开(公告)日：2019-12-31

    申请号：US15652247

    申请日：2017-07-18

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Li-Hui Cheng ,  Jing-Cheng Lin ,  Po-Hao Tsai

    IPC: H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L23/50

    Abstract: A package structure including an integrated fan-out package and plurality of conductive terminals is provided. The integrated fan-out package includes an integrated circuit component, a plurality of conductive through vias, an insulating encapsulation having a first surface and a second surface opposite to the first surface, and a redistribution circuit structure. The insulating encapsulation laterally encapsulates the conductive through vias and the integrated circuit component. Each of conductive through vias includes a protruding portion accessibly revealed by the insulating encapsulation. The redistribution circuit structure is electrically connected to the integrated circuit component and covers the first surface of the insulating encapsulation and the integrated circuit component. The conductive terminals are disposed on and electrically connected to the protruding portions of the conductive through vias, and a plurality of intermetallic compound caps are formed between the conductive terminals and the protruding portions.

    Package structure and method of manufacturing the same
    148.
    发明授权
    Package structure and method of manufacturing the same 有权

    公开(公告)号：US10340253B2

    公开(公告)日：2019-07-02

    申请号：US15716506

    申请日：2017-09-26

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Shu-Hang Liao ,  Chih-Wei Wu ,  Jing-Cheng Lin ,  Szu-Wei Lu ,  Ying-Ching Shih

    IPC: H01L25/065 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

    Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a bridge, an underfill layer and a RDL structure. The first die and the second die are placed side by side. The first encapsulant encapsulates sidewalls of the first die and sidewalls of the second die. The bridge electrically connects the first die and the second die through two conductive bumps. The underfill layer fills the space between the bridge and the first die, between the bridge and the second die, and between the bridge and a portion of the first encapsualnt. The RDL structure is located over the bridge and electrically connected to the first die and the second die though a plurality of TIVs. The bottom surfaces of the two conductive bumps are level with a bottom surface of the underfill layer.

    Integrated fan-out package and method of fabricating the same
    149.
    发明授权
    Integrated fan-out package and method of fabricating the same 有权

    公开(公告)号：US10157870B1

    公开(公告)日：2018-12-18

    申请号：US15716494

    申请日：2017-09-26

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chih-Wei Wu ,  Jing-Cheng Lin ,  Szu-Wei Lu ,  Ying-Ching Shih

    IPC: H01L23/12 ,  H01L23/00 ,  H01L21/768 ,  H01L23/522 ,  H01L23/31 ,  H01L21/683 ,  H01L23/532

    Abstract: A method of fabricating an integrated fan-out package is described. The method includes the following steps. A carrier is provided. Through insulator vias are formed on the carrier, and at least one semiconductor die is provided on the carrier. The semiconductor die is attached to the carrier through a die attach film. An insulating encapsulant having a first region and a second region is formed on the carrier. The insulating encapsulant in the first region is encapsulating the semiconductor die, and the insulating encapsulant in the second region is encapsulating the plurality of through insulator vias. The carrier is debonded, and a trimming process is performed to remove portions of the insulating encapsulant in the second region, and a trench is formed in the insulating encapsulant in the second region. A plurality of conductive balls is disposed on the insulating encapsulant in the second region. The plurality of conductive balls surround the first region of the insulating encapsulant and the die attach film, and is electrically connected to the plurality of through insulator vias.

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