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公开(公告)号：US20180351119A1
公开(公告)日：2018-12-06
申请号：US16046768
申请日：2018-07-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Martin B. Wolk , Michael Benton Free , Margaret M. Vogel-Martin , Evan L. Schwartz , Mieczyslaw H. Mazurek , Terry O. Collier
IPC: H01L51/00 , B32B3/26 , C03C17/28 , H01L27/32 , G03F7/00 , B82Y40/00 , G03F7/34 , G03F7/16 , C03C17/34
CPC classification number: H01L51/0097 , B32B3/263 , B81C2201/0191 , B82Y40/00 , C03C17/28 , C03C17/34 , G03F7/0002 , G03F7/161 , G03F7/34 , H01L27/322 , H01L27/3244 , H01L51/004 , H01L51/0094 , H01L2221/68368 , H01L2227/326 , H01L2251/301 , H01L2251/5338 , H01L2251/5369 , Y10T428/24521
Abstract: Organic light emitting diode (OLED) devices are disclosed that include a first layer; a backfill layer having a structured first side and a second side; a planarization layer having a structured first side and a second side; and a second layer; wherein the second side of the backfill layer is coincident with and adjacent to the first layer, the second side of the planarization layer is coincident with and adjacent to the second layer, the structured first side of the backfill layer and structured first side of the planarization layer form a structured interface, the refractive index of the backfill later is index matched to the first layer, and the refractive index of the planarization layer is index matched to the second layer.
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142.发明申请公开(公告)号：US20160104851A1
公开(公告)日：2016-04-14
申请号：US14969625
申请日：2015-12-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Martin B. Wolk , Michael Benton Free , Margaret M. Vogel-Martin , Evan L. Schwartz , Mieczyslaw H. Mazurek , Terry O. Collier
CPC classification number: H01L51/0097 , B32B3/263 , B81C2201/0191 , B82Y40/00 , C03C17/28 , C03C17/34 , G03F7/0002 , G03F7/161 , G03F7/34 , H01L27/322 , H01L27/3244 , H01L51/004 , H01L51/0094 , H01L2221/68368 , H01L2227/326 , H01L2251/301 , H01L2251/5338 , H01L2251/5369 , Y10T428/24521
Abstract: Organic light emitting diode (OLED) devices are disclosed that include a first layer; a backfill layer having a structured first side and a second side; a planarization layer having a structured first side and a second side; and a second layer; wherein the second side of the backfill layer is coincident with and adjacent to the first layer, the second side of the planarization layer is coincident with and adjacent to the second layer, the structured first side of the backfill layer and structured first side of the planarization layer form a structured interface, the refractive index of the backfill layer is index matched to the first layer, and the refractive index of the planarization layer is index matched to the second layer.
Abstract translation: 公开了包括第一层的有机发光二极管（OLED）器件; 具有结构化第一侧和第二侧的回填层; 具有结构化第一侧和第二侧的平坦化层; 和第二层; 其中所述回填层的第二侧与所述第一层重合并且与所述第一层相邻，所述平坦化层的第二侧与所述第二层重叠并相邻，所述回填层的所述结构化的第一侧和所述平坦化的结构化的第一侧 层形成结构化界面，回填层的折射率与第一层折射率匹配，并且平坦化层的折射率与第二层折射率匹配。
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公开(公告)号：US09138973B1
公开(公告)日：2015-09-22
申请号：US14251775
申请日：2014-04-14
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： Yu-Jun He , Dong-Qi Li , Tian-Yi Li , Yang Wei , Kai-Li Jiang , Shou-Shan Fan
IPC: H01L21/20 , H01L21/36 , H01L21/30 , B05D1/18 , B29C65/00 , B32B37/00 , B32B37/12 , B32B37/30 , B32B38/08
CPC classification number: B32B37/025 , B32B37/12 , B32B37/30 , B32B38/08 , B32B38/10 , B32B2305/22 , B32B2309/16 , B32B2309/66 , B32B2311/04 , B32B2311/18 , B32B2311/24 , B32B2333/12 , B81B2207/056 , B81C1/00031 , B81C2201/0191 , B81C2201/0194 , B82B3/0014 , B82B3/0076
Abstract: A method for transferring nanostructures includes providing a growth substrate and a number of nanostructures located on the growth substrate. The nanostructures are transferred by an adhesive layer from the growth substrate to a target substrate. The nanostructures are between the target substrate and the adhesive layer, and at least partial of nanostructures is in contact with a surface of the target substrate. The adhesive layer is covered by a metal layer. The adhesive layer together with the metal layer is separated from the nanostructures and the target substrate in an organic solvent by an external force, wherein the organic solvent permeates into an interface between the adhesive layer and the nanostructures.
Abstract translation: 转移纳米结构的方法包括提供生长衬底和位于生长衬底上的许多纳米结构。 纳米结构通过粘合剂层从生长衬底转移到目标衬底。 纳米结构位于目标基底和粘合剂层之间，并且至少部分纳米结构与目标基底的表面接触。 粘合剂层被金属层覆盖。 粘合剂层与金属层一起通过外力与有机溶剂中的纳米结构和靶基材分离，其中有机溶剂渗入粘合剂层和纳米结构之间的界面。
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公开(公告)号：US09102515B2
公开(公告)日：2015-08-11
申请号：US14054679
申请日：2013-10-15
Inventor： Kwangyeol Lee
IPC: B81C1/00
CPC classification number: B81C1/00031 , B81C1/00373 , B81C2201/0149 , B81C2201/0191 , Y10T428/24612 , Y10T428/24802
Abstract: Nano structure patterning formation includes coating a part of a structural guide with a hydrophobic polymer, positioning the structural guide on a substrate, coating at least a part of the substrate with a film made of a block copolymer, and annealing the film made of the block copolymer to align the block copolymer.
Abstract translation: 纳米结构图案形成包括用疏水聚合物涂覆结构导向器的一部分，将结构引导件定位在基底上，用由嵌段共聚物制成的膜涂覆至少一部分基底，并且将由该块制成的膜退火 共聚物以对齐嵌段共聚物。
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公开(公告)号：US09029963B2
公开(公告)日：2015-05-12
申请号：US14034986
申请日：2013-09-24
Applicant: Andrew Sparks , Todd M. Borkowski
Inventor： Andrew Sparks , Todd M. Borkowski
CPC classification number: H04R17/02 , B81B3/0018 , B81B2201/0257 , B81C1/00158 , B81C2201/0191 , G01L9/008 , H04R2201/003
Abstract: Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm through signals emitted by the piezoelectric stack.
Abstract translation: 机械共振结构，以及相关设备和制造方法。 机械谐振结构可以是麦克风，每个麦克风包括隔膜和压电叠层。 隔膜可以具有穿过其中形成的一个或多个开口，以使得能够通过由压电叠层发射的信号来确定施加到隔膜的声压。
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Patent Agency Ranking
公开(公告)号：US20140084395A1
公开(公告)日：2014-03-27
申请号：US14034986
申请日：2013-09-24
Applicant: Andrew Sparks , Todd M. Borkowski
Inventor： Andrew Sparks , Todd M. Borkowski
CPC classification number: H04R17/02 , B81B3/0018 , B81B2201/0257 , B81C1/00158 , B81C2201/0191 , G01L9/008 , H04R2201/003
Abstract: Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm through signals emitted by the piezoelectric stack.
Abstract translation: 机械共振结构，以及相关设备和制造方法。 机械谐振结构可以是麦克风，每个麦克风包括隔膜和压电叠层。 隔膜可以具有穿过其中形成的一个或多个开口，以使得能够通过由压电叠层发射的信号来确定施加到隔膜的声压。
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公开(公告)号：US20140044933A1
公开(公告)日：2014-02-13
申请号：US14054679
申请日：2013-10-15
Inventor： Kwangyeol LEE
IPC: B81C1/00
CPC classification number: B81C1/00031 , B81C1/00373 , B81C2201/0149 , B81C2201/0191 , Y10T428/24612 , Y10T428/24802
Abstract: Nano structure patterning formation includes coating a part of a structural guide with a hydrophobic polymer, positioning the structural guide on a substrate, coating at least a part of the substrate with a film made of a block copolymer, and annealing the film made of the block copolymer to align the block copolymer.
Abstract translation: 纳米结构图案形成包括用疏水聚合物涂覆结构导向器的一部分，将结构引导件定位在基底上，用由嵌段共聚物制成的膜涂覆至少一部分基底，并且将由该块制成的膜退火 共聚物以对齐嵌段共聚物。
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公开(公告)号：US20130302934A1
公开(公告)日：2013-11-14
申请号：US13981504
申请日：2012-01-24
Applicant: Ayako Kato , Kazutoshi Torashima , Yasuhiro Soeda , Shinichiro Watanabe
Inventor： Ayako Kato , Kazutoshi Torashima , Yasuhiro Soeda , Shinichiro Watanabe
IPC: H01L41/33
CPC classification number: H01L41/33 , B06B1/0292 , B81B3/0072 , B81B2201/0271 , B81B2203/0127 , B81C1/00158 , B81C2201/0191
Abstract: Provided is a method of manufacturing a capacitive electromechanical transducer using fusion bonding, which is capable of reducing fluctuations in initial deformation among diaphragms caused at positions having different boundary conditions such as the bonding area, thereby enhancing the uniformity of the transducer and stabilizing the sensitivity and the like. The method of manufacturing a capacitive electromechanical transducer includes: forming an insulating layer on a first silicon substrate and forming at least one recess; fusion bonding a second silicon substrate onto the insulating layer; and thinning the second silicon substrate and forming a silicon film. The method further includes, before the bonding of the second silicon substrate onto the insulating layer, forming a groove in the insulating layer at the periphery of the at least one recess.
Abstract translation: 提供一种使用熔接的制造电容式机电换能器的方法，其能够减少在具有不同边界条件（例如接合面积）的位置处引起的膜片之间的初始变形的波动，从而增强换能器的均匀性并稳定灵敏度， 类似。 制造电容式机电换能器的方法包括：在第一硅衬底上形成绝缘层并形成至少一个凹槽; 将第二硅衬底熔合到所述绝缘层上; 并使第二硅衬底变薄并形成硅膜。 该方法还包括在将第二硅衬底接合到绝缘层之前，在至少一个凹部的周边处在绝缘层中形成凹槽。
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公开(公告)号：US08563086B2
公开(公告)日：2013-10-22
申请号：US12507718
申请日：2009-07-22
Applicant: Kwangyeol Lee
Inventor： Kwangyeol Lee
CPC classification number: B81C1/00031 , B81C1/00373 , B81C2201/0149 , B81C2201/0191 , Y10T428/24612 , Y10T428/24802
Abstract: Nano structure patterning formation includes coating a part of a structural guide with a hydrophobic polymer, positioning the structural guide on a substrate, coating at least a part of the substrate with a film made of a block copolymer, and annealing the film made of the block copolymer to align the block copolymer.
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公开(公告)号：US08404568B2
公开(公告)日：2013-03-26
申请号：US12163277
申请日：2008-06-27
Applicant: Michael Foster , Shifang Zhou
Inventor： Michael Foster , Shifang Zhou
IPC: H01L21/326
CPC classification number: B81C3/001 , B81B2203/0392 , B81C1/00103 , B81C2201/019 , B81C2201/0191 , B81C2203/038
Abstract: System and methods offset mechanism elements during fabrication of Micro-Electro-Mechanical Systems (MEMS) devices. An exemplary embodiment applies a voltage across an offset mechanism element and a bonding layer of a MEMS device to generate an electrostatic charge between the offset mechanism element and the bonding layer, wherein the electrostatic charge draws the offset mechanism element to the bonding layer. The offset mechanism element and the bonding layer are then bonded.
Abstract translation: 微机电系统（MEMS）器件制造过程中的系统和方法偏移机制元件。 示例性实施例施加电压跨越MEMS装置的偏移机构元件和结合层，以在偏置机构元件和结合层之间产生静电荷，其中静电电荷将偏移机构元件拉到粘合层。 然后粘合偏移机构元件和粘合层。
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