公开(公告)号：US08188555B2

公开(公告)日：2012-05-29

申请号：US12277329

申请日：2008-11-25

Applicant: Yasushi Igarashi

Inventor： Yasushi Igarashi

IPC: H01L29/84

CPC classification number: G01P15/125 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2207/092 ,  B81C1/00301 ,  G01P1/023 ,  G01P2015/0828

Abstract: A capacitive sensor includes a semiconductor substrate, a fixed electrode serving as a first electrode formed on a surface of or in the semiconductor substrate, a structure formed on the semiconductor substrate to have a vibratable second electrode that is formed to be spaced from and opposed to the semiconductor substrate and from the fixed electrode serving as the first electrode, a sealing member serving as a first sealing member formed on the semiconductor substrate to be spaced from the structure, to cover the structure, and to have a through hole serving as a first through hole, and a movable electrode serving as a vibratable third electrode formed on the sealing member to block up the through hole, and to be spaced from and opposed to the movable electrode.

Abstract translation: 电容传感器包括半导体衬底，用作形成在半导体衬底的表面上或半导体衬底中的第一电极的固定电极，形成在半导体衬底上的结构，以具有形成为与第二电极间隔开并与之相对的可振动的第二电极 半导体衬底和用作第一电极的固定电极，用作第一密封构件的密封构件，形成在半导体衬底上以与结构间隔开以覆盖结构，并且具有用作第一电极的通孔 通孔，以及用作可振动的第三电极的可动电极，形成在密封构件上以阻挡通孔，并与可动电极间隔开并与之相对。

公开(公告)号：US08093926B2

公开(公告)日：2012-01-10

申请号：US12599779

申请日：2009-01-27

Applicant: Fumihito Inukai ,  Yoichi Kaino

Inventor： Fumihito Inukai ,  Yoichi Kaino

IPC: H03K3/00

CPC classification number: G01C19/5607 ,  G01P15/125 ,  G01P2015/0828

Abstract: A physical quantity detection circuit (12) is used for a physical quantity sensor (10) that outputs a sensor signal according to a physical quantity given externally. In the physical quantity detection circuit (12), an analog-to-digital converter (104) converts an analog sensor signal (Ssnc) to a digital sensor signal (Dsnc). A digital filter (100) attenuates a frequency component of the digital sensor signal (Dsnc) that is higher than a predetermined cutoff frequency. A multiplier (106) multiplies a digital sensor signal (Dps) having passed the digital filter (100) by a digital detection signal (Ddet) to detect a digital physical quantity signal (Dphy).

Abstract translation: 物理量检测电路（12）用于根据外部给出的物理量输出传感器信号的物理量传感器（10）。 在物理量检测电路（12）中，模拟数字转换器（104）将模拟传感器信号（Ssnc）转换为数字传感器信号（Dsnc）。 数字滤波器（100）衰减高于预定截止频率的数字传感器信号（Dsnc）的频率分量。 乘法器（106）将通过数字滤波器（100）的数字传感器信号（Dps）乘以数字检测信号（Ddet）以检测数字物理量信号（Dphy）。

公开(公告)号：US08093119B2

公开(公告)日：2012-01-10

申请号：US12490318

申请日：2009-06-24

Applicant: Tsung-Min Hsieh ,  Chien-Hsing Lee

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee

IPC: H01L21/8238

CPC classification number: B81C1/00246 ,  B81B2201/0235 ,  B81C2203/0714 ,  G01L9/0042 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0828

Abstract: A method for fabricating the MEMS device includes providing a substrate. Then, a structural dielectric layer is formed over the substrate at a first side, wherein a diaphragm is embedded in the structural dielectric layer. The substrate is patterned from a second side to form a cavity in corresponding to the diaphragm and a plurality of venting holes in the substrate. An isotropic etching process is performed from the first side and the second side of the substrate via vent holes to remove a dielectric portion of the structural dielectric layer for exposing a central portion of the diaphragm while an end portion is held by a residue portion of the structural dielectric layer.

Abstract translation: 一种用于制造MEMS器件的方法包括提供衬底。 然后，在第一面上在基板上形成结构介电层，其中隔膜嵌入在结构介电层中。 衬底从第二侧构图，以形成对应于隔膜的空腔和衬底中的多个排气孔。 从衬底的第一侧和第二侧经由通气孔进行各向同性蚀刻处理，以去除结构介质层的电介质部分，用于暴露隔膜的中心部分，同时端部被残留部分保持 结构介电层。

公开(公告)号：US07998556B2

公开(公告)日：2011-08-16

申请号：US12493380

申请日：2009-06-29

Applicant: Kazuhiro Yoshida ,  Shikou Miyazaki

Inventor： Kazuhiro Yoshida ,  Shikou Miyazaki

IPC: B32B3/00 ,  B32B27/00 ,  B32B27/06 ,  G01P15/08

CPC classification number: G01P15/0802 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/032 ,  G01P1/023 ,  G01P15/123 ,  G01P2015/0828 ,  H01L41/1132 ,  H03H9/1071 ,  Y10T428/24331 ,  Y10T428/24562 ,  Y10T428/31623 ,  Y10T428/31721

Abstract: An element structure has a polyimide resin applied on a surface of a first substrate to a uniform thickness, and is subsequently heated to form a semi-cured polyimide layer. The polyimide layer is then cured to form a cured first polyimide layer. A polyimide resin is applied on a surface of a second substrate to a uniform thickness, and is subsequently heated to form a semi-cured polyimide layer. The polyimide layer is then cured to form a cured second polyimide layer. The cured first and second polyimide layers are pressed on each other and heated to a bonding temperature, thereby joining the polyimide layers together. Thus, the first substrate and the second substrate are combined with the polyimide layer being the bonded structure of the polyimide layers therebetween.

Abstract translation: 元件结构具有在第一基板的表面上施加到均匀厚度的聚酰亚胺树脂，随后被加热以形成半固化的聚酰亚胺层。 然后将聚酰亚胺层固化以形成固化的第一聚酰亚胺层。 将聚酰亚胺树脂施加到第二基板的表面上以均匀的厚度，随后被加热以形成半固化的聚酰亚胺层。 然后将聚酰亚胺层固化以形成固化的第二聚酰亚胺层。 将固化的第一和第二聚酰亚胺层彼此挤压并加热至接合温度，从而将聚酰亚胺层接合在一起。 因此，第一基板和第二基板与其间的聚酰亚胺层的结合结构的聚酰亚胺层组合。

公开(公告)号：US07989906B2

公开(公告)日：2011-08-02

申请号：US11562331

申请日：2006-11-21

Applicant: Joseph Colby McAlexander, III

Inventor： Joseph Colby McAlexander, III

IPC: H01L49/02

CPC classification number: H01H35/14 ,  B81B2201/0235 ,  B81B2201/032 ,  B81C1/0015 ,  B81C2201/019 ,  G01P15/125 ,  G01P15/135 ,  G01P2015/0828 ,  H01H1/0036

Abstract: An acceleration sensor includes a semiconductor substrate, a first layer formed on the substrate, a first aperture within the first layer, and a beam coupled at a first end to the substrate and suspended above the first layer for a portion of the length thereof. The beam includes a first boss coupled to a lower surface thereof and suspended within the first aperture, and a second boss coupled to an upper surface of the second end of the beam. A second layer is positioned on the first layer over the beam and includes a second aperture within which the second boss is suspended by the beam. Contact surfaces are positioned within the apertures such that acceleration of the substrate exceeding a selected threshold in either direction along a selected axis will cause the beam to flex counter to the direction of acceleration and make contact through one of the bosses with one of the contact surfaces.

Abstract translation: 加速度传感器包括半导体衬底，形成在衬底上的第一层，第一层内的第一孔，以及在第一端处耦合到衬底并在其长度的一部分上悬浮在第一层上方的梁。 梁包括联接到其下表面并悬挂在第一孔内的第一凸起，以及联接到梁的第二端的上表面的第二凸台。 第二层位于梁上的第一层上，并且包括第二孔，第二凸起由梁悬挂在该第二孔内。 接触表面定位在孔内，使得沿着所选择的轴线在任一方向超过选定阈值的基底的加速度将导致梁相对于加速方向弯曲并且通过一个凸起与其中一个接触表面 。

公开(公告)号：US20110100125A1

公开(公告)日：2011-05-05

申请号：US12913256

申请日：2010-10-27

Applicant: Kenta SATO

Inventor： Kenta SATO

IPC: G01P15/10

CPC classification number: G01P15/097 ,  G01P2015/0828

Abstract: An acceleration sensor includes: a sensitive element having a vibrating beam, base ends located at both ends of the vibrating beam, and excitation electrodes which are formed on a surface of the vibrating beam; a supporting section connected to each of the base ends in order to support the sensitive element; a connecting section which is provided between one of the base ends and the supporting section so as to extend from the one base end in the opposite direction to the one base end on the same axis as the vibrating beam and which has a thin section formed along the longitudinal direction of the vibrating beam; and a spindle section which is disposed at both sides of the sensitive element in the width direction in a state of being connected to the one base end and extends toward the other base end side along the longitudinal direction.

Abstract translation: 一种加速度传感器包括：具有振动梁的敏感元件，位于振动梁两端的基端部和形成在振动梁表面上的激励电极; 连接到每个基端的支撑部分，以便支撑敏感元件; 连接部分，其设置在一个基端和支撑部分之间，以便沿与振动梁相同的轴线上的一个基端沿相反方向从一个基端延伸，并且具有沿着 振动梁的纵向方向; 以及主轴部，其在与所述一个基端连接的状态下沿着所述长度方向朝向另一基端侧而在所述宽度方向上配置在所述敏感元件的两侧。

公开(公告)号：US20100132185A1

公开(公告)日：2010-06-03

申请号：US12702553

申请日：2010-02-09

Applicant: Hiroki HORIGUCHI ,  Yuji KIMURA ,  Kazuhiro YOSHIDA

Inventor： Hiroki HORIGUCHI ,  Yuji KIMURA ,  Kazuhiro YOSHIDA

IPC: B23P17/00

CPC classification number: G01P15/18 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81C1/00269 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0828 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T156/10 ,  H01L2924/00

Abstract: A triaxial acceleration sensor which has a structure including a cover joined to a substrate including a mechanically operable functional unit to be sealed, is adapted in such a way that the joined state can be reliably obtained so as to not interfere with a displacement of the functional unit. A sealing frame is made of a heated polyimide on a periphery of an upper main surface of a substrate provided with a functional unit, and a sealing layer made of a polyimide is formed over an entire lower main surface of a cover. For integrating the substrate and the cover so as to seal the functional unit, the sealing frame and the sealing layer are joined to each other by heating and pressurizing the sealing frame and the sealing layer at a temperature that is about 50° C. to about 150° C. higher than a glass transition temperature of the polyimide while bringing the sealing frame and the sealing layer into contact with each other. In this case, a recess is formed in the vicinity of a portion of the sealing layer to be brought into contact with the sealing frame so that a bump, generated from the sealing layer which is deformed in the joining step, is prevented from protruding toward the functional unit.

Abstract translation: 一种三轴加速度传感器，其具有包括接合到包括要被密封的机械可操作功能单元的基板的盖的结构，使得可以可靠地获得接合状态，以便不干扰功能的位移 单元。 密封框架由设置有功能单元的基板的上主表面的周边上的加热的聚酰亚胺制成，并且在盖的整个下主表面上形成由聚酰亚胺制成的密封层。 为了整合基板和盖以便密封功能单元，密封框架和密封层通过在约50℃到约50℃的温度下加热和加压密封框架和密封层而彼此接合 比使聚酰亚胺的玻璃化转变温度高150℃，同时使密封框和密封层相互接触。 在这种情况下，在密封层的一部分附近形成凹部以与密封框架接触，从而防止在接合步骤中变形的密封层产生的凸块朝向 功能单元。

公开(公告)号：US20100083760A1

公开(公告)日：2010-04-08

申请号：US12247921

申请日：2008-10-08

Applicant: Paul W. Dwyer

Inventor： Paul W. Dwyer

IPC: G01P15/105 ,  G01P15/125

CPC classification number: G01P15/132 ,  G01P15/125 ,  G01P2015/0828

Abstract: Microelectromechanical (MEMS) accelerometer and acceleration sensing methods. A MEMS accelerometer includes a proof mass suspended by at least one hinge type flexure, at least one planar coil located on the proof mass, and at least one magnet positioned such that a magnetic flux field passes through the at least one planar coil at an angle between approximately 30 degrees and approximately 60 degrees relative to the coil plane. In an example embodiment, the angle is approximately 45 degrees. The at least one magnet may include a first annular magnet positioned on a first side of the poof mass and a second annular magnet positioned on a second side of the proof mass. A method includes sensing a capacitance of a pickoff in the MEMS accelerometer and rebalancing the MEMS accelerometer by sending a current through the planar coil.

Abstract translation: 微机电（MEMS）加速度计和加速度传感方法。 MEMS加速度计包括通过至少一个铰链型挠曲件悬挂的检验质量块，位于证明块上的至少一个平面线圈，以及定位成使得磁通场以一定角度穿过至少一个平面线圈的至少一个磁体 在相对于线圈平面约30度至约60度之间。 在示例性实施例中，该角度为大约45度。 所述至少一个磁体可以包括位于所述物体的第一侧上的第一环形磁体和位于所述证明块的第二侧上的第二环形磁体。 一种方法包括感测MEMS加速度计中的传感器的电容，并通过发送电流通过平面线圈来重新平衡MEMS加速度计。

公开(公告)号：US20100064813A1

公开(公告)日：2010-03-18

申请号：US12556778

申请日：2009-09-10

Applicant: Ryuta NISHIZAWA ,  Takahiro KAMETA

Inventor： Ryuta NISHIZAWA ,  Takahiro KAMETA

IPC: G01H13/00 ,  H01L41/04

CPC classification number: G01P15/097 ,  G01P2015/0828

Abstract: A vibratory sensor includes a resonator element including (i) a first base portion and a second base portion, each of the first and the second base portions having an upper main surface and a lower main surface, (ii) a resonating arm extended in a beam shape between the first and the second base portions to be vibrated at a predetermined resonance frequency, (iii) a first narrow portion formed by reducing a width of a portion extended from the first base portion to be smaller than a width of the first base portion in a direction orthogonal to an extending direction of the resonating arm, (iv) a second narrow portion formed by reducing a width of a portion extended from the second base portion to be smaller than a width of the second base portion in the direction orthogonal to the extending direction of the resonating arm, (v) a first support portion extended from the first narrow portion in a direction opposite to the first base portion, and (vi) a second support portion extended from the second narrow portion in a direction opposite to the second base portion, a length ratio of the first narrow portion versus the first base portion in the extending direction of the resonating arm and a length ratio of the second narrow portion versus the second base portion in the extending direction of the resonating arm being in a range of 50 to 200% inclusive; and a base supporting the resonator element, the base being connected to one of upper and lower main surfaces of each of the first and the second support portions included in the resonator element.

Abstract translation: 振动传感器包括谐振器元件，其包括：（i）第一基部和第二基部，第一和第二基部中的每一个具有上主表面和下主表面，（ii） 在第一和第二基部之间的光束形状以预定的谐振频率振动，（iii）通过将从第一基部延伸的部分的宽度减小而形成的第一窄部小于第一基部的宽度 在与所述谐振臂的延伸方向正交的方向上的部分，（iv）通过将从所述第二基部延伸的部分的宽度减小到比所述第二基部的宽度小的方式形成的第二窄部， （v）从与所述第一基部相反的方向从所述第一窄部延伸的第一支撑部，以及（vi）从所述第一支撑部延伸的第二支撑部， 所述第二窄部在与所述第二基部相反的方向上，所述第一窄部与所述第一基部在所述共鸣臂的延伸方向上的长度比和所述第二窄部相对于所述第二基部的长度比在 谐振臂的延伸方向在50〜200％的范围内; 以及支撑所述谐振器元件的基座，所述基座连接到包括在所述谐振器元件中的所述第一和第二支撑部分中的每一个的上主表面和下主表面中的一个。

公开(公告)号：US07658109B2

公开(公告)日：2010-02-09

申请号：US11764096

申请日：2007-06-15

Applicant: Hiroshi Fukuda ,  Yuko Hanaoka ,  Tsukasa Fujimori

Inventor： Hiroshi Fukuda ,  Yuko Hanaoka ,  Tsukasa Fujimori

IPC: G01P15/125

CPC classification number: G01P15/125 ,  G01P15/08 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0828 ,  G01P2015/084 ,  Y10T29/49117

Abstract: A weight of an inertial sensor if formed from a plurality of divided weights, and the divided weights are connected to each other by elastically deformable beams. A movable range and a mass of each of the divided weights and a rigidity of each of the beams are adjusted and a plurality of deformation modes having different sensitivity ranges with respect to the acceleration are used in combination. By this means, it is possible to improve a detecting sensitivity of an acceleration and widen an acceleration response range.

Abstract translation: 如果由多个分割的重物形成的惯性传感器的重量，并且分割的重物通过可弹性变形的梁相互连接。 调整每个分割重物的可移动范围和质量以及每个光束的刚度，并组合使用相对于加速度具有不同灵敏度范围的多个变形模式。 通过这种方式，可以提高加速度的检测灵敏度并加宽加速度响应范围。