公开(公告)号：US08382934B2

公开(公告)日：2013-02-26

申请号：US13183511

申请日：2011-07-15

申请人： Hiroki Horiguchi ,  Yuji Kimura ,  Kazuhiro Yoshida

发明人： Hiroki Horiguchi ,  Yuji Kimura ,  Kazuhiro Yoshida

IPC分类号： B29C65/02 ,  B32B37/14

CPC分类号： G01P15/18 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81C1/00269 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0828 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T156/10 ,  H01L2924/00

摘要： A triaxial acceleration sensor which has a structure including a cover joined to a substrate including a mechanically operable functional unit to be sealed, is adapted in such a way that the joined state can be reliably obtained so as to not interfere with a displacement of the functional unit. A sealing frame is made of a heated polyimide on a periphery of an upper main surface of a substrate provided with a functional unit, and a sealing layer made of a polyimide is formed over an entire lower main surface of a cover. For integrating the substrate and the cover so as to seal the functional unit, the sealing frame and the sealing layer are joined to each other by heating and pressurizing the sealing frame and the sealing layer at a temperature that is about 50° C. to about 150° C. higher than a glass transition temperature of the polyimide while bringing the sealing frame and the sealing layer into contact with each other. In this case, a recess is formed in the vicinity of a portion of the sealing layer to be brought into contact with the sealing frame so that a bump, generated from the sealing layer which is deformed in the joining step, is prevented from protruding toward the functional unit.

摘要翻译： 一种三轴加速度传感器，其具有包括接合到包括要被密封的机械可操作功能单元的基板的盖的结构，使得可以可靠地获得接合状态，以便不干扰功能的位移 单元。 密封框架由设置有功能单元的基板的上主表面的周边上的加热的聚酰亚胺制成，并且在盖的整个下主表面上形成由聚酰亚胺制成的密封层。 为了整合基板和盖以便密封功能单元，密封框架和密封层通过在约50℃到约50℃的温度下加热和加压密封框架和密封层而彼此接合 比使聚酰亚胺的玻璃化转变温度高150℃，同时使密封框和密封层相互接触。 在这种情况下，在密封层的一部分附近形成凹部以与密封框架接触，从而防止在接合步骤中变形的密封层产生的凸块朝向 功能单元。

公开(公告)号：US20100089629A1

公开(公告)日：2010-04-15

申请号：US12629990

申请日：2009-12-03

申请人： Yuji KIMURA ,  Hiroki HORIGUCHI

发明人： Yuji KIMURA ,  Hiroki HORIGUCHI

IPC分类号： B23K31/02 ,  H05K1/16

CPC分类号： B81C3/001 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/036 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/166 ,  H01L2924/3025 ,  Y10T428/31678 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced.

摘要翻译： 在电子部件装置的制造方法中，以包含例如以Sn为主要成分的低熔点金属的低熔点金属层配置成将厚度夹层的状态进行热粘合工序 方向，包括例如以Cu为主要成分的高熔点金属的高熔点金属层，其与限定要结合的第一和第二导体膜的高熔点金属相同或基本相同。 为了产生高熔点金属和低熔点金属的金属间化合物，降低了在每个低熔点金属层中高熔点金属扩散的距离。 因此，扩散所需的时间减少，并且键合所需的时间减少。

公开(公告)号：US20090104990A1

公开(公告)日：2009-04-23

申请号：US12230224

申请日：2008-08-26

申请人： Hiroshi Tsujino ,  Kunio Sasayama ,  Kaoru Mizoguchi ,  Hiroki Horiguchi

发明人： Hiroshi Tsujino ,  Kunio Sasayama ,  Kaoru Mizoguchi ,  Hiroki Horiguchi

IPC分类号： A63F13/00

CPC分类号： A63F13/57 ,  A63F13/04 ,  A63F13/10 ,  A63F13/2145 ,  A63F13/26 ,  A63F13/5255 ,  A63F13/5378 ,  A63F13/837 ,  A63F2300/1075 ,  A63F2300/307 ,  A63F2300/6661 ,  A63F2300/8076

摘要： The game device of the present invention comprises a first image processing means for generating an image captured from the view of a virtual camera which moves together with a virtual player on landforms in a game world and displaying it as a main screen, a second image processing means for generating an image on which a destination for the virtual player can be designated and displaying it as a map image, a destination designation means for designating a destination for the virtual player, route determination means for detecting the position of a destination for the virtual player designated on the map screen, determining the shortest route connecting the detection position of the destination and the present position of the virtual player, and determining a movement route for the virtual player, and a movement control means for allowing the virtual player to move to the destination along the movement route.

摘要翻译： 本发明的游戏装置包括：第一图像处理装置，用于生成从游戏世界中的地形上的虚拟玩家一起移动的虚拟相机的视图捕获的图像，并将其显示为主屏幕;第二图像处理 用于生成可以指定虚拟播放器的目的地并将其显示为地图图像的图像的装置，用于指定虚拟播放器的目的地的目的地指定装置，用于检测虚拟播放器的目的地的位置的路线确定装置 指定在地图画面上的玩家，确定连接目的地的检测位置和虚拟玩家的当前位置的最短路线，以及确定虚拟玩家的移动路线，以及移动控制装置，用于允许虚拟玩家移动到 沿着运动路线的目的地。

公开(公告)号：US20110265929A1

公开(公告)日：2011-11-03

申请号：US13183511

申请日：2011-07-15

申请人： Hiroki HORIGUCHI ,  Yuji KIMURA ,  Kazuhiro YOSHIDA

发明人： Hiroki HORIGUCHI ,  Yuji KIMURA ,  Kazuhiro YOSHIDA

IPC分类号： H05K13/00 ,  B32B37/14 ,  B32B37/10 ,  B32B37/02 ,  B32B37/06

CPC分类号： G01P15/18 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81C1/00269 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0828 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T156/10 ,  H01L2924/00

摘要： A triaxial acceleration sensor which has a structure including a cover joined to a substrate including a mechanically operable functional unit to be sealed, is adapted in such a way that the joined state can be reliably obtained so as to not interfere with a displacement of the functional unit. A sealing frame is made of a heated polyimide on a periphery of an upper main surface of a substrate provided with a functional unit, and a sealing layer made of a polyimide is formed over an entire lower main surface of a cover. For integrating the substrate and the cover so as to seal the functional unit, the sealing frame and the sealing layer are joined to each other by heating and pressurizing the sealing frame and the sealing layer at a temperature that is about 50° C. to about 150° C. higher than a glass transition temperature of the polyimide while bringing the sealing frame and the sealing layer into contact with each other. In this case, a recess is formed in the vicinity of a portion of the sealing layer to be brought into contact with the sealing frame so that a bump, generated from the sealing layer which is deformed in the joining step, is prevented from protruding toward the functional unit.

摘要翻译： 一种三轴加速度传感器，其具有包括接合到包括要被密封的机械可操作功能单元的基板的盖的结构，使得可以可靠地获得接合状态，以便不干扰功能的位移 单元。 密封框架由设置有功能单元的基板的上主表面的周边上的加热的聚酰亚胺制成，并且在盖的整个下主表面上形成由聚酰亚胺制成的密封层。 为了整合基板和盖以便密封功能单元，密封框架和密封层通过在约50℃到约50℃的温度下加热和加压密封框架和密封层而彼此接合 比使聚酰亚胺的玻璃化转变温度高150℃，同时使密封框和密封层相互接触。 在这种情况下，在密封层的一部分附近形成凹部以与密封框架接触，从而防止在接合步骤中变形的密封层产生的凸块朝向 功能单元。

公开(公告)号：US08002942B2

公开(公告)日：2011-08-23

申请号：US12702553

申请日：2010-02-09

申请人： Hiroki Horiguchi ,  Yuji Kimura ,  Kazuhiro Yoshida

发明人： Hiroki Horiguchi ,  Yuji Kimura ,  Kazuhiro Yoshida

IPC分类号： B29C65/02 ,  B32B37/14

CPC分类号： G01P15/18 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81C1/00269 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0828 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T156/10 ,  H01L2924/00

摘要： A triaxial acceleration sensor which has a structure including a cover joined to a substrate including a mechanically operable functional unit to be sealed, is adapted in such a way that the joined state can be reliably obtained so as to not interfere with a displacement of the functional unit. A sealing frame is made of a heated polyimide on a periphery of an upper main surface of a substrate provided with a functional unit, and a sealing layer made of a polyimide is formed over an entire lower main surface of a cover. For integrating the substrate and the cover so as to seal the functional unit, the sealing frame and the sealing layer are joined to each other by heating and pressurizing the sealing frame and the sealing layer at a temperature that is about 50° C. to about 150° C. higher than a glass transition temperature of the polyimide while bringing the sealing frame and the sealing layer into contact with each other. In this case, a recess is formed in the vicinity of a portion of the sealing layer to be brought into contact with the sealing frame so that a bump, generated from the sealing layer which is deformed in the joining step, is prevented from protruding toward the functional unit.

摘要翻译： 一种三轴加速度传感器，其具有包括接合到包括要被密封的机械可操作功能单元的基板的盖的结构，使得可以可靠地获得接合状态，以便不干扰功能的位移 单元。 密封框架由设置有功能单元的基板的上主表面的周边上的加热的聚酰亚胺制成，并且在盖的整个下主表面上形成由聚酰亚胺制成的密封层。 为了整合基板和盖以便密封功能单元，密封框架和密封层通过在约50℃到约50℃的温度下加热和加压密封框架和密封层而彼此接合 比使聚酰亚胺的玻璃化转变温度高150℃，同时使密封框和密封层相互接触。 在这种情况下，在密封层的一部分附近形成凹部以与密封框架接触，从而防止在接合步骤中变形的密封层产生的凸块朝向 功能单元。

公开(公告)号：US20110132656A1

公开(公告)日：2011-06-09

申请号：US13026540

申请日：2011-02-14

申请人： Hiroki Horiguchi ,  Yuji Kimura

发明人： Hiroki Horiguchi ,  Yuji Kimura

IPC分类号： H01R13/46 ,  H05K3/00

CPC分类号： H05K13/00 ,  B23K1/0016 ,  B32B15/01 ,  B32B15/018 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.

摘要翻译： 一种电子部件装置，其具有形成在主基板上的第一密封框架和形成在盖基板上的第二密封框架，所述第一密封框架和第二密封框架由Ni膜构成。 在第一和第二密封框架之间形成由Ni-Bi合金构成的接合部。 例如，在第一密封框架上形成Bi层，然后将第一密封框架和第二密封框架在300℃的温度下加热至少10秒，同时沿着第一密封框架 密封框架和第二密封框架彼此紧密接触，从而形成将第一密封框架结合到第二密封框架的接合部分。

公开(公告)号：US08558123B2

公开(公告)日：2013-10-15

申请号：US13026540

申请日：2011-02-14

申请人： Hiroki Horiguchi ,  Yuji Kimura

发明人： Hiroki Horiguchi ,  Yuji Kimura

IPC分类号： H01R13/46

CPC分类号： H05K13/00 ,  B23K1/0016 ,  B32B15/01 ,  B32B15/018 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.

摘要翻译： 一种电子部件装置，其具有形成在主基板上的第一密封框架和形成在盖基板上的第二密封框架，所述第一密封框架和第二密封框架由Ni膜构成。 在第一和第二密封框架之间形成由Ni-Bi合金构成的接合部。 例如，在第一密封框架上形成Bi层，然后将第一密封框架和第二密封框架在300℃的温度下加热至少10秒，同时沿着第一密封框架 密封框架和第二密封框架彼此紧密接触，从而形成将第一密封框架结合到第二密封框架的接合部分。

公开(公告)号：US20110268977A1

公开(公告)日：2011-11-03

申请号：US13181614

申请日：2011-07-13

申请人： Yuji KIMURA ,  Hiroki HORIGUCHI

发明人： Yuji KIMURA ,  Hiroki HORIGUCHI

IPC分类号： B32B15/04

CPC分类号： B81C3/001 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/036 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/166 ,  H01L2924/3025 ,  Y10T428/31678 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced.

摘要翻译： 在电子部件装置的制造方法中，以包含例如以Sn为主要成分的低熔点金属的低熔点金属层配置成将厚度夹层的状态进行热粘合工序 方向，包括例如以Cu为主要成分的高熔点金属的高熔点金属层，其与限定要结合的第一和第二导体膜的高熔点金属相同或基本相同。 为了产生高熔点金属和低熔点金属的金属间化合物，降低了在每个低熔点金属层中高熔点金属扩散的距离。 因此，扩散所需的时间减少，并且键合所需的时间减少。

公开(公告)号：US20110132655A1

公开(公告)日：2011-06-09

申请号：US13023055

申请日：2011-02-08

申请人： Hiroki Horiguchi ,  Yuji Kimura

发明人： Hiroki Horiguchi ,  Yuji Kimura

IPC分类号： H01R13/46 ,  H05K3/00 ,  B32B15/01

CPC分类号： H03H9/105 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H03H9/1014 ,  Y10T29/49124 ,  Y10T428/12889 ,  Y10T428/12986 ,  H01L2924/00

摘要： An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, both of which are composed of a Ni film. A bonding section bonds the first sealing frame to the second sealing frame. For example, a Bi layer is formed on the first sealing frame and an Au layer is formed on the second sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are close contact with each other to form the bonding section. The bonding section is constituted by a mixed layer predominantly composed of a mixed alloy of a Ni—Bi—Au ternary alloy and Au2Bi.

摘要翻译： 一种电子部件装置，其具有形成在主基板上的第一密封框架和形成在盖基板上的第二密封框架，两者均由Ni膜构成。 接合部将第一密封框架结合到第二密封框架。 例如，在第一密封框架上形成Bi层，在第二密封框架上形成Au层，然后将第一密封框架和第二密封框架在300℃的温度下加热10秒，同时 在第一密封框架和第二密封框架彼此紧密接触的方向上施加压力以形成接合部分。 接合部由主要由Ni-Bi-Au三元合金和Au2Bi的混合合金构成的混合层构成。

公开(公告)号：US08658914B2

公开(公告)日：2014-02-25

申请号：US13023055

申请日：2011-02-08

申请人： Hiroki Horiguchi ,  Yuji Kimura

发明人： Hiroki Horiguchi ,  Yuji Kimura

IPC分类号： H05K7/02 ,  H01L23/48

CPC分类号： H03H9/105 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H03H9/1014 ,  Y10T29/49124 ,  Y10T428/12889 ,  Y10T428/12986 ,  H01L2924/00

摘要： An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, both of which are composed of a Ni film. A bonding section bonds the first sealing frame to the second sealing frame. For example, a Bi layer is formed on the first sealing frame and an Au layer is formed on the second sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are close contact with each other to form the bonding section. The bonding section is constituted by a mixed layer predominantly composed of a mixed alloy of a Ni—Bi—Au ternary alloy and Au2Bi.

摘要翻译： 一种电子部件装置，其具有形成在主基板上的第一密封框架和形成在盖基板上的第二密封框架，两者均由Ni膜构成。 接合部将第一密封框架结合到第二密封框架。 例如，在第一密封框架上形成Bi层，在第二密封框架上形成Au层，然后将第一密封框架和第二密封框架在300℃的温度下加热10秒，同时 在第一密封框架和第二密封框架彼此紧密接触的方向上施加压力以形成接合部分。 接合部由主要由Ni-Bi-Au三元合金和Au2Bi的混合合金构成的混合层构成。