公开(公告)号：US10393606B2

公开(公告)日：2019-08-27

申请号：US15350787

申请日：2016-11-14

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Alfons Dehe

IPC: G01L9/00 ,  B81B3/00 ,  H04R1/08 ,  G01L9/08

Abstract: According to various embodiments, a dynamic pressure sensor includes a substrate, a reference volume formed in the substrate, a deflectable membrane sealing the reference volume, a deflection sensing element coupled to the membrane and configured to measure a deflection of the membrane, and a ventilation hole configured to equalize an absolute pressure inside the reference volume with an absolute ambient pressure outside the reference volume.

公开(公告)号：US10370242B2

公开(公告)日：2019-08-06

申请号：US15662389

申请日：2017-07-28

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Matthias Friedrich Herrmann ,  Johannes Manz

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00

Abstract: A microelectromechanical device, a microelectromechanical system, and a method of manufacturing a microelectromechanical device, wherein the microelectromechanical device may include: a substrate; a diaphragm mounted to the substrate; a first electrode mounted to the diaphragm; a second electrode mounted to the substrate; wherein the first electrode is laterally adjacent to the second electrode; and wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.

公开(公告)号：US10322481B2

公开(公告)日：2019-06-18

申请号：US14198646

申请日：2014-03-06

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Reinhard Gabl ,  Ulrich Krumbein

IPC: B81B3/00 ,  B23Q3/18 ,  H04R7/18 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  B81C1/00

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

公开(公告)号：US20190149926A1

公开(公告)日：2019-05-16

申请号：US16186971

申请日：2018-11-12

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Manuel Dorfmeister ,  Ulrich Schmid ,  Michael Schneider

IPC: H04R17/10 ,  H04R7/06 ,  H04R3/04

CPC classification number: H04R17/10 ,  H04R3/04 ,  H04R7/06 ,  H04R17/00 ,  H04R23/006 ,  H04R2201/003

Abstract: Diaphragm element arrangements including at least one bistable diaphragm element, which has a first stable state and a second stable state, and corresponding methods are provided. The bistable diaphragm element can be activated above a changeover threshold in order to change over between the first and the second stable state or below the changeover threshold.

公开(公告)号：US20190132661A1

公开(公告)日：2019-05-02

申请号：US16219992

申请日：2018-12-14

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  David Tumpold ,  Gueclue Onaran

IPC: H04R1/04 ,  H04R29/00 ,  G01N29/24 ,  G01N29/02 ,  H04R19/04 ,  H04R1/08

Abstract: A device for detecting acoustic waves may include a housing having a housing wall with an inner surface, and an acoustic wave sensor provided at least partially inside the housing and configured to detect acoustic waves. The inner surface of the housing wall is made in at least half of its entire area of a thermally insulating material.

公开(公告)号：US20190098424A1

公开(公告)日：2019-03-28

申请号：US16200072

申请日：2018-11-26

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen

IPC: H04R31/00 ,  H04R19/00 ,  B81B3/00 ,  H04R1/08 ,  B81C1/00

CPC classification number: H04R31/003 ,  B81B3/0021 ,  B81B3/0086 ,  B81B2201/0221 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C1/00158 ,  B81C2201/013 ,  H04R1/08 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003

Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.

公开(公告)号：US20190092624A1

公开(公告)日：2019-03-28

申请号：US16136986

申请日：2018-09-20

Applicant: Infineon Technologies AG

Inventor： Arnaud Walther ,  Alfons Dehe ,  Gerhard Metzger-Brueckl ,  Johann Strasser

IPC: B81B7/02 ,  H04R19/04 ,  B81C1/00

Abstract: A production method for a MEMS component includes providing a layer arrangement on a carrier substrate, where the layer arrangement includes a first and second layer structure. A sacrificial material is arranged in an intermediate region between the first and second layer structures, an etch stop structure extending between the first and second layer structures subdivides the intermediate region into an exposure region and an edge region laterally adjoining the exposure region, and at least one of the first layer structure or the second layer structure has access openings to the exposure region. The method further includes removing the sacrificial material from the exposure region through the access openings using an etching process to expose the exposure region. The etch stop structure provides a lateral delimitation for the etching process, and the sacrificial material present in the edge region provides a mechanical connection between the first and second layer structures.

公开(公告)号：US20190063968A1

公开(公告)日：2019-02-28

申请号：US16106247

申请日：2018-08-21

Applicant: Infineon Technologies AG

Inventor： Christian Bretthauer ,  Alfons Dehe ,  Prashanth Makaram ,  Abidin Güçlü Onaran ,  Arnaud Walther

IPC: G01F1/36 ,  G01F1/38 ,  G01F1/84 ,  G01N11/08

Abstract: In accordance with an embodiment, a MEMS sensor includes a membrane that is suspended from the substrate, a resonant frequency of said membrane being influenced by an ambient pressure that acts on the membrane; and an evaluation device configured to perform a first measurement based on the resonant frequency of the membrane to obtain a measurement result, where the evaluation device is configured to at least partly compensate an influence of the ambient pressure on the measurement result

公开(公告)号：US20190058936A1

公开(公告)日：2019-02-21

申请号：US16052261

申请日：2018-08-01

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Gerhard Metzger-Brueckl ,  Johann Strasser ,  Arnaud Walther ,  Andreas Wiesbauer

IPC: H04R1/08 ,  B81B3/00 ,  H04R23/00 ,  H04R31/00 ,  B81C1/00

CPC classification number: H04R1/08 ,  B81B3/001 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  B81C1/00182 ,  H04R7/14 ,  H04R19/005 ,  H04R19/04 ,  H04R23/006 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2410/03

Abstract: In accordance with an embodiment, microelectromechanical microphone includes a holder and a sound detection unit carried on the holder. The sound detection unit includes a planar first membrane, a planar second membrane arranged at a distance from the first membrane, a low-pressure chamber formed between the first membrane and the second membrane, a reduced gas pressure relative to normal pressure being present in the low-pressure chamber, a reference electrode arranged at least in sections in the low-pressure chamber, where the first and second membranes are displaceable relative to the reference electrode by sound waves to be detected, the reference electrode includes a planar base section and a stiffening structure provided on the base section, and the stiffening structure is provided on a side of the base section that faces the first membrane or/and on a side of the base section that faces the second membrane.

公开(公告)号：US20190023562A1

公开(公告)日：2019-01-24

申请号：US16041083

申请日：2018-07-20

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Stefan Barzen ,  Alfons Dehe ,  Gunar Lorenz

IPC: B81C1/00 ,  B81B3/00

Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the counterelectrode structure.