Magnetic head suspension assembly with adhesion limiting structure
    152.
    发明授权
    Magnetic head suspension assembly with adhesion limiting structure 失效
    具有附着力限制结构的磁头悬挂组件

    公开(公告)号:US06801398B1

    公开(公告)日:2004-10-05

    申请号:US08901940

    申请日:1997-07-29

    IPC分类号: G11B548

    CPC分类号: G11B5/4853

    摘要: A magnetic head assembly equipped with a slider and a gimbal spring to which the slider is secured with an adhesive agent. According to one aspect, at least one slit is formed in the gimbal spring opposing the adhesion surface of the slider, so that expansion and contraction of the gimbal spring caused by a change in the temperature is hardly transferred to the slider. According to a second aspect, the Young's modulus after hardening of the adhesive agent applied onto thee adhesion surface of the slider is selected to be smaller than about {fraction (1/13000)} of the Young's modulus of the slider material or of the gimbal spring material. According to the first aspect, therefore, the area of the gimbal spring on which the adhesive agent is applied is limited by the slit. According to the second aspect, the Young's modulus of the adhesive agent after hardening is so small that the warping amount of the slider caused by a change in the temperature lies within a predetermined range. The warping amount of the slider in the magnetic head assembly is hence suppressed to lie within an allowable range despite a change in the temperature, and floating performance of thee slider is stabilized.

    摘要翻译: 具有滑块和万向弹簧的磁头组件,滑块用粘合剂固定到该磁头组件上。 根据一个方面,在与向滑块的粘合表面相对的万向弹簧中形成至少一个狭缝,使得由温度变化引起的万向弹簧的膨胀和收缩几乎不传递到滑块。 根据第二方面,施加到滑块的粘合表面上的粘合剂硬化后的杨氏模量被选择为小于约{分数(滑块材料或万向弹簧材料的杨氏模量的1/13000) 根据第一方面,因此,施加了粘合剂的万向弹簧的面积受到狭缝的限制,根据第二方面,硬化后的粘合剂的杨氏模量小到翘曲量 由于温度变化引起的滑动件在预定范围内,因此即使温度变化,磁头组件中的滑块的翘曲量也被抑制在容许范围内,而滑块的浮动性能为 稳定

    Semiconductor device with a dual damascene type via contact structure and method for the manufacture of same
    153.
    发明授权
    Semiconductor device with a dual damascene type via contact structure and method for the manufacture of same 失效
    具有双镶嵌型通孔接触结构的半导体器件及其制造方法

    公开(公告)号:US06433428B1

    公开(公告)日:2002-08-13

    申请号:US09086958

    申请日:1998-05-29

    IPC分类号: H01L2348

    摘要: The via contact structure is rendered into a dual damascene type via contact structure having a wide groove and a via contact hole lying below the wide groove, and the interior of the lower via contact hole is filled up with a filling material composed of tungsten, while, the interior of the upper groove is filled up with aluminum. Since the interior of the lower via contact hole is thus filled up with a filling material comprising tungsten, aluminum which has a low reflowability may be used only in the upper groove. As for the filling material for filling up the wide groove, the wide groove can be filled up sufficiently well even with aluminum which is not high in reflowability. By combining the filling of the via contact hole with tungsten and the filling of the groove with aluminum as mentioned above, a via contact filling with a high aspect ratio can be realized. Further, the problem or drawback that, at the time of forming the second metal wiring layer, the first metal wiring layer may be melted due to the high-temperature heat treatment performed for depositing the metal material is eliminated, and thus, it becomes possible to realize a dual damascene type via contact structure which can be applied to a multi-layer wiring structure.

    摘要翻译: 通孔接触结构被制成具有宽槽的通孔接触结构和位于宽槽下方的通孔接触孔的双镶嵌型通孔接触结构,并且下通孔接触孔的内部填充有由钨构成的填充材料,同时 ,上槽的内部填充有铝。 由于下通孔接触孔的内部填充有包含钨的填充材料,所以具有低回流性的铝可以仅在上槽中使用。 对于用于填充宽槽的填充材料,即使使用不可回流的铝的情况下,也可以充分地填充宽槽。 通过将通孔接触孔的填充与钨结合,并且如上所述用铝填充槽,可以实现填充高纵横比的通孔接头。 此外,在形成第二金属布线层时,第一金属布线层由于进行用于沉积金属材料的高温热处理而可能熔化的问题和缺陷被消除,因此, 实现可以应用于多层布线结构的双镶嵌型通孔接触结构。

    Ceramic electronic component
    154.
    发明授权
    Ceramic electronic component 有权
    陶瓷电子元件

    公开(公告)号:US06381117B1

    公开(公告)日:2002-04-30

    申请号:US09656724

    申请日:2000-09-07

    IPC分类号: H01G4228

    摘要: A ceramic electronic component includes at least one component body having two end faces opposing each other and side faces connecting the two end faces, and terminal electrodes formed on the component body. Each of the terminal electrodes extends from each end face to edge portions of each side face of the component body. Each of the terminal electrodes includes a metal layer formed on at least each end face of the component body, a conductive resin layer for covering at least portions of the side faces of the component body, and a metal plating film covering the outer surface of the terminal electrode. The conductive resin layer extends from the metal layer including the edge of the metal layer to the portions of the side faces, and includes a conductive resin containing metal powder and resin. The thickness of the conductive resin layer above the side faces is at least about 10 &mgr;m.

    摘要翻译: 陶瓷电子部件包括具有彼此相对的两个端面和连接两个端面的侧面和形成在部件主体上的端子电极的至少一个部件主体。 每个端子电极从每个端面延伸到组件主体的每个侧面的边缘部分。 每个端子电极包括形成在组件主体的至少每个端面上的金属层,用于覆盖组件主体的至少一部分侧面的导电树脂层和覆盖组件主体的外表面的金属镀膜 端子电极。 导电树脂层从包括金属层的边缘的金属层延伸到侧面的部分,并且包括含有金属粉末和树脂的导电树脂。 侧面上方的导电树脂层的厚度为至少约10μm。

    Suspension assembly having a head IC chip mounting portion
    155.
    发明授权
    Suspension assembly having a head IC chip mounting portion 失效
    具有头IC芯片安装部分的悬架组件

    公开(公告)号:US6134084A

    公开(公告)日:2000-10-17

    申请号:US46827

    申请日:1998-03-24

    CPC分类号: G11B5/486

    摘要: A suspension adapted to be mounted on an actuator arm and elastically support a head slider having a head includes a base portion configured and adapted to be mounted to an end of the actuator arm. Also included is a head slider mounting portion adapted to support the head slider. The head slider mounting portion is located at an opposite end of the suspension from the base portion. A tongue portion extends from the base portion in a direction perpendicular to a surface of the base portion, and a head IC chip mounting portion is formed on the tongue portion. The head IC chip mounting portion is configured and arranged to support a head IC chip thereon.

    摘要翻译: 适于安装在致动器臂上并弹性地支撑具有头部的头滑块的悬架包括构造并适于安装到致动器臂的端部的基部。 还包括适于支撑磁头滑块的磁头滑块安装部分。 磁头滑块安装部分位于与基部的悬架的相对端。 舌部从垂直于基部表面的方向从基部延伸,并且在舌部上形成头IC芯片安装部。 头IC芯片安装部分被配置和布置成在其上支撑头IC芯片。

    Microcomputer capable of preventing writing errors in a non-volatile
memory
    157.
    发明授权
    Microcomputer capable of preventing writing errors in a non-volatile memory 失效
    能够防止在非易失性存储器中写入错误的微型计算机

    公开(公告)号:US5925139A

    公开(公告)日:1999-07-20

    申请号:US821598

    申请日:1997-03-20

    IPC分类号: G11C16/22 G06F1/30 G06F11/00

    CPC分类号: G11C16/225

    摘要: When data are to be written in an EEPROM (1), a CPU (2) sets a flag (12). A voltage booster (13) boosts the power voltage in compliance with the setting of the flag (12). A voltage boost detector (14) detects whether the output of the voltage booster (13) is in voltage boost state. If the output of the voltage booster (13) is not in voltage boost state, a latch (15) is reset and the EEPROM (1) is not permitted to switch to write mode. As a result, it is possible to prevent incorrect data writing in the EEPROM (1) even when the flag (12) has been incorrectly set.

    摘要翻译: 当将数据写入EEPROM(1)时,CPU(2)设置标志(12)。 升压器(13)根据标志(12)的设置提升电源电压。 升压检测器(14)检测升压器(13)的输出是否处于升压状态。 如果升压器(13)的输出不处于升压状态,则锁存器(15)被复位,并且EEPROM(1)不被允许切换到写入模式。 结果,即使当标志(12)被错误地设置时,也可以防止EEPROM(1)中的错误数据写入。

    Adaptor device for connecting sheathed heater with power supply terminal
    158.
    发明授权
    Adaptor device for connecting sheathed heater with power supply terminal 失效
    用于将护套加热器与电源端子连接的适配器

    公开(公告)号:US5897806A

    公开(公告)日:1999-04-27

    申请号:US935125

    申请日:1997-09-22

    申请人: Toru Watanabe

    发明人: Toru Watanabe

    IPC分类号: H05B3/06 H05B3/08

    CPC分类号: H05B3/08

    摘要: An adaptor device for connecting a sheathed heater with a power supply terminal wherein an end of a heater wire of the sheathed heater and an end of a lead wire are inserted into an adaptor sleeve and the ends of the heater wire and the lead wire in the adaptor sleeve are connected by a flexible wire. The flexible wire is a stranded wire or in the form of a wave.

    摘要翻译: 一种用于将护套加热器与电源端子连接的适配器装置,其中,护套加热器的加热线的端部和引线的端部插入适配器套筒中,并且加热器线和引线的端部在 适配器套筒通过柔性线连接。 柔性线是绞线或波浪形。

    Surface acoustic wave device including IDT electrode having solid
electrode portion and split electrode portion
    159.
    发明授权
    Surface acoustic wave device including IDT electrode having solid electrode portion and split electrode portion 失效
    包括具有固体电极部分和分离电极部分的IDT电极的声表面波装置

    公开(公告)号:US5838091A

    公开(公告)日:1998-11-17

    申请号:US625592

    申请日:1996-04-03

    申请人: Toru Watanabe

    发明人: Toru Watanabe

    IPC分类号: H03H9/02 H03H9/145 H01L41/08

    CPC分类号: H03H9/14552 H03H9/14582

    摘要: A surface acoustic wave device achieving improved insertion loss and fraction defective without lowering the TTE level includes an IDT electrode located on a piezoelectric substrate. The IDT electrode includes a solid electrode portion and a split electrode portion continuously formed at an end of the solid electrode portion in the propagating direction of a surface acoustic wave and having an electrode finger width of about .lambda./8 wherein .lambda. is the wavelength of the surface acoustic wave.

    摘要翻译: 在不降低TTE电平的情况下实现改进的插入损耗和分数缺陷的表面声波装置包括位于压电基板上的IDT电极。 IDT电极包括固体电极部分和分裂电极部分,其在固体电极部分的端部在声表面波的传播方向上连续形成,并且具有约λ/ 8的电极指宽度,其中λ是 表面声波。