Abstract:
A computer-based method for measuring a ringup, a ringdown and a ringback of an electronic signal is provided. The method includes fitting a ringdown fitting curve to approximate a first ringdown data, and fitting a ringup fitting curve to approximate a first ringup data. The method further includes calculating an approximate ringdown value according to the ringdown fitting curve, and calculating an approximate ringup value according to the ringup fitting curve. The approximate ringup and ringdown values are then used to obtain an accurate ringup value and an accurate ringup value respectively. An accurate ringback value is calculated by subtracting the accurate ringup value from the accurate ringdown value.
Abstract:
An exemplary motherboard includes a driving module, at least two first slots arranged for mounting two first type of memories, at least two second slots arranged for mounting two second type of memories, and a voltage regulator. The driving module is electronically connected to the at least two first slots, the at least two second slots, and the voltage regulator in turn via a channel. The first type of memories and the second type of memories are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of memory mounted on the motherboard accordingly.
Abstract:
A computer-implemented method for designing a voltage regulator module (VRM) is disclosed. The method includes receiving design parameters and a component data for each component and storing the design parameters and the component data for each component into a component selection table, calculating a work efficiency of the VRM, and storing the work efficiency into a power computation table. The method further includes simulating a derating of each component according to a corresponding rated stress of each component if the work efficiency is greater than or equal to a predetermined work efficiency, calculating a stress ratio of each component, and storing the stress ratio into a component derating table. The component selection table, the power computation table and the component derating table are stored to form a desired VRM model if the stress ratio of each component meets a corresponding derating specification.
Abstract:
An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines.
Abstract:
An exemplary motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, and a voltage regulator electronically connected to the first slot and the second slot. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly.
Abstract:
An apparatus for testing characteristic impedance of transmission lines includes a variable resistor, a first comparator, a second comparator, and a counter. One terminal of the variable resistor is coupled to a signal source, another terminal of the variable resistor is coupled to one terminal of a transmission line, and another terminal of the transmission line is idle. The one terminal of the transmission line is coupled to the input terminals of the first and second comparators. The output terminals of the first and second comparators are respectively coupled to input terminals of the counter. An output terminal of the counter is coupled to an adjusting terminal of the variable resistor, the counter adjusts the resistance of the variable resistor according to signals output from the first and second comparators.
Abstract:
An exemplary motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, a voltage regulator electronically connected to the first slot and the second slot, and a serial presence detect (SPD) unit connected to the voltage regulator. The first memory and the second memory alternatively mounted on the motherboard, the SPD detects which type of memory is mounted on the motherboard, and the voltage regulator outputs voltages suitable for the type of the memory mounted on the motherboard according to a detection result of the SPD.
Abstract:
A circuit topology for multiple loads is provided. In an embodiment, the circuit topology includes a driving terminal (50), a first node (A), a first receiving terminal (10), and a second receiving terminal (20). The driving terminal is coupled to the first node via a main transmission line (11), the first node is respectively coupled to the first and second receiving terminals via a first branch transmission line (13) and a second branch transmission line (12). A first resistor (R2) is mounted on the second branch transmission line, a distance the signal travels from the driving terminal to the second receiving terminal via the main transmission line and the second branch transmission line is greater than a distance the signal travels from the driving terminal to the first receiving terminal via the main transmission and the first branch transmission line.
Abstract:
An exemplary printed circuit board includes a power plane, and a ground plane. The power plane includes two power modules, and an insulating medium for insulating the two power modules from each other. The ground plane is insulated from the power plane, a plurality of slots is defined in the ground plane and located close to facing edges of the two power modules, and the slots are arranged in rows along the facing edges of the two power modules.
Abstract:
A printed circuit board includes a power plane, a ground plane insulated from the power plane, and at least one via. The power plane includes two power modules, an insulating medium for insulating the two power modules, and a signal transmission line positioned between the two power modules and insulated from the two power modules by the insulating medium. The at least one via connects the signal transmission line with the ground plane for conducting simultaneous switching noise (SSN) transmitted to the power modules to the ground plane.