BALL GRID ARRAY PATTERN FOR AN INTEGRATED CIRCUIT

    公开(公告)号:US20220293500A1

    公开(公告)日:2022-09-15

    申请号:US17199025

    申请日:2021-03-11

    Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.

    DYNAMIC BANDWIDTH CONNECTIONS
    162.
    发明申请

    公开(公告)号:US20220283973A1

    公开(公告)日:2022-09-08

    申请号:US17636484

    申请日:2019-08-21

    Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide a dynamic data interconnect and networking cable configuration. The dynamic data interconnect includes a substrate, transmitters supported on the substrate configured to generate signals, and receivers supported on the substrate configured to receive signals. The dynamic data interconnect further includes a number of connection pads that receive data cables attached thereto and a number of transmission lanes that operably couple the transmitters and receivers to the connection pads. The dynamic data interconnect further includes transmission circuitry in communication with each of the transmitters and receivers such that, in an operational configuration, the transmission circuitry determines a transmission state of the dynamic data interconnect and selectively disables operation of at least a portion of the transmitters or at least a portion of the receivers.

    BACKSIDE FIBER ATTACHMENT TO SILICON PHOTONICS CHIP

    公开(公告)号:US20220276452A1

    公开(公告)日:2022-09-01

    申请号:US17649849

    申请日:2022-02-03

    Abstract: Various embodiments of silicon photonic (SiP) chips are provided that are configured for backside or frontside optical fiber coupling. An SiP chip includes a photonic integrated circuit formed on a first surface of a first substrate. The photonic integrated circuit includes at least one optical component and at least one coupling element. The at least one optical component is configured to propagate an optical signal therethrough in a waveguide propagation direction that is substantially parallel to a plane defined by the first surface. The at least one coupling element is configured to couple an optical signal propagating along an optical path transverse to the waveguide propagation direction into the at least one optical component to enable the backside or frontside coupling of an optical fiber to the SiP chip.

    OPTICAL SPLITTING ADAPTOR
    166.
    发明申请

    公开(公告)号:US20220244471A1

    公开(公告)日:2022-08-04

    申请号:US17162471

    申请日:2021-01-29

    Abstract: Optical splitting adaptors and associated methods of manufacturing are provided. An example optical splitting adaptor includes a first connector housing that interfaces with a first optical transceiver having a first data rate, and the first connector housing accommodates a first type multi-fiber ferrule of a first number of fibers. The example optical splitting adaptor also includes a second connector housing that defines dual receptacles for interfacing with a second optical transceiver and a third optical transceiver, and the dual receptacles receive respective multi-fiber ferrules. The example optical splitting adaptor further includes a plurality of fibers operably connecting the first connector housing and the second connector housing such that, in operation, the plurality of fibers perform optical splitting between the first type multi-fiber ferrule of the first connector housing and the multi-fiber ferrules received by the dual receptacles of the second connector housing.

    Packet transmission using scheduled prefetching

    公开(公告)号:US11388263B2

    公开(公告)日:2022-07-12

    申请号:US17067690

    申请日:2020-10-11

    Abstract: A Network-Connected Device (NCD) includes a network interface, a host interface, an NCD memory and an NCD processor. The network interface is configured for communicating over a network. The host interface is configured for communicating with a host. The NCD memory is configured to buffer packet information that originates from the host and pertains to a packet to be transmitted to the network at a specified transmission time. The NCD processor is configured to process the buffered packet information before the specified transmission time, and to transmit the packet to the network at the specified time. Processing of the packet information and transmission of the packet are decoupled from buffering of the packet information.

    Optical network system
    170.
    发明授权

    公开(公告)号:US11368768B2

    公开(公告)日:2022-06-21

    申请号:US16823387

    申请日:2020-03-19

    Abstract: In one embodiment, an optical network system including a plurality of optical switches configured to switch beams of light which are modulated to carry information, a plurality of host computers comprising respective optical network interface controllers (NICs), optical fibers connecting the optical NICs and the optical switches forming an optically-switched communication network, over which optical circuit connections are established between pairs of the optical NICs over ones of the optical fibers via ones of the optical switches, the optically-switched communication network which including the optical NICs and the optical switches.

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