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    Electrical connector with multilayer surface treatment and method for fabricating the same
    174.
    发明授权
    Electrical connector with multilayer surface treatment and method for fabricating the same 有权
    具有多层表面处理的电连接器及其制造方法

    公开(公告)号：US08764484B2

    公开(公告)日：2014-07-01

    申请号：US13562319

    申请日：2012-07-31

    Applicant: Wei-De Zhang ,  Peng-Cheng Wu

    Inventor： Wei-De Zhang ,  Peng-Cheng Wu

    IPC: H01R13/648

    CPC classification number: H01R13/03 ,  H01R13/6598

    Abstract: An electrical connector includes an insulative housing (3), a number of contacts (4) retained in the insulative housing (3) and a metallic shell (1) enclosing the insulative housing (3). The metallic shell (1) includes a number of peripheral walls and a soldering tab (15) extending therefrom. Each of the soldering tab (15) and the peripheral walls includes an intermediate layer (20), a first plating layer (21), a second plating layer (22) and a third plating layer (23). The third plating layer (23) covers both inner and outer sides of the second plating layer (22) of the peripheral walls for enhancing anti-wear properties while leaving the second plating layer (22) of the soldering tab (15) uncoated for wetting. Besides, a method of surface treatment of the metallic shell (1) is also disclosed.

    Abstract translation: 电连接器包括绝缘壳体（3），保持在绝缘壳体（3）中的多个触点（4）和包围绝缘壳体（3）的金属壳体（1）。 金属外壳（1）包括许多外围壁和从其延伸的焊接接头（15）。 每个焊接片（15）和周壁包括中间层（20），第一镀层（21），第二镀层（22）和第三镀层（23）。 第三镀层（23）覆盖周壁的第二镀层（22）的内侧和外侧，用于增强耐磨性能，同时留下未涂覆润湿的焊接片（15）的第二镀层（22） 。 此外，还公开了金属壳（1）的表面处理方法。

    BIPOLAR JUNCTION TRANSISTORS WITH REDUCED BASE-COLLECTOR JUNCTION CAPACITANCE
    176.
    发明申请
    BIPOLAR JUNCTION TRANSISTORS WITH REDUCED BASE-COLLECTOR JUNCTION CAPACITANCE 审中-公开
    具有降低的基极集电极结电容的双极晶体管

    公开(公告)号：US20130277804A1

    公开(公告)日：2013-10-24

    申请号：US13452335

    申请日：2012-04-20

    Applicant: Peng Cheng ,  David L. Harame ,  Robert K. Leidy ,  Qizhi Liu

    Inventor： Peng Cheng ,  David L. Harame ,  Robert K. Leidy ,  Qizhi Liu

    IPC: H01L29/732 ,  G06F17/50 ,  H01L21/331

    CPC classification number: H01L29/66287 ,  H01L29/0649 ,  H01L29/0804 ,  H01L29/7325

    Abstract: Methods for fabricating a device structure such as a bipolar junction transistor, device structures for a bipolar junction transistor, and design structures for a bipolar junction transistor. The device structure includes a collector region formed in a substrate, an intrinsic base coextensive with the collector region, an emitter coupled with the intrinsic base, a first isolation region surrounding the collector region, and a second isolation region formed at least partially within the collector region. The first isolation region has a first sidewall and the second isolation region having a second sidewall peripherally inside the first sidewall. A portion of the collector region is disposed between the first sidewall of the first isolation region and the second sidewall of the second isolation region.

    Abstract translation: 用于制造诸如双极结型晶体管的器件结构的方法，用于双极结型晶体管的器件结构以及用于双极结型晶体管的设计结构。 器件结构包括形成在衬底中的集电极区域，与集电极区域共同延伸的本征基极，与本征基极耦合的发射极，围绕集电极区域的第一隔离区域和至少部分地形成在集电极区域内的第二隔离区域 地区。 第一隔离区域具有第一侧壁，第二隔离区域在第一侧壁周围具有第二侧壁。 集电极区域的一部分设置在第一隔离区域的第一侧壁和第二隔离区域的第二侧壁之间。

    METHOD AND APPARATUS FOR PROVIDING A MULTI-DIMENSIONAL DATA INTERFACE
    177.
    发明申请
    METHOD AND APPARATUS FOR PROVIDING A MULTI-DIMENSIONAL DATA INTERFACE 审中-公开
    用于提供多维数据接口的方法和装置

    公开(公告)号：US20120271545A1

    公开(公告)日：2012-10-25

    申请号：US13089870

    申请日：2011-04-19

    Applicant: Peng Cheng

    Inventor： Peng Cheng

    IPC: G01C21/36

    CPC classification number: G06F1/169 ,  G06F1/1692 ,  G06F3/04815 ,  G06F3/0483 ,  G06F3/0488 ,  G06F2203/0339

    Abstract: Various methods for providing a multi-dimensional data interface are provided. One example method may include receiving first data navigation instructions for navigating data in a first dimension or a second dimension via a first user interface device, causing a presentation of the data to be modified within the first dimension or the second dimension in response to at least receiving the first data navigation instructions, receiving second data navigation instructions for navigating the data in a third dimension via a second user interface device, and causing the presentation of the data to be modified within a third dimension in response to at least receiving the second data navigation instructions. Similar and related example methods, example apparatuses, and example computer program products are also provided.

    Abstract translation: 提供了用于提供多维数据接口的各种方法。 一个示例性方法可以包括接收用于经由第一用户界面设备导航第一维度或第二维度中的数据的第一数据导航指令，以响应于至少在第一维度或第二维度中对数据进行修改 接收第一数据导航指令，接收用于经由第二用户界面设备导航第三维度中的数据的第二数据导航指令，并且响应于至少接收第二数据使得在第三维度内修改数据的呈现 导航说明。 还提供了类似的和相关的示例性方法，示例性装置和示例性计算机程序产品。

    POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVED IR DROP AND CHIP PERFORMANCE
    179.
    发明申请
    POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVED IR DROP AND CHIP PERFORMANCE 有权
    具有改进的红外线和芯片性能的集成电路设备的电源和接地布线

    公开(公告)号：US20120038055A1

    公开(公告)日：2012-02-16

    申请号：US13281458

    申请日：2011-10-26

    Applicant: Ching-Chung Ko ,  Tao Cheng ,  Tien-Yueh Liu ,  Dar-Shii Chou ,  Peng-Cheng Kao

    Inventor： Ching-Chung Ko ,  Tao Cheng ,  Tien-Yueh Liu ,  Dar-Shii Chou ,  Peng-Cheng Kao

    IPC: H01L23/535

    CPC classification number: H01L23/5286 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An integrated circuit chip includes a semiconductor substrate having thereon a plurality of IMD layers and first conductive layers embedded in the IMD layers; a first insulating layer overlying the IMD layers and the first conductive layers; a plurality of first power/ground mesh wiring lines, in a second conductive layer overlying the first Insulating layer, for distributing power signal or ground signal; and a second insulating layer covering the second conductive layer and the first insulating layer.

    Abstract translation: 集成电路芯片包括其上具有多个IMD层的半导体衬底和嵌入IMD层中的第一导电层; 覆盖IMD层和第一导电层的第一绝缘层; 在覆盖所述第一绝缘层的第二导电层中的多个第一电源/接地网状布线，用于分配电力信号或接地信号; 以及覆盖所述第二导电层和所述第一绝缘层的第二绝缘层。

    Thermally Driven Heat Pump for Heating and Cooling
    180.
    发明申请
    Thermally Driven Heat Pump for Heating and Cooling 审中-公开
    用于加热和冷却的热驱动热泵

    公开(公告)号：US20110259039A1

    公开(公告)日：2011-10-27

    申请号：US12745168

    申请日：2008-11-26

    Applicant: Hongbin Ma ,  Joseph A. Boswell ,  Peng Cheng

    Inventor： Hongbin Ma ,  Joseph A. Boswell ,  Peng Cheng

    IPC: F25B17/00 ,  F25B41/00

    CPC classification number: F25B1/08 ,  F25B15/02 ,  F25B2341/0011 ,  F25B2341/0015 ,  Y02A30/277 ,  Y02B30/62

    Abstract: A thermally driven heat pump includes a low temperature evaporator for evaporating cooling fluid to remove heat A first heat exchanger located at an outlet of a converging/diverging chamber of a first ejector receives a flow of primary fluid vapor and cooling fluid vapor ejected from the first ejector for condensing a portion of the cooling fluid vapor An absorber located in the first heat exchanger absorbs cooling fluid vapor into an absorbing fluid to reduce the pressure in the first heat exchanger A second heat exchanger located at an outlet of a converging/diverging chamber of a second ejector receives primary fluid vapor and cooling fluid vapor ejected from the second ejector for condensing the cooling fluid vapor and the primary fluid vapor A separator in communication with the second ejector, the low temperature evaporator and the primary fluid evaporator separates the primary fluid from the cooling fluid.

    Abstract translation: 热驱动热泵包括用于蒸发冷却流体以去除热量的低温蒸发器。位于第一喷射器的会聚/发散室的出口处的第一热交换器接收从第一喷射器喷射的主流体蒸气和冷却流体蒸汽的流动 用于冷凝冷却流体蒸气的一部分的喷射器位于第一热交换器中的吸收器将冷却流体蒸气吸收到吸收流体中以降低第一热交换器中的压力位于位于会聚/发散室的出口处的第二热交换器 第二喷射器接收从第二喷射器喷射的主要流体蒸汽和冷却流体蒸气，用于冷凝冷却流体蒸气和与第二喷射器连通的主流体蒸汽A分离器，低温蒸发器和主流体蒸发器将主流体从 冷却液。

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