公开(公告)号：US20130052758A1

公开(公告)日：2013-02-28

申请号：US13217821

申请日：2011-08-25

申请人： Brent S. Krusor ,  Christopher L. Chua ,  Thomas Wunderer ,  Noble M. Johnson ,  Bowen Cheng

发明人： Brent S. Krusor ,  Christopher L. Chua ,  Thomas Wunderer ,  Noble M. Johnson ,  Bowen Cheng

IPC分类号： H01L21/66 ,  B44C1/22

CPC分类号： H01L22/26 ,  H01L21/67086 ,  H01L21/67253 ,  H01L22/12 ,  H01L33/0079

摘要： Approaches for substantially removing bulk aluminum nitride (AlN) from one or more layers epitaxially grown on the bulk AlN are discussed. The bulk AlN is exposed to an etchant during an etching process. During the etching process, the thickness of the bulk AlN can be measured and used to control etching.

摘要翻译： 讨论了从体积AlN上外延生长的一层或多层基本上去除块状氮化铝（AlN）的方法。 在蚀刻过程中，大块AlN暴露于蚀刻剂。 在蚀刻过程中，可以测量体积AlN的厚度并用于控制蚀刻。

公开(公告)号：US08039938B2

公开(公告)日：2011-10-18

申请号：US12471163

申请日：2009-05-22

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/52 ,  H01L23/48 ,  H01L23/34

CPC分类号： H01L21/563 ,  H01L24/01 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L33/62 ,  H01L2224/13016 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81855 ,  H01L2224/81902 ,  H01L2224/83192 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

摘要翻译： 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和布置成在垫片芯片和弹簧芯片之间形成间隙的弹簧芯片，以及在间隙的一部分中的底部填充材料，以从垫片芯片和弹簧芯片形成模具。 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和弹簧芯片布置成在垫片芯片和弹簧芯片之间形成间隙，间隙中的底部填充材料从垫片芯片和弹簧芯片形成模具，以及底部填充材料和互连件之间的至少一个壁 区。 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。