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公开(公告)号：US20100295165A1
公开(公告)日：2010-11-25
申请号：US12471188
申请日：2009-05-22
CPC分类号： H01L21/50 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05568 , H01L2224/05599 , H01L2224/1111 , H01L2224/11334 , H01L2224/13005 , H01L2224/13016 , H01L2224/13027 , H01L2224/16105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81903 , H01L2224/83193 , H01L2224/83855 , H01L2224/83859 , H01L2224/83874 , H01L2224/83885 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/0132 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H05K3/321 , H05K3/4015 , H05K2201/0311 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
摘要翻译： 封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂 区域，以及响应于互连区域中的化学活化剂的粘合剂。 封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂 另一方面是垫片芯片或弹簧芯片。 一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂 芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。
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公开(公告)号：US08039938B2
公开(公告)日：2011-10-18
申请号：US12471163
申请日：2009-05-22
IPC分类号： H01L23/495 , H01L23/02 , H01L23/52 , H01L23/48 , H01L23/34
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译： 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和布置成在垫片芯片和弹簧芯片之间形成间隙的弹簧芯片，以及在间隙的一部分中的底部填充材料，以从垫片芯片和弹簧芯片形成模具。 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和弹簧芯片布置成在垫片芯片和弹簧芯片之间形成间隙，间隙中的底部填充材料从垫片芯片和弹簧芯片形成模具，以及底部填充材料和互连件之间的至少一个壁 区。 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。
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公开(公告)号：US08405198B2
公开(公告)日：2013-03-26
申请号：US12471188
申请日：2009-05-22
IPC分类号： H01L23/52
CPC分类号： H01L21/50 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05568 , H01L2224/05599 , H01L2224/1111 , H01L2224/11334 , H01L2224/13005 , H01L2224/13016 , H01L2224/13027 , H01L2224/16105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/81903 , H01L2224/83193 , H01L2224/83855 , H01L2224/83859 , H01L2224/83874 , H01L2224/83885 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/0132 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H05K3/321 , H05K3/4015 , H05K2201/0311 , H01L2224/81 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.
摘要翻译： 封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂 区域，以及响应于互连区域中的化学活化剂的粘合剂。 封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂 另一方面是垫片芯片或弹簧芯片。 一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂 芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。
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公开(公告)号：US08399296B2
公开(公告)日：2013-03-19
申请号：US13269609
申请日：2011-10-09
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译： 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。
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5.发明申请AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL 有权AIRGAP MICR-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL公开(公告)号：US20100295164A1
公开(公告)日：2010-11-25
申请号：US12471163
申请日：2009-05-22
IPC分类号： H01L23/498
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译： 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和布置成在垫片芯片和弹簧芯片之间形成间隙的弹簧芯片，以及在间隙的一部分中的底部填充材料，以从垫片芯片和弹簧芯片形成模具。 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和弹簧芯片布置成在垫片芯片和弹簧芯片之间形成间隙，间隙中的底部填充材料从垫片芯片和弹簧芯片形成模具，以及底部填充材料和互连件之间的至少一个壁 区。 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。
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6.发明申请AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL 有权AIRGAP MICR-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL公开(公告)号：US20120088330A1
公开(公告)日：2012-04-12
申请号：US13269609
申请日：2011-10-09
IPC分类号： H01L21/50
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译： 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。
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公开(公告)号：US20080141884A1
公开(公告)日：2008-06-19
申请号：US11613141
申请日：2006-12-19
IPC分类号： B41N1/12
摘要： A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften. A method of forming a printing plate provides an array of cells, first heats the array of cells such that the deformable polymer material does one of either melts or softens, actuates the cells in the array to assume a deformed state, cools the array of cells to solidify the cells in the deformed state, second heats the cells such that the deformable polymer material in selected ones of the cells does one of either soften or melt and return to a less deformed state to form a printing pattern, and cools the surface to solidify the deformable polymer material in the printing pattern. A method of forming a printing plate provides an array of cells, heats the array of cells such that the deformable polymer material softens, actuates selected ones of the cells to deform surfaces of the selected ones to form a printing pattern, and cools the array of cells to solidify the printing pattern into a printing plate.
摘要翻译： 印版具有衬底，衬底上的单元阵列，其中每个单元对应于印刷图像的元素，位于单元中的可变形聚合物材料，使得每个单元至少部分地由可变形聚合物材料形成， 当可变形聚合物材料是熔化或软化之一时，根据需要收集可变形聚合物材料的储存器，以及使可变形聚合物材料熔融或软化的加热器。 形成印版的方法提供了一个单元阵列，首先加热单元阵列，使得可变形的聚合物材料进行融化或软化之一，致动阵列中的单元以呈现变形状态，冷却单元阵列 使细胞在变形状态下固化，第二加热细胞，使得选定细胞中的可变形聚合物材料进行软化或熔化，并恢复到较小的变形状态以形成印刷图案，并将表面冷却至 使印刷图案中的可变形聚合物材料固化。 形成印版的方法提供了一个单元阵列，加热单元阵列使得可变形的聚合物材料软化，致动所选择的单元格以使选定的单元的表面变形以形成印刷图案，并且冷却 细胞将印刷图案固化成印版。
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8.发明授权Release height adjustment of stressy metal devices by annealing before and after release 有权释放压力金属器件释放高度后，退火前后退火公开(公告)号：US06973722B2
公开(公告)日：2005-12-13
申请号：US10715978
申请日：2003-11-17
申请人： Thomas Hantschel , David K. Fork , Dirk De Bruyker , Chinnwen Shih , Jeng Ping Lu , Christopher L. Chua , Raj B. Apte , Brent S. Krusor
发明人： Thomas Hantschel , David K. Fork , Dirk De Bruyker , Chinnwen Shih , Jeng Ping Lu , Christopher L. Chua , Raj B. Apte , Brent S. Krusor
CPC分类号： G01R1/06744 , G01R1/06727 , G01R3/00 , H05K3/4092 , Y10T29/49204 , Y10T29/49208 , Y10T29/49218 , Y10T29/49222
摘要： Spring structures are subjected to pre-release and post-release annealing to tune their tip height to match a specified target. Post-release annealing increases tip height, and pre-release annealing decreases tip height. The amount of tuning is related to the annealing temperature and/or time. Annealing schedules are determined for a pre-fabricated cache of unreleased spring structures such that finished spring structures having a variety of target heights can be economically produced by releasing/annealing the cache according to associated annealing schedules. Selective annealing is performed using lasers and heat absorbing/reflecting materials. Localized annealing is used to generate various spring structure shapes. Both stress-engineered and strain-engineered spring structures are tuned by annealing.
摘要翻译： 弹簧结构经受预释放和后释放退火以调节其尖端高度以匹配指定的靶。 后释放退火增加尖端高度，并且预释放退火使尖端高度降低。 调谐量与退火温度和/或时间有关。 对于未发布的弹簧结构的预制缓存来确定退火计划，使得可以通过根据相关联的退火计划释放/退火高速缓存来经济地产生具有各种目标高度的成品弹簧结构。 使用激光和吸热/反射材料进行选择性退火。 定位退火用于产生各种弹簧结构形状。 应力设计和应变工程弹簧结构都通过退火进行调整。
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公开(公告)号：US20110271857A1
公开(公告)日：2011-11-10
申请号：US13185188
申请日：2011-07-18
IPC分类号： B41C3/00
摘要： A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften. A method of forming a printing plate provides an array of cells, first heats the array of cells such that the deformable polymer material does one of either melts or softens, actuates the cells in the array to assume a deformed state, cools the array of cells to solidify the cells in the deformed state, second heats the cells such that the deformable polymer material in selected ones of the cells does one of either soften or melt and return to a less deformed state to form a printing pattern, and cools the surface to solidify the deformable polymer material in the printing pattern. A method of forming a printing plate provides an array of cells, heats the array of cells such that the deformable polymer material softens, actuates selected ones of the cells to deform surfaces of the selected ones to form a printing pattern, and cools the array of cells to solidify the printing pattern into a printing plate.
摘要翻译： 印版具有衬底，衬底上的单元阵列，其中每个单元对应于印刷图像的元素，位于单元中的可变形聚合物材料，使得每个单元至少部分地由可变形聚合物材料形成， 当可变形聚合物材料是熔化或软化之一时，根据需要收集可变形聚合物材料的储存器，以及使可变形聚合物材料熔融或软化的加热器。 形成印版的方法提供了一个单元阵列，首先加热单元阵列，使得可变形的聚合物材料进行融化或软化之一，致动阵列中的单元以呈现变形状态，冷却单元阵列 使细胞在变形状态下固化，第二加热细胞，使得选定细胞中的可变形聚合物材料进行软化或熔化，并恢复到较小的变形状态以形成印刷图案，并将表面冷却至 使印刷图案中的可变形聚合物材料固化。 形成印版的方法提供了一个单元阵列，加热单元阵列使得可变形的聚合物材料软化，致动所选择的单元格以使选定的单元的表面变形以形成印刷图案，并且冷却 细胞将印刷图案固化成印版。
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公开(公告)号：US07987784B2
公开(公告)日：2011-08-02
申请号：US11613141
申请日：2006-12-19
摘要： A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften. A method of forming a printing plate provides an array of cells, first heats the array of cells such that the deformable polymer material does one of either melts or softens, actuates the cells in the array to assume a deformed state, cools the array of cells to solidify the cells in the deformed state, second heats the cells such that the deformable polymer material in selected ones of the cells does one of either soften or melt and return to a less deformed state to form a printing pattern, and cools the surface to solidify the deformable polymer material in the printing pattern. A method of forming a printing plate provides an array of cells, heats the array of cells such that the deformable polymer material softens, actuates selected ones of the cells to deform surfaces of the selected ones to form a printing pattern, and cools the array of cells to solidify the printing pattern into a printing plate.
摘要翻译： 印版具有衬底，衬底上的单元阵列，其中每个单元对应于印刷图像的元素，位于单元中的可变形聚合物材料，使得每个单元至少部分地由可变形聚合物材料形成， 当可变形聚合物材料是熔化或软化之一时，根据需要收集可变形聚合物材料的储存器，以及使可变形聚合物材料熔融或软化的加热器。 形成印版的方法提供了一个单元阵列，首先加热单元阵列，使得可变形的聚合物材料进行融化或软化之一，致动阵列中的单元以呈现变形状态，冷却单元阵列 使细胞在变形状态下固化，第二加热细胞，使得选定细胞中的可变形聚合物材料进行软化或熔化，并恢复到较小的变形状态以形成印刷图案，并将表面冷却至 使印刷图案中的可变形聚合物材料固化。 形成印版的方法提供了一个单元阵列，加热单元阵列使得可变形的聚合物材料软化，致动所选择的单元格以使选定的单元的表面变形以形成印刷图案，并且冷却 细胞将印刷图案固化成印版。
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