公开(公告)号：US20150092358A1

公开(公告)日：2015-04-02

申请号：US14072803

申请日：2013-11-06

Applicant: Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chao-Min Wang

Inventor： Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chao-Min Wang

IPC: H05K1/11

CPC classification number: H05K3/007 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0376 ,  H05K2203/0156 ,  H01L2924/00014

Abstract: A package carrier including a removable supporting plate and a circuit board is provided. The removable supporting plate includes a dielectric layer, a copper foil layer and a releasing layer. The dielectric layer is disposed between the copper foil layer and the releasing layer. The circuit board is disposed on the removable supporting plate and directly contacts the releasing layer. A thickness of the circuit board is between 30 μm and 100 μm.

Abstract translation: 提供一种包括可拆卸支撑板和电路板的封装载体。 可移除的支撑板包括介电层，铜箔层和释放层。 介电层设置在铜箔层和释放层之间。 电路板设置在可拆卸的支撑板上并直接接触释放层。 电路板的厚度在30μm和100μm之间。

公开(公告)号：US08803295B2

公开(公告)日：2014-08-12

申请号：US13371459

申请日：2012-02-12

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H01L21/00

CPC classification number: H05K3/28 ,  H05K3/062 ,  H05K2201/0338

Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. A covering layer is formed on the surface passivation layer, and the covering layer covers the surface passivation layer.

Abstract translation: 提供一种电路结构的制造方法。 提供具有上表面的金属层。 在金属层上形成表面钝化层。 表面钝化层暴露金属层的上表面的一部分，并且金属层的材料不同于表面钝化层的材料。 在表面钝化层上形成覆盖层，覆盖层覆盖表面钝化层。

公开(公告)号：US20140000109A1

公开(公告)日：2014-01-02

申请号：US13600222

申请日：2012-08-31

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H01K3/10

CPC classification number: H05K3/244 ,  H05K3/42 ,  H05K3/428 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: A manufacturing method of substrate structure is provided. A base material having a core layer, a first patterned copper layer, a second patterned copper layer and at least one conductive via is provided. The first and second patterned copper layers are respectively located on a first surface and a second surface of the core layer. The conductive via passes through the core layer and connects the first and second patterned copper layers. A first and a second solder mask layers are respectively formed on the first and second surfaces. Portions of the first and second patterned copper layers are exposed by the first and second solder mask layers, respectively. A first gold layer is formed on the first and second patterned copper layers exposed by the first and second solder mask layers. A nickel layer and a second gold layer are successively formed on the first gold layer.

Abstract translation: 提供了一种基板结构的制造方法。 提供具有芯层，第一图案化铜层，第二图案化铜层和至少一个导电通孔的基材。 第一和第二图案化铜层分别位于芯层的第一表面和第二表面上。 导电通孔穿过芯层并连接第一和第二图案化的铜层。 第一和第二焊料掩模层分别形成在第一和第二表面上。 第一和第二图案化铜层的部分分别由第一和第二焊料掩模层暴露。 在由第一和第二焊料掩模层暴露的第一和第二图案化铜层上形成第一金层。 在第一金层上依次形成镍层和第二金层。

公开(公告)号：US20130323927A1

公开(公告)日：2013-12-05

申请号：US13961844

申请日：2013-08-07

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H01L21/768

CPC classification number: H01L21/7685 ,  B82Y10/00 ,  H05K3/062 ,  H05K2201/0338

Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. The metal layer and the surface passivation layer are dipped into a modifier, and the modifier is selectively absorbed and attached to the surface passivation layer, so as to form a covering layer. The covering layer has a plurality of nanoparticles and covers the surface passivation layer.

Abstract translation: 提供一种电路结构的制造方法。 提供具有上表面的金属层。 在金属层上形成表面钝化层。 表面钝化层暴露金属层的上表面的一部分，并且金属层的材料不同于表面钝化层的材料。 将金属层和表面钝化层浸入改性剂中，并且改性剂被选择性地吸收并附着到表面钝化层，以形成覆盖层。 覆盖层具有多个纳米颗粒并覆盖表面钝化层。

公开(公告)号：US20120282738A1

公开(公告)日：2012-11-08

申请号：US13160501

申请日：2011-06-14

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H01L21/56 ,  H01L23/58 ,  B82Y99/00

CPC classification number: H01L21/7685 ,  B82Y10/00 ,  H05K3/062 ,  H05K2201/0338

Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. The metal layer and the surface passivation layer are dipped into a modifier, and the modifier is selectively absorbed and attached to the surface passivation layer, so as to form a covering layer. The covering layer has a plurality of nanoparticles and covers the surface passivation layer.

Abstract translation: 提供一种电路结构的制造方法。 提供具有上表面的金属层。 在金属层上形成表面钝化层。 表面钝化层暴露金属层的上表面的一部分，并且金属层的材料不同于表面钝化层的材料。 将金属层和表面钝化层浸入改性剂中，并且改性剂被选择性地吸收并附着到表面钝化层，以形成覆盖层。 覆盖层具有多个纳米颗粒并覆盖表面钝化层。

公开(公告)号：US20120280371A1

公开(公告)日：2012-11-08

申请号：US13371459

申请日：2012-02-12

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H01L23/58 ,  H01L21/56

CPC classification number: H05K3/28 ,  H05K3/062 ,  H05K2201/0338

Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. A covering layer is formed on the surface passivation layer, and the covering layer covers the surface passivation layer.

Abstract translation: 提供一种电路结构的制造方法。 提供具有上表面的金属层。 在金属层上形成表面钝化层。 表面钝化层暴露金属层的上表面的一部分，并且金属层的材料不同于表面钝化层的材料。 在表面钝化层上形成覆盖层，覆盖层覆盖表面钝化层。

公开(公告)号：US20150163908A1

公开(公告)日：2015-06-11

申请号：US14181739

申请日：2014-02-17

Applicant: Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chun-Kai Lin ,  Chao-Min Wang

Inventor： Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chun-Kai Lin ,  Chao-Min Wang

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/40 ,  H05K1/09

CPC classification number: H05K1/113 ,  H05K1/115 ,  H05K3/0097 ,  H05K3/4007 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/1536 ,  H05K2203/1563 ,  Y10T29/49165

Abstract: A circuit board includes a circuit layer, a first solder resist layer, a second solder resist layer and at least one conductive bump. The first solder resist layer is disposed on a lower surface of the circuit layer and has at least one first opening exposing a portion of the lower surface of the circuit layer. The second solder resist layer is disposed on an upper surface of the circuit layer and has at least one second opening exposing a portion of the upper surface of the circuit layer. The conductive bump is disposed inside the second opening of the second solder resist layer and directly connects to the upper surface of the circuit layer exposed by the second opening. A top surface of the conductive bump is higher than a second surface of the second solder resist layer.

Abstract translation: 电路板包括电路层，第一阻焊层，第二阻焊层和至少一个导电凸块。 第一阻焊层设置在电路层的下表面上，并且具有暴露电路层的下表面的一部分的至少一个第一开口。 第二阻焊层设置在电路层的上表面上，并且具有暴露电路层的上表面的一部分的至少一个第二开口。 导电凸块设置在第二阻焊层的第二开口内，并且直接连接到由第二开口暴露的电路层的上表面。 导电凸块的顶表面高于第二阻焊层的第二表面。

公开(公告)号：US08973258B2

公开(公告)日：2015-03-10

申请号：US13600222

申请日：2012-08-31

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H05K3/20

CPC classification number: H05K3/244 ,  H05K3/42 ,  H05K3/428 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: A manufacturing method of substrate structure is provided. A base material having a core layer, a first patterned copper layer, a second patterned copper layer and at least one conductive via is provided. The first and second patterned copper layers are respectively located on a first surface and a second surface of the core layer. The conductive via passes through the core layer and connects the first and second patterned copper layers. A first and a second solder mask layers are respectively formed on the first and second surfaces. Portions of the first and second patterned copper layers are exposed by the first and second solder mask layers, respectively. A first gold layer is formed on the first and second patterned copper layers exposed by the first and second solder mask layers. A nickel layer and a second gold layer are successively formed on the first gold layer.

Abstract translation: 提供了一种基板结构的制造方法。 提供具有芯层，第一图案化铜层，第二图案化铜层和至少一个导电通孔的基材。 第一和第二图案化铜层分别位于芯层的第一表面和第二表面上。 导电通孔穿过芯层并连接第一和第二图案化的铜层。 第一和第二焊料掩模层分别形成在第一和第二表面上。 第一和第二图案化铜层的部分分别由第一和第二焊料掩模层暴露。 在由第一和第二焊料掩模层暴露的第一和第二图案化铜层上形成第一金层。 在第一金层上依次形成镍层和第二金层。

公开(公告)号：US20090215490A1

公开(公告)日：2009-08-27

申请号：US12269911

申请日：2008-11-13

Applicant: Sheng Hua Lee ,  Yu-Ju Lee ,  Ching Sheng Chen

Inventor： Sheng Hua Lee ,  Yu-Ju Lee ,  Ching Sheng Chen

IPC: H04M1/00

CPC classification number: H04M1/72522 ,  G06K19/0701 ,  G06K19/0723 ,  H04M2250/14 ,  H04W8/183 ,  H04W12/00405 ,  H04W12/06 ,  H04W52/0251 ,  H04W88/02 ,  H04W88/06 ,  H04W92/08 ,  Y02D70/1224 ,  Y02D70/1242

Abstract: A method for handling a proactive command in a mobile system with a subscriber identity card, executed by a micro-processing unit (MCU) of a Baseband chip, is provided. A response code is received from the subscriber identity card, wherein the response code indicates the mobile system to fetch the proactive command for a specific procedure. It is determined whether the mobile system is under a specific condition after receiving the response code. The response code is ignored until the specific condition is absent.

Abstract translation: 提供了一种用于在具有基带芯片的微处理单元（MCU）执行的用户身份卡的移动系统中处理主动命令的方法。 从用户身份卡接收到响应代码，其中响应代码指示移动系统获取用于特定过程的主动命令。 在接收到响应码之后，确定移动系统是否处于特定状态。 响应代码被忽略，直到具体条件不存在为止。

公开(公告)号：US20080107051A1

公开(公告)日：2008-05-08

申请号：US11557122

申请日：2006-11-07

Applicant: Ching Sheng Chen

Inventor： Ching Sheng Chen

IPC: H04B7/00 ,  H04M1/00

CPC classification number: H04W48/18 ,  H04M1/72505 ,  H04M1/72519 ,  H04M2250/06 ,  H04W8/18

Abstract: A method of establishing a communication connection of a wireless communication device operable in a wireless local area network and a cellular phone network is provided. A wireless communication device, having access to the wireless local area network and the cellular phone network, is also provided. A user preference parameter is provided. The wireless local area network or the cellular phone network is selected according to the user preference parameter. A new communication connection is established using the selected network.

Abstract translation: 提供了一种建立在无线局域网和蜂窝电话网中可操作的无线通信设备的通信连接的方法。 还提供了一种具有访问无线局域网和蜂窝电话网络的无线通信设备。 提供用户偏好参数。 根据用户偏好参数选择无线局域网或蜂窝电话网络。 使用所选网络建立新的通信连接。