公开(公告)号：US08884717B2

公开(公告)日：2014-11-11

申请号：US13741398

申请日：2013-01-15

Applicant: Yu-Lin Liao ,  Ian-Chun Cheng

Inventor： Yu-Lin Liao ,  Ian-Chun Cheng

IPC: H01P5/12 ,  H03H7/46 ,  H03H7/01 ,  H03H1/00

CPC classification number: H03H7/01 ,  H03H7/463 ,  H03H2001/0092

Abstract: The invention discloses a diplexer formed from the combination of a first filter and a second filter, wherein both the first filter and the second filter have at least one through-hole via inductor. The diplexer has an input terminal to receive an input signal. The first filter has a first terminal electrically connected to the input terminal and a second terminal to generate a first output signal; the second filter has a third terminal electrically connected to the input terminal and a fourth terminal to generate a second output signal. The diplexer has a first output terminal electrically connected to the second terminal of the first filter to output the first output signal and a second output terminal electrically connected to the fourth terminal of the second filter to output the second output signal.

Abstract translation: 本发明公开了一种由第一滤波器和第二滤波器的组合形成的双工器，其中第一滤波器和第二滤波器都具有至少一个通孔通孔电感器。 双工器具有用于接收输入信号的输入端。 第一滤波器具有电连接到输入端子的第一端子和产生第一输出信号的第二端子; 第二滤波器具有电连接到输入端子的第三端子和用于产生第二输出信号的第四端子。 双工器具有电连接到第一滤波器的第二端子以输出第一输出信号的第一输出端子和电连接到第二滤波器的第四端子的第二输出端子，以输出第二输出信号。

公开(公告)号：US08802469B2

公开(公告)日：2014-08-12

申请号：US13109687

申请日：2011-05-17

Applicant: Chen-Fu Chu ,  Trung Tri Doan ,  Hao-Chun Cheng ,  Feng-Hsu Fan ,  Fu-Hsien Wang

Inventor： Chen-Fu Chu ,  Trung Tri Doan ,  Hao-Chun Cheng ,  Feng-Hsu Fan ,  Fu-Hsien Wang

IPC: H01L21/301

CPC classification number: H01L33/0079 ,  H01L33/0095

Abstract: A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies.

Abstract translation: 描述了在半导体制造期间分离多个管芯的方法。 在包含多个模具的半导体晶片的上表面上，除了存在一块停止电镀材料之外，金属层被沉积​​。 停止电镀材料被消除，并且在整个剩余结构上方形成阻挡层。 在阻挡层上方添加牺牲金属元素，然后去除衬底。 在消除各个管芯之间的半导体材料之后，将任何期望的接合焊盘和图案化电路添加到与牺牲金属元件相对的半导体表面，在该表面上添加钝化层，然后去除牺牲金属元件。 将胶带添加到现在暴露的阻挡层中，去除钝化层，将所得结构翻转，并且将带扩展以分离各个模具。

公开(公告)号：US20140130989A1

公开(公告)日：2014-05-15

申请号：US13674488

申请日：2012-11-12

Applicant: Louis Chan ,  Zhao Jun ,  Ding Chun Cheng

Inventor： Louis Chan ,  Zhao Jun ,  Ding Chun Cheng

IPC: E06B9/90 ,  E06B9/68

CPC classification number: E06B9/90 ,  E06B9/50 ,  E06B9/68 ,  E06B9/78 ,  E06B2009/905

Abstract: A window dressing control device includes a housing defining a base, an axially extending hollow cylinder, and an axially extending central shaft, the cylinder and shaft each projecting from the base so as to be substantially parallel and coaxial. The device also includes at least one resilient member between the cylinder and the shaft; a rotatable spool coupled to the housing about the cylinder, and a clutch device mounted on the spool. The resilient member engages the spool and the clutch device, providing a friction brake that bears on the inner wall of the cylinder (or a reinforcing insert within the cylinder) to resist rotation of the spool and clutch.

Abstract translation: 窗户修整控制装置包括限定基座，轴向延伸的中空圆柱体和轴向延伸的中心轴的壳体，所述圆柱体和轴每个从基部突出以基本平行和同轴。 该装置还包括在气缸和轴之间的至少一个弹性构件; 联接到壳体的可旋转的卷轴围绕圆柱体，以及安装在卷轴上的离合器装置。 弹性构件接合线轴和离合器装置，提供一个摩擦制动器，该摩擦制动器承载在气缸的内壁上（或气缸内的加强插件），以阻止滑阀和离合器的旋转。

公开(公告)号：US08664040B2

公开(公告)日：2014-03-04

申请号：US13331061

申请日：2011-12-20

Applicant: Chen-Hua Yu ,  Chung-Shi Liu ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng

Inventor： Chen-Hua Yu ,  Chung-Shi Liu ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/31 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A method includes performing an etching step on a package. The package includes a package component, a connector on a top surface of the package component, a die bonded to the top surface of the package component, and a molding material molded over the top surface of the package component. The molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and the connector is exposed.

Abstract translation: 一种方法包括对包装进行蚀刻步骤。 该包装包括包装部件，在包装部件的顶表面上的连接器，结合到包装部件的顶表面的管芯，以及模制在包装部件的顶表面上的模制材料。 成型材料覆盖连接器，其中通过蚀刻步骤去除覆盖连接器的成型材料的一部分，并且连接器被暴露。

公开(公告)号：US20130271240A1

公开(公告)日：2013-10-17

申请号：US13570267

申请日：2012-08-09

Applicant: Chen-Chung Liu ,  Ian-Chun Cheng

Inventor： Chen-Chung Liu ,  Ian-Chun Cheng

IPC: H03H7/01 ,  H05K13/00 ,  H05K1/16

CPC classification number: H01F17/0013 ,  H01F19/04 ,  H01F2017/002 ,  Y10T29/49117

Abstract: The invention discloses a high-frequency device having a through-hole via inductor in a substrate. The through-hole via inductor has an integral body. The inductance of the through-hole via inductor is greater than that of the horizontal inductor. The through-hole via inductor comprises at least two materials, wherein one of said at least two materials is a conductive material. The present invention also discloses a method for manufacturing the structure of the high-frequency device, wherein the method mainly includes via-drilling and via-filling in the substrate, and lithography process on the substrate.

Abstract translation: 本发明公开了一种在衬底中具有通孔通孔电感器的高频器件。 通孔通孔电感器具有整体。 通孔电感的电感大于水平电感的电感。 所述通孔通孔电感器包括至少两种材料，其中所述至少两种材料之一是导电材料。 本发明还公开了一种用于制造高频器件结构的方法，其中该方法主要包括衬底中的通孔钻孔和通孔填充以及衬底上的光刻工艺。

公开(公告)号：US20130271239A1

公开(公告)日：2013-10-17

申请号：US13741398

申请日：2013-01-15

Applicant: Yu-Lin Liao ,  Ian-Chun Cheng

Inventor： Yu-Lin Liao ,  Ian-Chun Cheng

IPC: H01P1/213

CPC classification number: H03H7/01 ,  H03H7/463 ,  H03H2001/0092

Abstract: The invention discloses a diplexer formed from the combination of a first filter and a second filter, wherein both the first filter and the second filter have at least one through-hole via inductor. The diplexer has an input terminal to receive an input signal. The first filter has a first terminal electrically connected to the input terminal and a second terminal to generate a first output signal; the second filter has a third terminal electrically connected to the input terminal and a fourth terminal to generate a second output signal. The diplexer has a first output terminal electrically connected to the second terminal of the first filter to output the first output signal and a second output terminal electrically connected to the fourth terminal of the second filter to output the second output signal.

Abstract translation: 本发明公开了一种由第一滤波器和第二滤波器的组合形成的双工器，其中第一滤波器和第二滤波器都具有至少一个通孔通孔电感器。 双工器具有用于接收输入信号的输入端。 第一滤波器具有电连接到输入端子的第一端子和产生第一输出信号的第二端子; 第二滤波器具有电连接到输入端子的第三端子和用于产生第二输出信号的第四端子。 双工器具有电连接到第一滤波器的第二端子以输出第一输出信号的第一输出端子和电连接到第二滤波器的第四端子的第二输出端子，以输出第二输出信号。

公开(公告)号：US08553336B2

公开(公告)日：2013-10-08

申请号：US13329222

申请日：2011-12-17

Applicant: Chun-Cheng Ko

Inventor： Chun-Cheng Ko

IPC: G02B13/18 ,  G02B3/02

CPC classification number: G02B9/10 ,  G02B13/003 ,  G02B13/18

Abstract: An image lens includes a first lens and a second lens. The first lens includes a first surface and a second surface. The second lens includes a third surface and a fourth surface. The image lens satisfies: FB/TTL>0.38; R11/F1>2.23; Z/Y>0.11; Z/T

Abstract translation: 图像透镜包括第一透镜和第二透镜。 第一透镜包括第一表面和第二表面。 第二透镜包括第三表面和第四表面。 图像透镜满足：FB / TTL> 0.38; R11 / F1> 2.23; Z / Y> 0.11; Z / T <0.42; R23 / F2

公开(公告)号：US08552458B2

公开(公告)日：2013-10-08

申请号：US12824163

申请日：2010-06-26

Applicant: Trung Tri Doan ,  Chen-Fu Chu ,  Wen-Huang Liu ,  Feng-Hsu Fan ,  Hao-Chun Cheng ,  Fu-Hsien Wang

Inventor： Trung Tri Doan ,  Chen-Fu Chu ,  Wen-Huang Liu ,  Feng-Hsu Fan ,  Hao-Chun Cheng ,  Fu-Hsien Wang

IPC: H01L33/02

CPC classification number: H01L33/62 ,  H01L33/641 ,  H01L2224/73265 ,  H01L2933/0066

Abstract: A light emitting diode includes a thermal conductive substrate having at least one electrical isolation layer configured to provide vertical electrical isolation and a heat transfer path through the substrate from a front side (first side) to a back side (second side) thereof. The light emitting diode includes an anode having a through interconnect, and a cathode having a through interconnect, which are arranged side by side on the substrate. The light emitting diode also includes a LED chip mounted to the substrate between the anode and the cathode. A method for fabricating the light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect.

Abstract translation: 发光二极管包括具有至少一个电隔离层的导热基板，该隔离层被配置为提供垂直电隔离和从基板的前侧（第一侧）到其后侧（第二侧）穿过基板的热传递路径。 发光二极管包括具有贯通互连的阳极和在基板上并排布置的具有通孔互连的阴极。 发光二极管还包括安装在阳极和阴极之间的衬底上的LED芯片。 一种制造发光二极管的方法包括以下步骤：提供具有电隔离层的导热衬底，在衬底的第一侧经由衬底并排形成阳极通孔和阴极，形成阳极 通过在阴极通孔中通过互连在阳极通孔和阴极之间的互连，通过互连将互连和阴极通过互连将衬底从衬底的第二侧延伸到阳极，并将LED芯片安装到与第一侧电连通的第一侧 阴极通过互连和阳极通过互连。

公开(公告)号：US08511423B2

公开(公告)日：2013-08-20

申请号：US13190586

申请日：2011-07-26

Applicant: Jian-Chun Cheng ,  Bin Liang ,  Juan Tu ,  Xia-Sheng Guo ,  Dong Zhang

Inventor： Jian-Chun Cheng ,  Bin Liang ,  Juan Tu ,  Xia-Sheng Guo ,  Dong Zhang

IPC: G01K11/00

CPC classification number: G10K11/04

Abstract: An acoustic diode includes a phononic crystal medium, a nonlinear acoustic medium, a aluminum tubes contain the phononic crystal medium and the nonlinear acoustic medium. The phononic crystal medium is fabricated by alternately laminating a water layers and a glass layers in a periodic manner.

Abstract translation: 声二极管包括声子晶体介质，非线性声学介质，含有声子晶体介质和非线性声学介质的铝管。 声子晶体介质是通过周期性地交替层叠水层和玻璃层来制造的。

公开(公告)号：US08507679B2

公开(公告)日：2013-08-13

申请号：US12966405

申请日：2010-12-13

Applicant: Yun Chi ,  Chun-Cheng Chou ,  Kuan-Lin Wu

Inventor： Yun Chi ,  Chun-Cheng Chou ,  Kuan-Lin Wu

IPC: C07F15/00 ,  H01L31/00

CPC classification number: C07F15/0046 ,  C07F15/0053 ,  H01G9/2031 ,  H01G9/2059 ,  H01L51/0061 ,  H01L51/0068 ,  H01L51/0086 ,  Y02E10/542 ,  Y02E10/549

Abstract: Photosensitizers having a formula of RuL1L2 (1) are provided, wherein Ru is ruthenium; L1 and L2 are heterocyclic tridentate ligands. L1 has a formula of (2), and L2 has a formula of G1G2G3 (3), wherein G1 and G3 are selected from the group consisting of formulae (4) to (7), and G2 is selected from the group consisting of formulae (7) and (8). The above-mentioned photosensitizers are suitable to be used as sensitizers for fabrication of high efficiency dye-sensitized solar cells.

Abstract translation: 提供具有式RuL1L2（1）的光敏剂，其中Ru是钌; L1和L2是杂环三齿配体。 L1具有式（2）的式，L2具有式G1G2G3（3）的式，其中G1和G3选自式（4）至（7），G2选自式 （7）和（8）。 上述光敏剂适用于制造高效染料敏化太阳能电池的敏化剂。