公开(公告)号：US20060075025A1

公开(公告)日：2006-04-06

申请号：US10538439

申请日：2003-01-21

Applicant: David Cheng ,  Vivien Fung ,  Andrew Padilla

Inventor： David Cheng ,  Vivien Fung ,  Andrew Padilla

IPC: G06F15/16

CPC classification number: H04L41/06 ,  H04L41/026 ,  H04L41/046 ,  H04L41/0803 ,  H04L41/085 ,  H04L51/34 ,  H04L67/10 ,  H04L69/329

Abstract: In one embodiment of the present invention's a system for tracking and managing data over a computer network including a plurality of application computers each operating a computer software application program is provided, comprising a key master (106, 108); a system startup module (100) connected to the key master (106, 108); a gatekeeper (102) connected to the system startup module (100); as task manager (122, 124, 126, 128's 130) connected to the key master (106, 108) and the gatekeeper (102); a central database (112, 114, 116) connected to the gatekeeper (102); a plurality of agents (132, 134, 136, 138, 140) connected to the task manager; a plurality of sub-agents (142, 144, 146, 148, 150) independently connected to the plurality of agents (132, 134, 136, 138, 140) and the plurality of application computers (152, 154,156, 158, 160); and an alert dispatcher (104) connected to the system startup module (100) and the gatekeeper (102).

Abstract translation: 在本发明的一个实施例中，提供了一种用于在包括多个应用计算机的计算机网络上跟踪和管理数据的系统，每个应用计算机各自操作计算机软件应用程序，包括密钥主机（106,108）; 连接到所述键主机（106,108）的系统启动模块（100）; 连接到系统启动模块（100）的网闸（102）; 连接到密钥主机（106,108）和网守（102）的任务管理器（122,124,126,128,130）; 连接到关守（102）的中央数据库（112,114,116）; 连接到任务管理器的多个代理（132,134,136,138,140）; 独立地连接到多个代理（132,134,136,138,140）和多个应用计算机（152,154,156,158,160）的多个子代理（142,144,146,148,150） ; 以及连接到系统启动模块（100）和关守（102）的警报调度器（104）。

公开(公告)号：US5769588A

公开(公告)日：1998-06-23

申请号：US700267

申请日：1996-08-20

Applicant: Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

Inventor： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

IPC: H01L21/02 ,  B65G49/05 ,  B65G49/07 ,  B65G65/00 ,  H01L21/205 ,  H01L21/285 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/677

CPC classification number: H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

Abstract: A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

公开(公告)号：US5696383A

公开(公告)日：1997-12-09

申请号：US647162

申请日：1996-05-09

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/16 ,  G01B11/255 ,  G01B11/30 ,  H01L21/00 ,  G01N21/86

CPC classification number: G01B11/16 ,  G01B11/255 ,  G01B11/306 ,  H01L21/67288

Abstract: A method and apparatus for measuring the curvature of a wafer. The apparatus includes a laser head that includes multiple laser sources that each emit a laser beam, each beam having a different wavelength. A CPU selects one of the sources to emit a beam. The beam is directed through a lens within the laser head and onto a surface of a wafer. The beam is reflected from the surface of the wafer and detected by a detector. The present invention includes a motor to cause relative motion between the laser head and the wafer such that the beam scans across the surface of the wafer, relaying data to the detector and the CPU. The CPU calculates the curvature of the wafer surface using the scanned data. The CPU selects a different laser source to direct a beam having a different wavelength at the wafer surface to avoid destructive interference that may occur with previously-used wavelengths. Other embodiments include the laser sources within a carousel apparatus, and the addition of a beamsplitter to transmit and reflect selected beams onto the wafer surface.

Abstract translation: 一种用于测量晶片曲率的方法和装置。 该装置包括激光头，其包括多个激光源，每个激光源发射激光束，每个光束具有不同的波长。 CPU选择一个源发射波束。 光束通过激光头内的透镜并被引导到晶片的表面上。 光束从晶片的表面反射并由检测器检测。 本发明包括一种电动机，用于在激光头和晶片之间产生相对运动，使得光束扫过晶片的表面，将数据中继到检测器和CPU。 CPU使用扫描数据计算晶片表面的曲率。 CPU选择不同的激光源以在晶片表面处引导具有不同波长的光束，以避免先前使用的波长可能发生的破坏性干扰。 其他实施例包括转盘装置内的激光源，以及添加分束器以将选定的光束传输并反射到晶片表面上。

公开(公告)号：US5670888A

公开(公告)日：1997-09-23

申请号：US484792

申请日：1995-06-07

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B7/06 ,  G01R31/26 ,  H01L21/68 ,  H01L21/683 ,  G01R31/02

CPC classification number: G01R31/2648 ,  G01B7/06 ,  H01L21/681 ,  H01L21/6838 ,  Y10S414/137 ,  Y10S414/141

Abstract: A method and apparatus for handling wafers. A wafer pick moves along a horizontal x-axis to unload a wafer from a cassette and position the wafer over a chuck. The chuck moves upwardly along a z-axis perpendicular to the surface of the wafer and lifts the wafer off the pick. The pick retracts through a slot in the chuck and a test probe moves along the x-axis to position itself over the wafer and chuck with reference to a calculated wafer center. The chuck then moves upwardly to engage the surface of the wafer with the probe. Wafer characteristics are tested at several test points located on a circle on the surface of the wafer by repeatedly lowering the chuck, rotating the chuck by a small amount, and raising the chuck to engage the wafer with the probe. The probe is then positioned to test another circle of points.

Abstract translation: 一种处理晶片的方法和装置。 晶片拾取器沿水平x轴移动以从盒子卸载晶片并将晶片定位在卡盘上。 卡盘沿垂直于晶片表面的z轴向上移动，并将晶片从拾取器上提起。 拾取器通过卡盘中的槽缩回，并且测试探针沿x轴移动，以参考计算的晶片中心自身位于晶片和卡盘上。 然后，卡盘向上移动以与探针接合晶片的表面。 通过重复地降低卡盘，使卡盘旋转少量，并且提升卡盘以使晶片与探针接合，在晶圆表面上圆的几个测试点上测试晶片特性。 然后定位探针以测试另一个圆圈。

公开(公告)号：US5523582A

公开(公告)日：1996-06-04

申请号：US142591

申请日：1993-10-22

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/16 ,  G01B11/255 ,  G01B11/30 ,  H01L21/00 ,  G01N21/86

CPC classification number: G01B11/16 ,  G01B11/255 ,  G01B11/306 ,  H01L21/67288

Abstract: A method and apparatus for measuring the curvature of a wafer. The apparatus includes a laser head that includes multiple laser sources that each emit a laser beam, each beam having a different wavelength. A CPU selects one of the sources to emit a beam. The beam is directed through a lens within the laser head and onto a surface of a wafer. The beam is reflected from the surface of the wafer and detected by a detector. The present invention includes a motor to cause relative motion between the laser head and the wafer such that the beam scans across the surface of the wafer, relaying data to the detector and the CPU. The CPU calculates the curvature of the wafer surface using the scanned data. The CPU selects a different laser source to direct a beam having a different wavelength at the wafer surface to avoid destructive interference that may occur with previously-used wavelengths. Other embodiments include the laser sources within a carousel apparatus, and the addition of a beamsplitter to transmit and reflect selected beams onto the wafer surface.

Abstract translation: 一种用于测量晶片曲率的方法和装置。 该装置包括激光头，其包括多个激光源，每个激光源发射激光束，每个光束具有不同的波长。 CPU选择一个源发射波束。 光束通过激光头内的透镜并被引导到晶片的表面上。 光束从晶片的表面反射并由检测器检测。 本发明包括一种电动机，用于在激光头和晶片之间产生相对运动，使得光束扫过晶片的表面，将数据中继到检测器和CPU。 CPU使用扫描数据计算晶片表面的曲率。 CPU选择不同的激光源以在晶片表面处引导具有不同波长的光束，以避免先前使用的波长可能发生的破坏性干扰。 其他实施例包括转盘装置内的激光源，以及添加分束器以将选定的光束传输并反射到晶片表面上。

公开(公告)号：US5227641A

公开(公告)日：1993-07-13

申请号：US793458

申请日：1991-11-18

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/16 ,  G01B11/255 ,  G01B11/30 ,  H01L21/00

CPC classification number: H01L21/67288 ,  G01B11/16 ,  G01B11/255 ,  G01B11/306

Abstract: A system for measuring the curvature of a surface includes a laser for emitting a beam of light to be incident upon the surface; a photodetector for detecting light reflected by the surface; a first stage for selectively moving the surface in a direction normal to the direction of the incident beam; a second stage for selectively moving the photodetector in a direction normal to the reflected beam; a sensor connected to the photodetector for detecting the displacement of the reflected beam relative to the photodetector.

Abstract translation: 用于测量表面曲率的系统包括用于发射入射到表面上的光束的激光器; 用于检测由所述表面反射的光的光电检测器; 用于在垂直于入射光束的方向的方向选择性地移动表面的第一阶段; 第二级，用于沿垂直于反射光束的方向选择性地移动光电探测器; 连接到光电检测器的传感器，用于检测反射光束相对于光电检测器的位移。

公开(公告)号：US5160402A

公开(公告)日：1992-11-03

申请号：US528297

申请日：1990-05-24

Applicant: David Cheng

Inventor： David Cheng

IPC: H01L21/302 ,  C23F4/00 ,  H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32935

Abstract: A plasma discharge endpoint detection system and method characterized by a plurality of individual data channels which are combined to create a composite function representative of the conditions within a plasma etch chamber. Preferably, a number of the channels are representative of spectral components within the optical spectrum caused by the plasma discharge within the etch chamber. A multi-channel sensor assembly is provided for this purpose including a number of light-guides for guiding light from the plasma discharge to filters and photosensors associated with the multiple channels. Other channels can detect various conditions such as the D.C. bias on a cathode within the plasma etch chamber. The various channels are digitized, weighted and summed within a digital computer to create the composite function from which endpoint and other conditions within the chamber can be determined. The method is characterized by the weighting and summing of a plurality of data channels carrying information about the conditions within a plasma etch chamber to develop a composite function and then analyzing the composite function to determine endpoint and other conditions. The endpoint detection method compares the slope of the composite function to a predetermined maximum slope value and identifies endpoint when the maximum slope value is exceeded a predetermined number of times.

公开(公告)号：US4927485A

公开(公告)日：1990-05-22

申请号：US225158

申请日：1988-07-28

Applicant: David Cheng ,  Robert P. Hartlage ,  Wesley W. Zhang

Inventor： David Cheng ,  Robert P. Hartlage ,  Wesley W. Zhang

IPC: G01B11/22 ,  H01J37/32 ,  H01L21/302 ,  H01L21/3065

CPC classification number: H01J37/32935 ,  G01B11/22

Abstract: A laser end point detector incorporating adjustable-focus, variable-orientation detection optics for monitoring different types of structures such as laser-transparent thin films, isolated trenches or holes and patterned arrays of trenches or holes is disclosed. A collector lens package comprising a laser and a focusing lens are mounted in a hole in a collector lens which is pivotally mounted for selectively focusing zero, first and higher orders of diffractions reflected from the wafer onto an associated detector to monitor the etching of different types of structures. For example, zero order diffraction signals are used to monitor the etching of large target areas in transparent thin films or of non-patterned trenches or holes. First order (or higher) diffraction signals are used for monitoring the etching of patterned features which effect a two-dimensional diffraction grating, such as the capacitor holes in dynamic random access memories.

公开(公告)号：US20130304535A1

公开(公告)日：2013-11-14

申请号：US13940629

申请日：2013-07-12

Applicant: David Cheng Hu ,  Charles Nelson ,  Tim Landvoigt ,  James Tarver ,  Claribel Chan

Inventor： David Cheng Hu ,  Charles Nelson ,  Tim Landvoigt ,  James Tarver ,  Claribel Chan

IPC: G06Q10/06

CPC classification number: G06Q10/0637 ,  G06Q10/067 ,  G06Q10/10

Abstract: Systems and techniques to allow a user to design and manage business solutions. The business solution management system (150) comprises a portal layer (112), an application layer (104) and a data repository (106). The portal layer (112) comprises at least first and second agents (204, 208). The application layer (104) comprises at least first and second software applications (220, 224). The first and second agents (204, 208) provide user interfaces to the first and second software applications (220, 224). The first software application (220) is operable to allow a user to design a business solution with user parameters and user-selectable, pre-defined business process objects and pre-defined technology objects. The second software application (224) is operable to allow a user to manage the business solution. The data repository (106) comprises the pre-defined business objects (316) and pre-defined technology objects (314).

Abstract translation: 允许用户设计和管理业务解决方案的系统和技术。 业务解决方案管理系统（150）包括门户层（112），应用层（104）和数据存储库（106）。 入口层（112）包括至少第一和第二代理（204,208）。 应用层（104）至少包括第一和第二软件应用（220,224）。 第一和第二代理（204,208）向第一和第二软件应用程序（220,224）提供用户界面。 第一软件应用程序（220）可操作以允许用户设计具有用户参数和用户可选择的预定义业务处理对象和预定义技术对象的业务解决方案。 第二软件应用程序（224）可操作以允许用户管理业务解决方案。 数据存储库（106）包括预定义的业务对象（316）和预定义的技术对象（314）。

公开(公告)号：US20120104726A1

公开(公告)日：2012-05-03

申请号：US13345565

申请日：2012-01-06

Applicant: Nancy Balcom ,  Louis Belanger ,  Torr Brown ,  Janusz Krawczynski ,  Phil Mundy ,  David Harding ,  David Cheng Cheng

Inventor： Nancy Balcom ,  Louis Belanger ,  Torr Brown ,  Janusz Krawczynski ,  Phil Mundy ,  David Harding ,  David Cheng Cheng

IPC: A61G5/10

CPC classification number: A61G5/1005 ,  A61G5/1054 ,  A61G5/1062 ,  A61G5/1064 ,  A61G5/1075 ,  A61G5/1089 ,  A61G5/125 ,  A61G5/128 ,  Y10T29/49716

Abstract: A modular wheelchair assembly is adapted to be reconfigured between a fixed angle of tilt, a dynamically adjustable tilt-in-space configuration with the tilt axis being near the user's knees and a dynamically adjustable tilt-in-space configuration with the tilt axis being near the user's center of gravity. The reconfiguration is achieved by modifying a limited number of selectively removable components of the support assembly or the pivot assembly of the wheelchair.