公开(公告)号：US5877043A

公开(公告)日：1999-03-02

申请号：US28014

申请日：1998-02-23

Applicant: David James Alcoe ,  Steven Wayne Anderson ,  Yifan Guo ,  Eric Arthur Johnson

Inventor： David James Alcoe ,  Steven Wayne Anderson ,  Yifan Guo ,  Eric Arthur Johnson

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/13 ,  H01L23/16 ,  H01L23/373 ,  H01L23/495 ,  H01L23/498 ,  H01L21/44

CPC classification number: H01L24/50 ,  H01L23/13 ,  H01L23/16 ,  H01L23/49572 ,  H01L23/49816 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/351

Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.

Abstract translation: 包括柔性基板，加强件和芯片的电子封装。 芯片被粘合到衬底上，固定到加强件上。 应变消除装置用于包装中的各个位置，以防止与包装件的各种元件之间的热膨胀系数相对较大差异相关的问题（例如带子“起皱”）。

公开(公告)号：US5786635A

公开(公告)日：1998-07-28

申请号：US767465

申请日：1996-12-16

Applicant: David James Alcoe ,  Sanjeev Balwant Sathe

Inventor： David James Alcoe ,  Sanjeev Balwant Sathe

IPC: H05K7/20 ,  H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433 ,  H01L23/10

CPC classification number: H01L23/3733 ,  H01L21/563 ,  H01L23/3677 ,  H01L23/4093 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01322 ,  Y10T156/1089 ,  Y10T156/1093

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.