公开(公告)号：US20090100671A1

公开(公告)日：2009-04-23

申请号：US12314450

申请日：2008-12-10

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC: H05K3/00

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

公开(公告)号：US20090072419A1

公开(公告)日：2009-03-19

申请号：US12076359

申请日：2008-03-17

Applicant: Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

Inventor： Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC: G02B6/10

CPC classification number: G02B6/43 ,  G02B6/1221 ,  G02B6/136 ,  H01L2224/16225

Abstract: A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.

Abstract translation: 一种制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在其之间设置有预定距离， 载体 抛光第一反射凸块和第二反射凸块的表面; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 在载体的上侧上堆叠上覆层以覆盖第一反射凸块，第二反射凸块和芯; 移除载体; 并且在上部包层的下侧层叠下部包层。 在导电载体上形成反射凸块，并且对反射凸块进行抛光以形成倾斜表面，可以减少交货时间并且可以提供高度的设计自由度。

公开(公告)号：US07489839B2

公开(公告)日：2009-02-10

申请号：US11984114

申请日：2007-11-13

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC: G02B6/12

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

公开(公告)号：US20080118200A1

公开(公告)日：2008-05-22

申请号：US11984114

申请日：2007-11-13

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC: G02B6/12

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Abstract translation: 公开了印刷电路板。 一种印刷电路板，包括第一板部分，柔性板部分，其一侧与第一板部分耦合并且包括电布线层和光波导以传输电信号和光信号;以及第二板 与柔性基板部分的另一侧耦合的部分，其中电布线层和光波导在其间具有间隙设置，可以通过使光波导和电布线层间隔开来提供更大的弯曲性和可靠性 在板的柔性部分之间，通过使光波导分别制造，然后在板的制造过程中插入，可以以更高的精度制造光波导以获得更高的可靠性。

公开(公告)号：US20080037929A1

公开(公告)日：2008-02-14

申请号：US11889327

申请日：2007-08-10

Applicant: Joon-Sung Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Sang-Hoon Kim

Inventor： Joon-Sung Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC: G02B6/13

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274

Abstract: An optical printed circuit board which can transfer optical signal and electric signals simultaneously, and a method of fabricating the optical printed circuit board. An optical printed circuit board which includes an upper cladding layer, a core layer positioned in the upper cladding layer that has a first reflecting surface and a second reflecting surface at both ends to guide optical signals, a lower cladding layer of which one side is in contact with the upper cladding layer and which has a circuit pattern and light connecting bumps on the other side corresponding to the first reflecting surface and the second reflecting surface, may provide the advantage of high optical connection efficiency.

Abstract translation: 可以同时传送光信号和电信号的光学印刷电路板，以及制造光学印刷电路板的方法。 一种光学印刷电路板，包括上包层，位于上包层中的芯层，其具有第一反射表面和两端的第二反射表面以引导光信号;一侧的下包层 与上包层接触并且具有电路图案和在与第一反射表面和第二反射表面相对应的另一侧上的光连接凸块可提供高的光连接效率的优点。

公开(公告)号：US07239767B2

公开(公告)日：2007-07-03

申请号：US10795612

申请日：2004-03-08

Applicant: Dong-Su Kim ,  Hyo-Hoon Park ,  Han-Seo Cho ,  Byung-Sup Rho ,  Sun-Tae Jung

Inventor： Dong-Su Kim ,  Hyo-Hoon Park ,  Han-Seo Cho ,  Byung-Sup Rho ,  Sun-Tae Jung

IPC: G02B6/12

CPC classification number: G02B6/42 ,  G02B6/4214 ,  H05K1/0274

Abstract: A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.

Abstract translation: 一种用于光学PCB上的光学互连的封装装置，包括：第一基板，其具有形成在其中的通孔，并且其中形成有光波导;光学互连块，其下端插入通孔的反射平面;第二基板 翻转接合到第一基板的上表面，以及光学活性元件，其被翻转接合到第二基板的下表面并对准以进行光通信。

公开(公告)号：US08761551B2

公开(公告)日：2014-06-24

申请号：US12926364

申请日：2010-11-12

Applicant: Sang Hoon Kim ,  Jong Ha Park ,  Han Seo Cho ,  Joon Sung Kim ,  Jae Hyun Jung

Inventor： Sang Hoon Kim ,  Jong Ha Park ,  Han Seo Cho ,  Joon Sung Kim ,  Jae Hyun Jung

IPC: G02B6/12

CPC classification number: G02B6/1221 ,  G02B6/43

Abstract: The present invention provides an optical flexible printed circuit board comprising: a base layer; an optical waveguide pattern disposed on a partial region of the base layer; an insulating layer which is disposed on the base layer with the optical waveguide pattern and has a surface profile bent by the optical waveguide pattern; and circuit wires disposed on one surface of the base layer.

Abstract translation: 本发明提供一种光学柔性印刷电路板，包括：基底层; 设置在所述基底层的部分区域上的光波导图案; 绝缘层，其设置在具有光波导图案的基底层上，并且具有由光波导图案弯曲的表面轮廓; 以及设置在基层的一个表面上的电路布线。

公开(公告)号：US08265445B2

公开(公告)日：2012-09-11

申请号：US13419826

申请日：2012-03-14

Applicant: Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

Inventor： Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC: G02B6/10 ,  C03B37/022

CPC classification number: G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

Abstract translation: 这里公开了一种用于光波导的印刷电路板，包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层，形成在下包层上并具有芯形成通孔的绝缘层，形成在下包层的区域上的芯部，其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

公开(公告)号：US08249403B2

公开(公告)日：2012-08-21

申请号：US12761716

申请日：2010-04-16

Applicant: Sang-Hoon Kim ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

Inventor： Sang-Hoon Kim ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

IPC: G02B6/12 ,  G02B6/10

CPC classification number: G02B6/4201 ,  G02B6/4214 ,  G02B6/428 ,  G02B6/43 ,  Y10T29/49117

Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin.

Abstract translation: 公开了一种光布线板及其制造方法。 根据本发明的实施例，该方法包括提供柔性光波导层，在光波导层的一个表面上选择性地形成加强包层，并在光波导层的另一个表面上根据 其中形成加强包层。 因此，只要在形成镜面凹槽的地方能够形成厚度的包层，即使光线路板通常薄，也可以制造具有挠性的挠性光布线板。

公开(公告)号：US08159824B2

公开(公告)日：2012-04-17

申请号：US12230700

申请日：2008-09-03

Applicant: Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

Inventor： Han-Seo Cho ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Sang-Hoon Kim

IPC: H05K1/00

CPC classification number: G02B6/4246 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/429 ,  H05K3/4691 ,  H05K2201/10121

Abstract: A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board unit and the other side stacked on the second board unit, where the flexible optical board includes a core through which the optical signals travel, a cladding surrounding the core, and a circuit pattern buried in the cladding which transmits electrical signals. By forming the rigid boards and the flexible optical board as an integrated structure, the need for separate connectors is obviated, and thus the cost of the product can be lowered.

Abstract translation: 公开了印刷电路板。 印刷电路板包括第一板单元和设置在其间的间隙的第二板单元和被配置为传输光信号的柔性光板，所述光信号具有堆叠在第一板单元上的一侧，而另一侧堆叠在 第二板单元，其中柔性光学板包括光信号行进的芯，围绕芯的包层以及掩埋在包层中的传输电信号的电路图案。 通过将刚性板和柔性光学板形成为一体结构，可以避免对单独的连接器的需要，从而可以降低产品的成本。