公开(公告)号：US07411306B2

公开(公告)日：2008-08-12

申请号：US11194669

申请日：2005-08-02

Applicant: Fang-Jun Leu ,  Shou-Lung Chen ,  Ching-Wen Hsiao ,  Shan-Pu Yu ,  Jyh-Rong Lin ,  I-Hsuan Peng ,  Jian-Shu Wu ,  Hui-Mei Wu ,  Chien-Wei Chieh

Inventor： Fang-Jun Leu ,  Shou-Lung Chen ,  Ching-Wen Hsiao ,  Shan-Pu Yu ,  Jyh-Rong Lin ,  I-Hsuan Peng ,  Jian-Shu Wu ,  Hui-Mei Wu ,  Chien-Wei Chieh

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

Abstract translation: 本发明涉及图像传感器模块的封装结构和方法。 该方法包括：提供具有第一图案化导电层的透明基板; 在所述透明基板上承载具有感光有源区域的图像传感器集成电路芯片和至少一个无源芯片，其中所述光敏有源区域面向所述透明基板; 在透明基板上形成绝缘堆积膜; 并且在绝缘堆积膜中形成多个导电通孔，其中导电通孔的端部与透明基板的无源芯片或第一图案化导电层连接，而导电通孔的另一端暴露在表面上 的绝缘堆积膜。 包装方法能够缩小图像传感器模块的结构，简化了处理步骤。

公开(公告)号：US20070105373A1

公开(公告)日：2007-05-10

申请号：US11270862

申请日：2005-11-09

Applicant: Liang-Tang Wang ,  Chi-Lin Chen ,  I-Hsuan Peng ,  Jung-Fang Chang ,  Chin-Jen Huang

Inventor： Liang-Tang Wang ,  Chi-Lin Chen ,  I-Hsuan Peng ,  Jung-Fang Chang ,  Chin-Jen Huang

IPC: H01L21/44

CPC classification number: H01L21/02532 ,  C23C16/0272 ,  C23C16/24 ,  C23C16/5096 ,  H01L21/02422 ,  H01L21/0262 ,  H01L27/1214

Abstract: A method for forming a polysilicon film in a plasma-assisted chemical vapor deposition (CVD) system including a chamber in which a first electrode and a second electrode spaced apart from the first electrode are provided comprises providing a substrate on the second electrode, the substrate including a surface exposed to the first electrode, applying a first power to the first electrode for generating a plasma in the chamber, applying a second power to the second electrode during a nucleation stage of the polysilicon film for ion bombarding the surface of the substrate, and flowing an erosive gas into the chamber.

Abstract translation: 一种在等离子体辅助化学气相沉积（CVD）系统中形成多晶硅膜的方法，包括：设置有与第一电极间隔开的第一电极和第二电极的腔室，包括在第二电极上设置衬底， 包括暴露于第一电极的表面，向第一电极施加第一功率以在腔室中产生等离子体，在用于离子轰击衬底表面的多晶硅膜的成核阶段期间向第二电极施加第二功率， 并将侵蚀性气体流入室内。

公开(公告)号：US07193848B2

公开(公告)日：2007-03-20

申请号：US10834081

申请日：2004-04-29

Applicant: Po-Hsuan Peng

Inventor： Po-Hsuan Peng

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/00

CPC classification number: G06F1/1656 ,  G06F1/1613 ,  G06F1/182 ,  G06F1/203 ,  H05K5/0213

Abstract: A portable industrial computer includes a host having an aperture located on a bottom side leading to the interior of the host and a movable heat dissipation panel pivotally coupled on the aperture in a movable manner to open or close the aperture. The movable heat dissipation panel has a top end extended outside the bottom side of the host and the aperture when the movable heat panel closes the aperture so when the portable industrial computer rested on a loading object generating a reaction force towards the interior of the host to push the movable heat dissipation panel to open the aperture for dispersing heat from the interior of the host. When the portable industrial computer removed from the loading object, the movable heat dissipation panel closes the aperture to prevent water or dust from entering the interior of the host avoiding damage.

Abstract translation: 一种便携式工业计算机包括主机，该主机具有位于主机内部的底侧上的孔，以及以可移动方式可枢转地联接在孔上的可移动散热板，以打开或关闭该孔。 可移动散热面板的顶端延伸到主体底部的外侧，当可移动热面板关闭孔时，当便携式工业计算机搁置在加载对象上时，该端部产生朝向主机内部的反作用力 推动可移动散热板打开用于分散主机内部热量的孔。 当便携式工业计算机从装载物体移除时，可移动散热板关闭孔径，以防止水或灰尘进入主机内部，避免损坏。

公开(公告)号：US20060093834A1

公开(公告)日：2006-05-04

申请号：US11285065

申请日：2005-11-21

Applicant: Yung-Jen Lin ,  Jung-Chang Hu ,  Chien-Ming Tseng ,  Hsuan-Peng Lin ,  Chih-Chao Hsu

Inventor： Yung-Jen Lin ,  Jung-Chang Hu ,  Chien-Ming Tseng ,  Hsuan-Peng Lin ,  Chih-Chao Hsu

IPC: B05D3/02 ,  B05D1/12 ,  B32B17/06 ,  B32B9/00 ,  B32B19/00

CPC classification number: C30B29/20

Abstract: A transparent ceramic structure and a method of surface treatment thereof are disclosed. A glass powder is applied over an unpolished surface of an intrinsically transparent ceramic structure. The ceramic structure is then placed in high temperature which is higher than the melting temperature of the glass powder and lower than 1,700 ° C. for about 1 minute to about 5 minutes. The transparent ceramic structure is removed from the environment and cooled down so as to obtain the desired transparency and strength of the ceramic structure.

Abstract translation: 公开了透明陶瓷结构及其表面处理方法。 将玻璃粉末涂覆在本体透明陶瓷结构的未抛光表面上。 然后将陶瓷结构放置在高于玻璃粉末的熔融温度的高温下，低于1,700℃约1分钟至约5分钟。 将透明陶瓷结构从环境中除去并冷却，以获得所需的陶瓷结构的透明度和强度。

公开(公告)号：US20060030070A1

公开(公告)日：2006-02-09

申请号：US11194669

申请日：2005-08-02

Applicant: Fang-Jun Leu ,  Shou-Lung Chen ,  Ching-Wen Hsiao ,  Shan-Pu Yu ,  Jyh-Rong Lin ,  I-Hsuan Peng ,  Jian-Shu Wu ,  Hui-Mei Wu ,  Chien-Wei Chieh

Inventor： Fang-Jun Leu ,  Shou-Lung Chen ,  Ching-Wen Hsiao ,  Shan-Pu Yu ,  Jyh-Rong Lin ,  I-Hsuan Peng ,  Jian-Shu Wu ,  Hui-Mei Wu ,  Chien-Wei Chieh

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

公开(公告)号：US5501266A

公开(公告)日：1996-03-26

申请号：US259625

申请日：1994-06-14

Applicant: Kuo K. Wang ,  Hsuan Peng ,  Nan Wang ,  Shau-Poh Wang

Inventor： Kuo K. Wang ,  Hsuan Peng ,  Nan Wang ,  Shau-Poh Wang

IPC: B22D17/20 ,  B22D17/00 ,  B22D17/30 ,  B29C45/18 ,  B29C45/23 ,  B22D23/00 ,  B22D27/08

CPC classification number: B22D17/007 ,  Y10S164/90

Abstract: A new method and apparatus for the injection molding of semi-solid materials (SSM). In this process (called Rheomolding), a superheated liquid metal is cooled into the semi-solid state in the barrel of a special vertical injection-molding machine, with the growing dendrites of the solid phase being broken into small and nearly spherical particles by the shearing force generated by the screw and barrel. Compared with the superheated liquid metal, SSM has lower temperature, lower shrinkage and a more stable flow pattern. Therefore, the rheomolding process can produce net-shape metal or metal-matrix-composite parts continuously at lower cost.

Abstract translation: 一种用于半固体材料（SSM）注射成型的新方法和装置。 在这个过程（称为Rheomolding）中，过热液态金属在特殊立式注射成型机的筒体中被冷却成半固体状态，其中固相的生长树枝状破碎成小而近似球形的颗粒 由螺杆和桶产生的剪切力。 与过热液态金属相比，SSM具有较低的温度，较低的收缩率和更稳定的流动模式。 因此，流变成型工艺可以以较低的成本连续生产网状金属或金属基复合材料。

公开(公告)号：US20130027321A1

公开(公告)日：2013-01-31

申请号：US13284986

申请日：2011-10-31

Applicant: Yen-Wen CHEN ,  I-Hsuan PENG ,  Yen-Yin CHU

Inventor： Yen-Wen CHEN ,  I-Hsuan PENG ,  Yen-Yin CHU

IPC: G06F3/041 ,  G09G5/00

CPC classification number: G06F3/04883 ,  G06F3/1446 ,  G09G2356/00

Abstract: A display system is disclosed. The display system includes several electrical apparatuses and a display control unit. The display control unit builds connections with the electrical apparatuses. The display control unit includes an information generating module and a display driving module. When the display system is in a combination display mode, the information generating module detects and generates combination information about combination relations among the display units of the electrical apparatuses. The display driving module drives each of the display units to display a corresponding image block according to the combination information. Hence, the displayed corresponding image blocks can be combined to form an entire image. A display method is also disclosed.

Abstract translation: 公开了一种显示系统。 显示系统包括多个电气设备和显示控制单元。 显示控制单元与电气设备建立连接。 显示控制单元包括信息产生模块和显示驱动模块。 当显示系统处于组合显示模式时，信息产生模块检测并产生关于电气设备的显示单元之间的组合关系的组合信息。 显示驱动模块根据组合信息驱动每个显示单元显示相应的图像块。 因此，可以组合显示的对应图像块以形成整个图像。 还公开了一种显示方法。

公开(公告)号：US20120250782A1

公开(公告)日：2012-10-04

申请号：US13166753

申请日：2011-06-22

Applicant: Yen-Wen CHEN ,  I-Hsuan PENG

Inventor： Yen-Wen CHEN ,  I-Hsuan PENG

IPC: H04L27/00

CPC classification number: H04L12/6418 ,  H04W40/02

Abstract: A data transmission system includes a mobile originated device and at least one cloud server. The mobile originated device obtains information of at least one datum to be transmitted. The mobile originated device builds connections with several candidate mobile devices through a first wireless data transmission interface, and selects at least one target mobile device from the candidate mobile devices. The mobile originated device obtains target-mobile-device information of the target mobile device through the first wireless data transmission interface. The mobile originated device transmits the target-mobile-device information and the information of the datum to be transmitted to the cloud server through a second wireless data transmission interface. The cloud server assists the mobile originated device to transmit the datum to be transmitted to the target mobile device according to the target-mobile-device information and the information of the datum to be transmitted.

Abstract translation: 数据传输系统包括移动发起装置和至少一个云服务器。 移动发起装置获取要发送的至少一个数据的信息。 移动发起的设备通过第一无线数据传输接口与几个候选移动设备建立连接，并从候选移动设备中选择至少一个目标移动设备。 移动发起装置通过第一无线数据传输接口获得目标移动装置的目标移动装置信息。 移动发起装置通过第二无线数据传输接口发送目标移动装置信息和要发送给云服务器的数据的信息。 云服务器协助移动发起设备根据目标移动设备信息和要发送的数据的信息，传输要发送到目标移动设备的数据。

公开(公告)号：US20110315841A1

公开(公告)日：2011-12-29

申请号：US12891693

申请日：2010-09-27

Applicant: Wan Lin Hsu ,  Po Hsuan Peng

Inventor： Wan Lin Hsu ,  Po Hsuan Peng

IPC: H05K5/03

CPC classification number: G06F1/187

Abstract: A mounting assembly is configured in a case having an opening and a door panel. The door panel is pivoted to the case so as to cover the opening or uncover the opening by removing the door panel. The mounting assembly includes at least one fixing rod, a stopper member, at least one elastic member and an actuator. The fixing rod is disposed on one inner side of the case adjacent to the opening. The stopper member and the elastic member are movably disposed on the fixing rod. The actuator is disposed on the door panel. When the door panel covers the opening, the actuator is incorporated with the stopper member, such that the stopper member shields the opening, so as to avoid an object moving around or away from the case through the opening.

Abstract translation: 安装组件构造成具有开口和门板的壳体。 门板通过拆卸门板而枢转到壳体以覆盖开口或露出开口。 安装组件包括至少一个固定杆，止动构件，至少一个弹性构件和致动器。 固定杆设置在与开口相邻的壳体的一个内侧上。 止动构件和弹性构件可移动地设置在固定杆上。 执行器设置在门板上。 当门面板覆盖开口时，致动器与止动构件并入，使得止动构件屏蔽开口，以避免物体通过开口移动或远离壳体。

公开(公告)号：USD649149S1

公开(公告)日：2011-11-22

申请号：US29359336

申请日：2010-04-08

Applicant: Po Hsuan Peng

Designer： Po Hsuan Peng