Abstract:
An electrostatic discharge (ESD) device with a parasitic silicon controlled rectifier (SCR) structure and controllable holding current is provided. A first distance is kept between a first N+ doped region and a first P+ doped region, and a second distance is kept between a second P+ doped region and a third N+ doped region. In addition, the holding current of the ESD device can be set to a specific value by modulating the first distance and the second distance. The holding current is in inverse proportion to the first distance and the second distance.
Abstract:
A high-voltage MOSFET having isolation structure is provided. An N-type MOSFET includes a first deep N-type well. A first P-type region is formed in the first deep N-type well to enclose a first source region and a first contact region. A first drain region is formed in the first deep N-type well. A P-type MOSFET includes a second deep N-type well. A second P-type region is formed in the second deep N-type well to enclose a second drain region. A second source region and a second contact region are formed in the second deep N-type well. A polysilicon gate oxidation layer is disposed above the thin gate oxidation layer and the thick field oxidation layer to control the current in the channel of the MOSFET. Separated P-type regions provide further isolation between MOSFETs. A first gap and a second gap increase the breakdown voltage of the high-voltage MOSFET.
Abstract:
A high voltage LDMOS transistor according to the present invention includes at least one P-field block in the extended drain region of the N-well. The P-field blocks form junction-fields in the N-well for equalizing the capacitance of parasitic capacitors between the drain region and the source region and fully deplete the drift region before breakdown occurs. A higher breakdown voltage is therefore achieved and the N-well having a higher doping density is thus allowed. The source region and P-field blocks enclose the drain region, which makes the LDMOS transistor self-isolated.
Abstract:
The present invention demonstrates a power-mode controlled power converter for supplying a constant output voltage and a constant output current. A PWM controller of the power-mode controlled power converter generates a PWM signal in response to the voltage sampled from a transformer auxiliary winding. A programmable current-sink and a detection resistor compensate for the voltage drop of an output rectifier. A low-pass filter integrates a switching-current voltage to an average-current signal. An attenuator produces an input-voltage signal from a line-voltage input signal. The PWM controller multiplies the average-current signal with the input-voltage signal to generate a power-control signal. An error-amplifier compares the power-control signal with a power-reference voltage to generate a limit voltage. The limit voltage controls the power delivered from a primary-side circuit to a secondary-side circuit of the power-mode controlled power converter. Since the power-reference voltage varies in proportional to output voltage variations, a constant output current is therefore achieved.
Abstract:
The present invention provides a forward power converter with a synchronized rectifying controller. The synchronized rectifying controller has a detection input for detecting the voltage of a secondary winding of a transformer, and thereby accurately measuring the PWM signal. Based on this measurement, the synchronized rectifying controller generates control signals for two secondary-side rectifying MOSFETs. The present invention also introduces a delay time using a timing resistor coupled to the synchronized rectifying controller. This avoids cross-conduction from secondary-side MOSFETs. The present invention also includes an output current-sense mechanism to avoid reverse inductor currents under light-load conditions.
Abstract:
An electrostatic discharge (ESD) protection device with adjustable single-trigger or multi-trigger voltage is provided. The semiconductor structure has multi-stage protection semiconductor circuit finction and adjustable discharge capacity. The single-trigger or multi-trigger semiconductor structure may be fabricated by using the conventional semiconductor process, and can be applied to IC semiconductor design and to effectively protect the important semiconductor devices and to prevent the semiconductor devices from ESD damage. In particular, the present invention can meet the requirements of high power semiconductor device and has better protection function compared to conventional ESD protection circuit. In the present invention, a plurality of N-wells or P-wells connected in parallel are used to adjust the discharge capacity of various wells in the P-substrate so as to improve the ESD protection capability and meet different power standards.
Abstract:
The present invention discloses a switching control circuit for a primary-side controlled power converter. A voltage-waveform detector produces a voltage-feedback signal and a discharge-time signal. A current-waveform detector generates a current-waveform signal by measuring a primary-side switching current. An integrator generates a current-feedback signal by integrating the current-waveform signal with the discharge time. A time constant of the integrator is correlated with the switching frequency, thus the current-feedback signal is proportional to an output current of the power converter. A PWM circuit controls the pulse width of the switching signal in response to the outputs of a voltage-loop error amplifier and a current-loop error amplifier. The output voltage and the maximum output current of the power converter are therefore regulated.
Abstract:
A MOSFET device with an isolation structure for a monolithic integration is provided. A P-type MOSFET includes a first N-well disposed in a P-type substrate, a first P-type region disposed in the first N-well, a P+ drain region disposed in the first P-type region, a first source electrode formed with a P+ source region and an N+ contact region. The first N-well surrounds the P+ source region and the N+ contact region. An N-type MOSFET includes a second N-well disposed in a P-type substrate, a second P-type region disposed in the second N-well, an N+drain region disposed in the second N-well, a second source electrode formed with an N+ source region and a P+ contact region. The second P-type region surrounds the N+ source region and the P+ contact region. A plurality of separated P-type regions is disposed in the P-type substrate to provide isolation for transistors.
Abstract:
A method of manufacturing different-voltage devices mainly comprises forming at least one high-voltage well in high-voltage device regions, at least one N-well in low-voltage device regions, at least one P-well in low-voltage device regions, source/drain wells in high-voltage device regions, and isolation wells in isolation regions in a p-type substrate. The breakdown voltage is adjusted by modulating the ion doping profile. Furthermore, parameters of implanting conductive ions are adjusted for implanting conductive ions into both high-voltage device regions and low-voltage device regions. The isolation wells formed in isolation regions between devices are for separating device formed over high-voltage device regions and device formed over low-voltage device regions. The thickness of a HV gate oxide layer is thicker than the thickness of an LV gate oxide layer for modulating threshold voltages of high-voltage devices and low-voltage devices.
Abstract:
An electrostatic discharge (ESD) device with latch-up immunity is provided. The ESD device has an equivalent SCR structure when a supply voltage is not applied thereto and has an equivalent PN diode structure when the supply voltage is applied thereto, thus freeing the ESD device from the latch-up phenomenon.