Abstract:
A method of fabricating a contact plug of a semiconductor device is provided, the method includes forming a gate pattern on a substrate, forming a capping pattern to cover an upper surface and sidewalls of the gate pattern, forming an interlayer insulation layer on the substrate such that the interlayer insulation layer exposes an upper surface of the capping pattern, and removing a portion of the capping pattern and the interlayer insulation layer such that the upper surface of the capping pattern is planarized.
Abstract:
Disclosed is an electromechanical transducer and the method for manufacturing the same, which can detect or control deformation and vibration of a structure and flow of fluids by applying controlling forces. The electromechanical transducer of the present invention comprises a base substrate to which initial stress is applied; an electro-active material layer attached on the base substrate; and electrodes installed on the top and bottom side of the electro-active material layer for actuating the electro-active material layer, the base substrate and the electro-active material layer which is deformed when initial stress is removed from the base substrate so that the base substrate and the electro-active material layer have curvatures.
Abstract:
An internal voltage generation device is disclosed which includes an internal voltage generator operated in response to an enable signal, the internal voltage generator generating an internal voltage using a reference voltage, and a sub-voltage generator for driving an output terminal of the internal voltage generator to a predetermined voltage level in response to a control signal.
Abstract:
A precharge control circuit includes a precharge control unit and a precharge unit. The precharge control unit controls and outputs a precharge signal in response to a read command signal, a write command signal, and a first signal. The precharge unit precharges local input/output lines in response to a signal output from the precharge control unit.
Abstract:
A WLAN distributed/opportunistic scheduling (WDOS) method for acquiring a multi-user diversity gain is disclosed. The WDOS method allows a transmitter (i.e., a transmission user) to observe channel conditions of receivers (i.e., reception users), and commands the transmitter to transmit packets to a specific receiver having a relative good channel condition. The WDOS method uses a modified RTS/CTS exchange method to perform the channel probing. If the transmitter broadcasts the BRTS frame, each receiver transmits a CTS frame after the lapse of its backoff period. According to the reception signal strength distribution, the backoff delay time minimizes the number of CTS collisions irrespective of the number of receivers, reduces an amount of channel probing overheads, and maximizes a multi-user diversity gain. The better the relative channel condition, the lower the backoff delay time.
Abstract:
A substrate bias voltage detection unit compares a level of a substrate bias voltage with a reference voltage in response to a self-refresh signal, an idle signal, and a refresh count signal so as to output an oscillating driving signal, enables the oscillating driving signal when the substrate bias voltage is equal to or higher than a first level in a normal mode, disables the oscillating driving signal when the substrate bias voltage is at a second level in a self-refresh mode, and disables the oscillating driving signal when the substrate bias voltage is at a third level in the self-refresh mode. An oscillation unit outputs an oscillating signal according to the oscillating driving signal. A voltage pumping unit controls pumping of the substrate bias voltage according to an output signal of the oscillation unit and then outputs a pumped substrate bias voltage.
Abstract:
An molding apparatus includes a core having a recessed part corresponding to a protruding part of a molded article, an ejector pin movably provided in the core to eject the molded article, an ejector sleeve movably provided in the core to push the protruding part of the molded article, and an ejector actuating part to move the ejector pin and the ejector sleeve together to a separation position where the protruding part of the molded article is separated from the recessed portion of the core, to bring the ejector sleeve into a stop position so that the ejector sleeve does not protrude from the core, and to move the ejector pin from the separation position to a removal position where the molded article is spaced apart from the core by a predetermined distance. Accordingly, the molding apparatus is capable of preventing damage caused on an ejector sleeve.
Abstract:
A semiconductor integrated circuit includes a multi-mode control signal generating section that enables one of up and down mat input/output switch control signals for controlling input/output switches in up and down mats according to up/down information addresses during a read operation mode, a multi-mode decoding section that simultaneously activates multi mat selection signals corresponding to one of the up mats and one of the down mats according to row addresses in an active operation mode, and a mat control section that receives the up and down mat input/output switch control signals and the multi mat selection signals and enables word lines and input/output switches in the mats corresponding to the signals.
Abstract:
In a method of manufacturing a semiconductor device such as a SONOS type semiconductor device, a trench is formed on a substrate. An isolation layer protruding from the substrate is formed to fill the trench. After a first layer is formed on the substrate, a preliminary second layer pattern is formed on the first layer. The preliminary second layer pattern has an upper face substantially lower than or substantially equal to an upper face of the isolation layer. A third layer is formed on the preliminary second layer and the isolation layer. A fourth layer is formed on the third layer. The fourth layer, the third layer, the preliminary second layer pattern and the first layer are partially etched to form a gate structure on the substrate. Source/drain regions are formed at portions of the substrate adjacent to the gate structure.
Abstract:
Disclosed therein are apparatus and method for manufacturing agricultural water supply hose, which can continuously supply a small quantity of water to various farm products or agricultural crops such as garden fruits. The apparatus and method can firmly bond the nozzle chips on the hose without regard to materials and constituents of the nozzle chips not by thermally bonding the nozzle chips on the inner periphery of the hose but by bonding the nozzle chips on the inner periphery of the hose after coating the inner periphery of the hose with an adhesive which is supplied from an adhesive coating device, thereby increasing durability. The apparatus and method can prevent distortion of the bonded portion and concentration of stress on the bonded portion even though the coefficients in thermal expansion of the nozzle chips and the hose are different from each other since the bonding between the nozzle chips and the hose is carried out after the hose is sufficiently cooled from a melting point. The apparatus and method can supply the nozzle chips up to a place, where the nozzle chips will be bonded, in such a way that the nozzle chips supplied from a bowl feeder is supplied forwardly by constant-speed rollers and then supplied to a portion, which will be bonded, by chip inputting rollers rotating rapidly, thereby supplying the nozzle chips more easily and conveniently.