公开(公告)号：US08633396B2

公开(公告)日：2014-01-21

申请号：US12714077

申请日：2010-02-26

Applicant: Eung Suek Lee ,  Jee Soo Mok ,  Jun Oh Hwang

Inventor： Eung Suek Lee ,  Jee Soo Mok ,  Jun Oh Hwang

IPC: H05K1/09

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L2224/1132 ,  H01L2224/11901 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a die mounting substrate, which includes a mounting substrate having a pad, a die having a terminal and surface-mounted on the mounting substrate, and a conductive paste bump formed on the pad or the terminal so as to connect the pad and the terminal to each other. When the die is connected and mounted on the mounting substrate using the conductive paste bump, shear stress is relieved thus preventing reliability from decreasing due to a difference in the coefficient of thermal expansion between the die and the mounting substrate, and also preventing the force of adhesion of the bump from decreasing due to the reduction in size of the pad of the mounting substrate.

Abstract translation: 公开了一种管芯安装基板，其包括具有焊盘的安装基板，具有端子并且表面安装在安装基板上的管芯，以及形成在焊盘或端子上的导电焊膏，以便将焊​​盘和 终端彼此。 当使用导电膏凸点将管芯连接并安装在安装基板上时，解除剪切应力，从而防止由于管芯和安装基板之间的热膨胀系数的差异导致的可靠性降低，并且还防止 由于安装基板的焊盘的尺寸的减小，凸块的粘附性降低。

公开(公告)号：US20110120758A1

公开(公告)日：2011-05-26

申请号：US12714077

申请日：2010-02-26

Applicant: Eung Suek Lee ,  Jee Soo Mok ,  Jun Oh Hwang

Inventor： Eung Suek Lee ,  Jee Soo Mok ,  Jun Oh Hwang

IPC: H05K1/09 ,  H05K1/16 ,  H01L21/60

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L2224/1132 ,  H01L2224/11901 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a die mounting substrate, which includes a mounting substrate having a pad, a die having a terminal and surface-mounted on the mounting substrate, and a conductive paste bump formed on the pad or the terminal so as to connect the pad and the terminal to each other. When the die is connected and mounted on the mounting substrate using the conductive paste bump, shear stress is relieved thus preventing reliability from decreasing due to a difference in the coefficient of thermal expansion between the die and the mounting substrate, and also preventing the force of adhesion of the bump from decreasing due to the reduction in size of the pad of the mounting substrate.

Abstract translation: 公开了一种管芯安装基板，其包括具有焊盘的安装基板，具有端子并且表面安装在安装基板上的管芯，以及形成在焊盘或端子上的导电焊膏，以便将焊​​盘和 终端彼此。 当使用导电膏凸点将管芯连接并安装在安装基板上时，解除剪切应力，从而防止由于管芯和安装基板之间的热膨胀系数的差异导致的可靠性降低，并且还防止 由于安装基板的焊盘的尺寸的减小，凸块的粘附性降低。

公开(公告)号：US20090321109A1

公开(公告)日：2009-12-31

申请号：US12352090

申请日：2009-01-12

Applicant: Jun-Oh Hwang ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

Inventor： Jun-Oh Hwang ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

IPC: H05K7/20 ,  H05K3/10

CPC classification number: B82Y10/00 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/183 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0108 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 该方法可以包括 提供绝缘层，其中第一金属层形成在绝缘层的一侧上; 在绝缘层上形成凹槽; 在所述槽的内侧和所述绝缘层的另一侧上形成金属物质; 以及通过去除所述第一金属层的一部分，在所述绝缘层的一侧中的至少一个和形成在所述凹槽上的所述金属物质之间形成第一电路图案。 本发明通过设置与基板直接接触的散热器和印刷电路板的制造方法来提供具有高发热效率的印刷电路板。

公开(公告)号：US20090294956A1

公开(公告)日：2009-12-03

申请号：US12219442

申请日：2008-07-22

Applicant: Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

Inventor： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC: H01L23/467 ,  F28F7/00 ,  H01L21/58 ,  B21D53/02

CPC classification number: H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin.

Abstract translation: 本发明公开了一种冷却翅片，其冷却性能优良，制造简单，包括冷却翅片的封装基板及其制造方法。 含有碳成分的可燃糊剂被施加到模具的凹槽中，从而形成具有对应于凹槽的图案的冷却翅片。 因此，能够制造具有各种构造的散热片，从而提高包含冷却片的封装基板的冷却性能。