摘要:
Provided is a releasable pressure sensitive adhesive sheet, which is mainly used for a coating film for an automobile, and which is applicable to a coating film with insufficient curing immediately after drying. Specifically provided is a releasable pressure sensitive adhesive sheet for a curable coating film, which has a pressure sensitive adhesive layer on one face of a front substrate, in which a face of the pressure sensitive adhesive layer out of contact with the front substrate has a rolling circle arithmetic mean waviness (Wea) specified in JIS B0610 of 0.30 μm or less.
摘要翻译:提供一种主要用于汽车涂膜的可剥离压敏粘合片,其可应用于干燥后立即不足固化的涂膜。 具体地提供了一种用于可固化涂膜的可剥离压敏粘合片,其在前基板的一个表面上具有压敏粘合剂层,其中压敏粘合剂层的与前基板不接触的表面具有轧制 JIS B0610规定的圆度算术平均波纹度(Wea)为0.30μm以下。
摘要:
A plug-in unit-mounting structure which makes it possible to efficiently accommodate plug-in units without being dependent on the structure of a shelf. The plug-in unit-mounting structure comprises a shelf that has connectors disposed on a back wiring board, for being fitted to the plug-in units, and at least one mounting frame that is mounted in the shelf, for each accommodating an associated one of the plug-in units, and enabling the plug-in unit to be inserted in and removed from an associated one of the connectors, the mounting frame being provided with a guide rail which enables a position of disposition of the plug-in unit to be changed according to a size of the plug-in unit. This makes it possible to efficiently accommodate plug-in units without being dependent on the structure of a shelf.
摘要:
In an electronic device test apparatus using image processing technology to position an IC device relative to a socket, a calibration method of an electronic device test apparatus of calibrating a relative position of a device camera with respect to a socket, the method comprising: calculating an offset amount of a socket guide with respect to the socket on the basis of a relative position of the socket camera with respect to the socket guide and a relative position of a socket camera with respect to the socket; and adding this offset amount to the relative position of the device camera with respect to the socket guide so as to calculate the relative position of the device camera with respect to the socket.
摘要:
The radiator device which radiates heat generated by electronic components mounted on a printed board, and the plug-in unit which the radiator device is equipped to is provided in order to reliably absorb errors in height among various electronic components while realizing a high heat radiation efficiency. The device and the plug-in unit includes: a radiating board which is connected to an electronic component side of a printed board mounted with one or more electronic components thereon, with a specific space between the radiating board and the printed board; a heat conductive block which is connected to a side of the radiating board that faces the printed board in such a manner that the position of the heat conductive block is adjustable along a direction crossing the printed board, the heat conductive block making intimate contact with an electronic component mounted on the printed board.
摘要:
A heat radiating apparatus includes a radiator adhering to an electronic component mounted on a circuit board via an elastic member provided on the circuit board so that the electronic component is cooled. The radiator includes a plurality of projection parts, the elastic member includes an engaging part configured to engage the projection part and a radiator insert hole forming part where the radiator is inserted, and a pushing force is applied from the elastic member to the radiator by rotating the radiator so that the projection part is engaged by the engaging part, and thereby a bottom surface of the radiator is adhered to the electronic component.
摘要:
There is disclosed an acrylic fiber (a) consisting of an acrylonitrile polymer comprising an acrylonitrile unit in at least 80 wt % and less than 95 wt %, (b) having a monofilament dry strength of 2.5 to 4.0 cN/dtex, (c) having a monofilament dry elongation of 35 to 50%, and (d) forming a crack with a length of 20 &mgr;m or more in its tension rupture lateral surface along the filament axis direction when rupturing the monofilament in a tension test. The fiber has even orientation in its surface and inside; is significantly improved in dry strength, dry elongation and dyeability; and exhibits wool-like hand feeling. It is, therefore, quite suitable as a synthetic fiber for various applications such as a garment material, e.g., a sweater and a home furnishing material such as a pile.
摘要:
The present invention aims at implementing acceleration of the hop-by-hop transfer without using a high-speed processor. In the present invention, a transfer destination searching circuit (12) constituted by hardware is provided in addition to a processor (11). In the transfer destination searching circuit (12), after header information has been extracted from received IP packet data, a content addressable memory (21) is first searched by using the header information as a key. If corresponding forwarding information cannot be obtained from the searching of the content addressable memory (21), HASH function searching is executed by employing an HASH searching pointer table (22). If the forwarding information is obtained from a forwarding table (23) as a result of these searching operations, the hop-by-hop transfer of the IP packet data is executed in accordance with the forwarding information.
摘要:
The carbon fiber precursor fiber bundle of the present invention is an acrylonitrile-based fiber bundle wherein the ratio of the length and width of the fiber cross section of a monofilament (length/width) is 1.05 to 1.6, and the amount of Si measured by ICP (Inductively Coupled Plasma) atomic emission spectrometry is in the range of 500 to 4,000 ppm. This type of carbon fiber precursor fiber bundle has a high compactness, and the carbonizing processing ability is good. Furthermore, for the carbon fiber bundle which is to obtained hereafter, the resin impregnating ability and tow spreading ability are good, the strength increases, and it has bulkiness. Furthermore, the carbon fiber precursor fiber bundle of the present invention is an acrylonitrile-based fiber bundle wherein the liquid content ratio HW is 40 wt. % or more and less than 60 wt. %. The carbon fiber bundle obtained from this type of carbon fiber precursor fiber bundle improves the bulkiness and is superior in resin impregnating ability, tow spreading ability, and covering ability when made into cloth.
摘要:
A carbon fiber precursor fiber bundle which permits easy bundling of a plurality of small tows into one bundle, is provided with a dividing capability to divide into the original small tows spontaneously at the time of firing, and is suitable for obtaining a carbon fiber that is excellent in productivity and quality. A carbon fiber precursor fiber bundle that has a degree of intermingle of 1 m−1 or less between small tows, consists of substantially straight fibers without imparted crimp, a tow of which straight fibers has a moisture content of less than 10% by mass when housed in a container, and has a widthwise dividing capability to maintain a form of a single aggregate of tows when housed in a container, taken out from the container and guided into a firing step, and to divide into a plurality of small tows in the firing step by the tension generated in the firing step.
摘要:
In an electronic device test apparatus using image processing technology to position an IC device relative to a socket, a calibration method of an electronic device test apparatus of calibrating a relative position of a device camera with respect to a socket, the method comprising: calculating an offset amount of a socket guide with respect to the socket on the basis of a relative position of the socket camera with respect to the socket guide and a relative position of a socket camera with respect to the socket; and adding this offset amount to the relative position of the device camera with respect to the socket guide so as to calculate the relative position of the device camera with respect to the socket.