公开(公告)号：US07866036B2

公开(公告)日：2011-01-11

申请号：US12250652

申请日：2008-10-14

Applicant: Jonathan C. Doan ,  Satyadev R. Patel ,  Robert M. Duboc, Jr.

Inventor： Jonathan C. Doan ,  Satyadev R. Patel ,  Robert M. Duboc, Jr.

IPC: H05K3/02 ,  H05K3/10

CPC classification number: G02B26/0841 ,  G02B26/0833 ,  Y10T29/49155

Abstract: A micromirror device and a method of making the same are disclosed herein. The micromirror device comprises a mirror plate, hinge, and post each having an electrically conductive layer. One of the hinge, mirror plate, and post further comprises an electrically insulating layer. To enable the electrical connections between the conducting layers of the hinge, mirror plate, and post, the insulating layer is patterned.

Abstract translation: 本文公开了一种微镜器件及其制造方法。 微镜装置包括各自具有导电层的镜板，铰链和柱。 铰链，镜板和柱中的一个还包括电绝缘层。 为了实现铰链，镜板和柱的导电层之间的电连接，绝缘层被图案化。

公开(公告)号：US07671428B2

公开(公告)日：2010-03-02

申请号：US11102186

申请日：2005-04-07

Applicant: Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

Inventor： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

IPC: H01L21/50

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

公开(公告)号：US07002726B2

公开(公告)日：2006-02-21

申请号：US11034294

申请日：2005-01-11

Applicant: Satyadev R. Patel ,  Andrew G. Huibers

Inventor： Satyadev R. Patel ,  Andrew G. Huibers

IPC: G02B26/00

CPC classification number: B82Y30/00 ,  G02B26/0841 ,  H04N5/7458

Abstract: A spatial light modulator is disclosed, along with a method for making such a modulator that comprises an array of micromirror devices. The center-to-center distance and the gap between adjacent micromirror devices are determined corresponding to the light source being used so as to optimize optical efficiency and performance quality. The micromirror device comprises a hinge support formed on a substrate and a hinge that is held by the hinge support. A mirror plate is connected to the hinge via a contact, and the distance between the mirror plate and the hinge is determined according to desired maximum rotation angle of the mirror plate, the optimum gap and pitch between the adjacent micromirrors. In a method of fabricating such spatial light modulator, one sacrificial layer is deposited on a substrate followed by forming the mirror plates, and another sacrificial layer is deposited on the mirror plates followed by forming the hinge supports. The two sacrificial layers are removed via the small gap between adjacent mirror devices with spontaneous vapor phase chemical etchant. Also disclosed is a projection system that comprises such a spatial light modulator, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.

Abstract translation: 公开了一种空间光调制器，以及用于制造这样的调制器的方法，该调制器包括微镜器件阵列。 根据所使用的光源确定中心到中心的距离和相邻的微反射镜装置之间的间隙，以优化光学效率和性能质量。 微反射镜装置包括形成在基底上的铰链支撑件和由铰链支撑件保持的铰链。 镜板通过触点连接到铰链，并且根据镜板的期望的最大旋转角度，相邻微镜之间的最佳间隙和间距来确定镜板和铰链之间的距离。 在制造这种空间光调制器的方法中，将一个牺牲层沉积在衬底上，随后形成镜板，并且另一牺牲层沉积在镜板上，随后形成铰链支架。 通过具有自发气相化学蚀刻剂的相邻反射镜装置之间的小间隙去除两个牺牲层。 还公开了一种投影系统，其包括这样的空间光调制器以及光源，聚光光学器件，其中来自光源的光聚焦到微镜阵列上，用于投射从微镜阵列反射的光的投影光学器件 以及用于选择性地致动阵列中的微镜的控制器。

公开(公告)号：US06995040B2

公开(公告)日：2006-02-07

申请号：US11093943

申请日：2005-03-29

Applicant: Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

Inventor： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

IPC: H01L21/44

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

公开(公告)号：US06741383B2

公开(公告)日：2004-05-25

申请号：US10155744

申请日：2002-05-24

Applicant: Andrew G. Huibers ,  Peter J. Heureux ,  Satyadev R. Patel

Inventor： Andrew G. Huibers ,  Peter J. Heureux ,  Satyadev R. Patel

IPC: G02B2000

CPC classification number: G02B26/0841

Abstract: A spatial light modulator having a micromirror and one or more deflection limiting mechanisms, and a process for fabrication therefor. In one embodiment, the mirror support structure has a deflection stopping mechanism that limits the tilt angle of the reflective plate. Alternatively, a deflection stopping mechanism can be provided separate from the mirror support structure. The deflection stopping mechanism can be used in conjunction with one or more additional stopping mechanisms such as the abutment of a portion of the reflective plate against the substrate upon which it was constructed and/or abutment of the micromirror on a surface or structure of the circuit substrate.

Abstract translation: 具有微反射镜和一个或多个偏转限制机构的空间光调制器及其制造方法。 在一个实施例中，反射镜支撑结构具有限制反射板的倾斜角度的偏转停止机构。 或者，偏转止动机构可以与镜支撑结构分开设置。 偏转止动机构可以与一个或多个附加止动机构结合使用，例如反射板的一部分抵靠其上构造的基板和/或微镜在电路的表面或结构上的邻接 基质。

公开(公告)号：US06523961B2

公开(公告)日：2003-02-25

申请号：US09732445

申请日：2000-12-07

Applicant: Fedor A. Ilkov ,  Satyadev R. Patel ,  Peter W. Richards ,  John K. Stockton

Inventor： Fedor A. Ilkov ,  Satyadev R. Patel ,  Peter W. Richards ,  John K. Stockton

IPC: G03B2128

CPC classification number: G02B26/0841 ,  B82Y30/00

Abstract: In order to minimize light diffraction along the direction of switching and more particularly light diffraction into the acceptance cone of the projection optics, in the present invention, mirrors are provided which are not rectangular. Also, in order to minimize the cost of the illumination optics and the size of the display unit of the present invention, the light source is placed orthogonal to the rows (or columns) of the array, and/or the light source is placed orthogonal to a side of the frame defining the active area of the array. The incident light beam, though orthogonal to the sides of the active area, are not however, orthogonal to any substantial portion of sides of the individual mirrors in the array. Orthogonal sides cause incident light to diffract along the direction of mirror switching, and result in light ‘leakage’ into the on-state even if the mirror is in the off-state. This light diffraction decreases the contrast ratio of the mirror. The mirrors of the present invention result in an improved contrast ratio, and the arrangement of the light source to mirror array in the present invention results in a more compact system.

公开(公告)号：US07655492B2

公开(公告)日：2010-02-02

申请号：US11102183

申请日：2005-04-07

Applicant: Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

Inventor： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

IPC: H01L29/82

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Abstract translation: 公开了一种用于形成MEMS器件的方法，其中在晶片接合步骤之前执行最终释放步骤以保护MEMS器件免受污染，物理接触或其它有害的外部事件。 除了可选的静态处理之外，在释放和晶片接合和分离之间的MEMS结构没有额外的变化的情况下，MEMS器件是最佳保护的并且整个工艺流程得到改善。 该方法适用于任何MEMS器件的生产，并且特别有利于制造易碎的微镜。

公开(公告)号：US07629190B2

公开(公告)日：2009-12-08

申请号：US11094086

申请日：2005-03-29

Applicant: Satyadev R. Patel ,  Andrew G. Huibers

Inventor： Satyadev R. Patel ,  Andrew G. Huibers

IPC: H01L21/00

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on a first substrate. A second substrate is bonded onto the first substrate so as to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.

公开(公告)号：US07573111B2

公开(公告)日：2009-08-11

申请号：US11101939

申请日：2005-04-07

Applicant: Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

Inventor： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

IPC: H01L29/00

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Abstract translation: 公开了一种用于形成MEMS器件的方法，其中在晶片接合步骤之前执行最终释放步骤以保护MEMS器件免受污染，物理接触或其它有害的外部事件。 除了可选的静态处理之外，在释放和晶片接合和分离之间的MEMS结构没有额外的变化的情况下，MEMS器件是最佳保护的并且整个工艺流程得到改善。 该方法适用于任何MEMS器件的生产，并且特别有利于制造易碎的微镜。

公开(公告)号：US06972891B2

公开(公告)日：2005-12-06

申请号：US11034399

申请日：2005-01-11

Applicant: Satyadev R. Patel ,  Andrew G. Huibers

Inventor： Satyadev R. Patel ,  Andrew G. Huibers

IPC: B81C20060101 ,  G02B26/00 ,  G02B26/08 ,  G02F1/29 ,  H04N5/74

CPC classification number: B82Y30/00 ,  G02B26/0841 ,  H04N5/7458

Abstract: A spatial light modulator is disclosed, along with a method for making such a modulator that comprises an array of micromirror devices. The center-to-center distance and the gap between adjacent micromirror devices are determined corresponding to the light source being used so as to optimize optical efficiency and performance quality. The micromirror device comprises a hinge support formed on a substrate and a hinge that is held by the hinge support. A mirror plate is connected to the hinge via a contact, and the distance between the mirror plate and the hinge is determined according to desired maximum rotation angle of the mirror plate, the optimum gap and pitch between the adjacent micromirrors. In a method of fabricating such spatial light modulator, one sacrificial layer is deposited on a substrate followed by forming the mirror plates, and another sacrificial layer is deposited on the mirror plates followed by forming the hinge supports. The two sacrificial layers are removed via the small gap between adjacent mirror devices with spontaneous vapor phase chemical etchant. Also disclosed is a projection system that comprises such a spatial light modulator, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.