公开(公告)号：US20090291319A1

公开(公告)日：2009-11-26

申请号：US12301338

申请日：2007-05-18

申请人： Seiji Nagatani ,  Hiroshi Watanabe ,  Kazufumi Izumida

发明人： Seiji Nagatani ,  Hiroshi Watanabe ,  Kazufumi Izumida

IPC分类号： B32B15/20 ,  B32B15/04 ,  B05D1/36 ,  C25D5/00 ,  C23C14/34 ,  C25D5/10 ,  C25D5/34

CPC分类号： H05K3/025 ,  C23C30/00 ,  C25D1/04 ,  C25D1/20 ,  C25D5/10 ,  C25D5/34 ,  H05K2201/0323 ,  Y10T428/12438 ,  Y10T428/12625 ,  Y10T428/12806 ,  Y10T428/12903 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/265 ,  Y10T428/30

摘要： An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300° C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick.

摘要翻译： 本发明的目的是提供一种具有载体片的铜箔，即使在印刷线路板的制造中也应用了在超过300℃的温度下进行热压时，能够从铜箔层剥离载体片。 为了实现该目的，通过接合界面层在载体片的表面上具有具有铜箔层的物理上可释放的载体片的铜箔，其特征在于，所述接合界面层由金属层和碳层 。 接合界面层优选由1nm〜50nm厚的金属层和1nm〜20nm厚的碳层构成。

公开(公告)号：US20080280159A1

公开(公告)日：2008-11-13

申请号：US11547517

申请日：2005-03-31

申请人： Kenichiro Iwakiri ,  Seiji Nagatani

发明人： Kenichiro Iwakiri ,  Seiji Nagatani

IPC分类号： B23P9/00 ,  C25F3/00

CPC分类号： C25D7/06 ,  H05K3/382 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12993

摘要： The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S)   (1) where Rz(S) is a numerical value represented by μm.

摘要翻译： 本发明的目的是为了提供铜箔的高粘合性，即使铜箔的结节面的粗糙度R z较低，也可以提供铜箔的制造方法。 为了实现该目的，采用铜箔，其特征在于，由三维表面积A（S）由A（S）/ B（S）定义的面积系数C（S），其中 通过在激光显微镜下对铜箔样品S的结节面的表面积进行三维测量，并且从作为三维测量区域的测量区域的面积的测量区域B（S）获得， 通过针式粗糙度计测量的铜箔样品S的结节表面的尺寸表面积A（S）和粗糙度R z（S）具有等式 （1），并且粗糙度R z（S）为1.0μm〜3.0μm，<？在线式描述=“In-line Formulas”end =“lead”？ > 0.5xR z（S）+0.5 <= C（S）（1）<？在线公式描述=“在线公式”end =“tail”？>其中R < （S）是由mum表示的数值。