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    Copper Foil and Method of Manufacturing the Same
    8.
    发明申请
    Copper Foil and Method of Manufacturing the Same 失效
    铜箔及其制造方法

    公开(公告)号：US20080280159A1

    公开(公告)日：2008-11-13

    申请号：US11547517

    申请日：2005-03-31

    申请人： Kenichiro Iwakiri ,  Seiji Nagatani

    发明人： Kenichiro Iwakiri ,  Seiji Nagatani

    IPC分类号： B23P9/00 ,  C25F3/00

    CPC分类号： C25D7/06 ,  H05K3/382 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12993

    摘要： The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S)   (1) where Rz(S) is a numerical value represented by μm.

    摘要翻译： 本发明的目的是为了提供铜箔的高粘合性，即使铜箔的结节面的粗糙度R z较低，也可以提供铜箔的制造方法。 为了实现该目的，采用铜箔，其特征在于，由三维表面积A（S）由A（S）/ B（S）定义的面积系数C（S），其中 通过在激光显微镜下对铜箔样品S的结节面的表面积进行三维测量，并且从作为三维测量区域的测量区域的面积的测量区域B（S）获得， 通过针式粗糙度计测量的铜箔样品S的结节表面的尺寸表面积A（S）和粗糙度R z（S）具有等式 （1），并且粗糙度R z（S）为1.0μm〜3.0μm，<？在线式描述=“In-line Formulas”end =“lead”？ > 0.5xR z（S）+0.5 <= C（S）（1）<？在线公式描述=“在线公式”end =“tail”？>其中R < （S）是由mum表示的数值。

    Copper foil and method of manufacturing the same
    10.
    发明授权
    Copper foil and method of manufacturing the same 失效
    铜箔及其制造方法

    公开(公告)号：US07749610B2

    公开(公告)日：2010-07-06

    申请号：US11547517

    申请日：2005-03-31

    申请人： Kenichiro Iwakiri ,  Seiji Nagatani

    发明人： Kenichiro Iwakiri ,  Seiji Nagatani

    IPC分类号： B32B15/20 ,  C25D7/06 ,  C25D3/38 ,  H05K1/09

    CPC分类号： C25D7/06 ,  H05K3/382 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12993

    摘要： The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S)  (1) where Rz(S) is a numerical value represented by μm.

    摘要翻译： 本发明的目的是提供铜箔的结节面的粗糙度Rz低的高粘合性的铜箔及其制造方法。 为了实现该目的，采用铜箔，其特征在于，由三维表面积A（S）由A（S）/ B（S）定义的面积系数C（S），其中 通过在激光显微镜下对铜箔样品S的结节面的表面积进行三维测量，并且从作为三维测量区域的测量区域的面积的测量区域B（S）获得， 通过触针式粗糙度计测量的铜箔样品S的结节面的尺寸表面积A（S）和粗糙度Rz（S）具有以下等式（1）的关系，并且因此 粗糙度Rz（S）为1.0μm〜3.0μm，0.5×Rz（S）+ 0.5＆amp; NlE; C（S）（1）其中，Rz（S）为由μm表示的数值。